Electromagnetic shield structure of high frequency circuit and high frequency module

Patent metadata

Field	Value
Publication number	US-10438862-B2
Application number	US-201515770848-A
Country	US
Kind code	B2
Filing date	Dec 24, 2015
Priority date	Dec 24, 2015
Publication date	Oct 8, 2019
Grant date	Oct 8, 2019

Abstract

A recess in a metal housing accommodating a high frequency package includes a first space and a second space and has a winners podium shape in cross-sectional view. A thermally conductive material is sandwiched between the metal housing having heat dissipating fins and the high frequency package.

First claim

The invention claimed is:

1. An electromagnetic shield structure of a high frequency circuit, the electromagnetic shield structure comprising:
a dielectric substrate provided with a grounding conductor and on which the high frequency circuit is mounted;
a metal housing in which a recess accommodating the high frequency circuit is formed, fixed to the dielectric substrate to be electrically connected to the grounding conductor; and
a thermally conductive material being electrically insulative,
wherein the metal housing comprises a heat dissipation structure,
the recess forms a first space and a second space, in which the first space is defined by a first bottom face which faces the high frequency circuit and a first side face which stands from the first bottom face, the second space is defined by a second bottom face which faces the high frequency circuit and is positioned in a shallower part in the recess than the first bottom face and a second side face which stands from the second bottom face, and the second space is formed to be protruded from the first space to an outer peripheral side,
the high frequency circuit is accommodated in the second space to be spaced from the metal housing, and the thermally conductive material is sandwiched between the first bottom face and the high frequency circuit, and (the high frequency circuit is in the second space)
the thermally conductive material is arranged to be spaced from the first side face and extends from below the first side face to the first bottom face.

2. A high frequency module comprising the electromagnetic shield structure and the high frequency circuit according to claim 1 .

3. An electromagnetic shield structure of a high frequency circuit, the electromagnetic shield structure comprising:
a dielectric substrate provided with a grounding conductor and on which the high frequency circuit is mounted;
a metal housing in which a recess accommodating the high frequency circuit is formed, fixed to the dielectric substrate to be electrically connected to the grounding conductor; and
a thermally conductive material being electrically insulative,
wherein the metal housing comprises a heat dissipation structure,
the recess forms a first space and a second space, in which the first space is defined by a first bottom face which faces the high frequency circuit and a first side face which stands from the first bottom face, the second space is defined by a second bottom face which faces the high frequency circuit and is positioned in a shallower part in the recess than the first bottom face and a second side face which stands from the second bottom face, and the second space is formed to be protruded from the first space to an outer peripheral side,
the high frequency circuit is accommodated in the second space to be spaced from the metal housing, and the thermally conductive material is sandwiched between the first bottom face and the high frequency circuit; and
the thermally conductive material has a recess being formed on either the first bottom face or a face that faces the high frequency circuit, or has a through-hole extending from a face that faces the first bottom face to a face that faces the high frequency circuit and the thermally conductive material extends from below the first side face to the first bottom face.

4. A high frequency module comprising the electromagnetic shield structure and the high frequency circuit according to claim 3 .

5. An electromagnetic shield structure of a high frequency circuit, the electromagnetic shield structure comprising:
a dielectric substrate provided with a grounding conductor and on which the high frequency circuit is mounted;
a metal housing in which a recess accommodating the high frequency circuit is formed, fixed to the dielectric substrate to be electrically connected to the grounding conductor; and
a thermally conductive material being electrically insulative,
wherein the metal housing comprises a heat dissipation structure,
the recess forms a first space and a second space, in which the first space is defined by a first bottom face which faces the high frequency circuit and a first side face which stands from the first bottom face, the second space is defined by a second bottom face which faces the high frequency circuit and is positioned in a shallower part in the recess than the first bottom face and a second side face which stands from the second bottom face; and the second space is formed to be protruded from the first space to an outer peripheral side,
the recess further forms a third space formed on a part of the first bottom face being recessed, and defined by a third bottom face and a bird de face standing from the third bottom face,
the high frequency circuit is accommodated in the second space to be spaced from the metal housing, and the thermally conductive material is sandwiched between the first bottom face and the high frequency circuit, and
the thermally conductive material is arranged to be spaced from the third bottom face and extends from below the first side face to the third bottom face.

6. A high frequency module comprising the electromagnetic shield structure and the high frequency circuit according to claim 5 .

7. An electromagnetic shield structure of a high frequency circuit, the electromagnetic shield structure comprising:
a dielectric substrate provided with a grounding conductor and on which the high frequency circuit is mounted;
a metal housing in which a recess accommodating the high frequency circuit is formed, fixed to the dielectric substrate to be electrically connected to the grounding conductor; and
a thermally conductive material being electrically insulative,
wherein the metal housing comprises a heat dissipation structure,
the recess forms a first space and a second space, in which the first space is defined by a first bottom face which faces the high frequency circuit and a first side face which stands from the first bottom face, the second space is defined by a second bottom face which faces the high frequency circuit and is positioned in a shallower part in the recess than the first bottom face and a second side face which stands from the second bottom face, and the second space is formed to be protruded from the first space to an outer peripheral side,
the high frequency circuit is accommodated in the second space to be spaced from the metal housing, and the thermally conductive material is sandwiched between the first bottom face and the high frequency circuit, and
the thermally conductive material is sandwiched between the second bottom face and the high frequency circuit and spaced from the first bottom face.

8. A high frequency module comprising the electromagnetic shield structure and the high frequency circuit according the claim 7 .

Assignees

• Mitsubishi Electric Corp

Inventors

• Morimoto Yasuo
• Yoshioka Hideharu
• Hirota Akimichi
• Yoneda Naofumi
• Ishibashi Takuma

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/877

  Bump connectors and die-attach connectors · CPC title

• H10W44/216

  Waveguides, e.g. strip lines · CPC title

• H10W40/228

  the projecting parts being wire-shaped or pin-shaped · CPC title

• H10W76/10

  Containers or parts thereof · CPC title