Shielding technique for semiconductor package including metal lid

Patent metadata

Field	Value
Publication number	US-9362209-B1
Application number	US-201213356349-A
Country	US
Kind code	B1
Filing date	Jan 23, 2012
Priority date	Jan 23, 2012
Publication date	Jun 7, 2016
Grant date	Jun 7, 2016

Abstract

In accordance with the present invention, there is provided a semiconductor package wherein a metal lid of the package is used as a shield that effectively surrounds the active circuitry, and thus forms a type of Faraday shield. The lid is electrically coupled to an internal die mounting pad of either a leadframe or an alternative type of substrate. Appropriate interconnect methods between the lid, the die pad, and the ground connections exterior to the semiconductor package include, but are not restricted to, conductive adhesives, wire bonding, bumps, tabs, or similar techniques.

First claim

What is claimed is:

1. A semiconductor package comprising:
a leadframe including a die pad having at least one tie bar connected thereto and extending therefrom and a plurality of leads extending at least partially about the die pad in spaced relation thereto, each lead having a lead top surface and a lead bottom surface;
a semiconductor die having a first surface and a second surface opposed to the first surface, the second surface attached to the die pad and electrically connected to at least some of the leads;
a package body covering at least portions of the die pad, the tie bar and the leads where at least some leads each have both the lead top surface at least partially exposed in a top surface of the package body and the lead bottom surface at least partially exposed in a bottom surface of the package body, the package body including at least one via which is formed therein and terminates on the tie bar, the via being laterally surrounded by the package body, wherein:
the top surface of the package body includes at least first and second sections, the first section being recessed relative to the second section;
the via is formed in the second section of the top surface;
the package body is formed such that the die pad, the tie bar and at least some of the leads each include a portion that is exposed in the first section of the top surface; and
the top surface of the package body is positioned below the first surface of the semiconductor die;

a conductive material within the via and contacting the tie bar; and
a lid attached to the conductive material adjacent to the second section of the top surface of the package body to facilitate the electrical connection of the lid to the tie bar, wherein the tie bar comprises:
a generally planar top surface adjacent the top surface of the package body, and
a generally planar bottom surface disposed in opposed relation to the top surface and covered by the package body.

2. The semiconductor package of claim 1 wherein the semiconductor die is further electrically connected to the die pad, and wherein the package body does not cover the semiconductor die.

3. The semiconductor package of claim 2 wherein the semiconductor die is electrically connected to the die pad and at least some of the leads by conductive wires which are covered by the lid.

4. The semiconductor package of claim 1 wherein the via has a generally circular configuration, and wherein the semiconductor die is electrically connected to the die pad by a conductive wire attached to a terminal on the first surface of the semiconductor die and attached to the die pad so that the terminal, the die pad, the tie bar and the lid are configured to be in electrical communication.

5. The semiconductor package of claim 1 , wherein those leads which include a portion exposed in the first section of the top surface of the package body each comprise:
a generally planar top surface which is partially exposed in the first section of the top surface of the package body;
a generally planar bottom surface which is disposed in opposed relation to the top surface and exposed in the bottom surface of the package body; and
a shelf which is disposed in opposed relation to the top surface and recessed relative to the bottom surface, the shelf being covered by the package body.

6. The semiconductor package of claim 5 wherein the die pad comprises:
a generally planar top surface which is exposed in the first section of the top surface of the package body;
a generally planar bottom surface which is disposed in opposed relation to the top surface and exposed in the bottom surface of the package body; and
a shelf which is disposed in opposed relation to the top surface and recessed relative to the bottom surface, the shelf being covered by the package body.

7. The semiconductor package of claim 1 , wherein the top surface of the tie bar is partially exposed in the top surface of the package body.

8. The semiconductor package of claim 1 wherein:
the package body is formed to include the at least one via which extends to the tie bar and is laterally surrounded by the package body, and at least one via which extends to a corresponding one of the leads and is laterally surrounded by the package body; and
the vias are filled with the conductive material to facilitate the electrical connection of the lid to the tie bar and to at least one of the leads.

9. A semiconductor package comprising:
a leadframe within a package body, the leadframe comprising a die pad and a plurality of leads extending at least partially about the die pad, each lead having a first surface and an opposing second surface;
a semiconductor die having a first major surface and a second major surface opposed to the first major surface, the second major surface attached to the die pad and electrically connected to at least some of the leads;
the package body covering at least portions of the leads where at least some leads each have both the first surface at least partially exposed in a top surface of the package body and the second surface at least partially exposed in bottom surface of the package body, the package body including at least one via which is formed therein and extends to a corresponding one of the leads, the via laterally surrounded by the package body;
a conductive material within the via and contacting the corresponding one of the leads; and
a lid attached to the conductive material to facilitate electrical connection of the lid to the corresponding one of the leads, wherein:
the package body includes a bottom surface, and a top surface having at least first and second sections, the first section being recessed relative to the second section;
the via is in the second section of the top surface;
the lid is attached to the second section of the top surface; and
the die pad and at least some of the leads each include a portion exposed in the first section of the top surface.

10. The semiconductor package of claim 9 wherein the semiconductor die is further electrically connected to the die pad by a conductive wire attached to a terminal on the first surface of the semiconductor die and the die pad.

11. The semiconductor package of claim 10 wherein the semiconductor die is electrically connected to the die pad and at least some of the leads by conductive wires which are covered by the lid, and wherein the first portion of the package body isolates at least some of the leads from the lid.

12. The semiconductor package of claim 9 wherein the via has a generally circular configuration.

13. The semiconductor package of claim 9 , wherein those leads which include a portion exposed in the first section of the top surface of the package body each comprise:
a generally planar top surface which is partially exposed in the first section of the top surface of the package body;
a generally planar bottom surface which is disposed in opposed relation to the top surface and exposed in the bottom surface of the package body; and
a shelf which is disposed in opposed relation to the top surface and recessed relative to the bottom surface, the shelf being covered by the package body.

14. The semiconductor package of claim 13 wherein the die pad comprises:
a generally planar top surface which is exposed in the first section of the top surface of the package body;
a generally planar bottom surface which is disposed in opposed relation to the top surface and exposed in the bottom surface of the package body; and
a shelf which is disposed in opposed relation to the top surface and recessed relative to the bottom surface, the shelf being covered by the package

Assignees

• Mangrum Marc Alan
• Amkor Technology Inc

Inventors

• Mangrum Marc Alan

Classifications

• H10W70/63

  Vias, e.g. via plugs · CPC title

• H10W76/63

  characterised by their shape or disposition, e.g. between cap and walls of a container · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/5363

  the connected ends being wedge-shaped · CPC title