Method of inspecting surface having a minute pattern based on detecting light reflected from metal layer on the surface

Patent metadata

Field	Value
Publication number	US-10431505-B2
Application number	US-201715429525-A
Country	US
Kind code	B2
Filing date	Feb 10, 2017
Priority date	Jun 7, 2016
Publication date	Oct 1, 2019
Grant date	Oct 1, 2019

Abstract

Manufacturing a device may include inspecting a surface of an inspection target device. The inspecting may include forming a metal layer on a surface of the inspection target device on which a minute pattern is formed, directing a beam of light to be incident and normal to the surface of the inspection target device, determining a spectrum of light reflected from the surface of the inspection target device, and generating, via the spectrum, information associated with a structural characteristic of the minute pattern formed on the inspection target device. The inspection target device may be selectively incorporated into the manufactured device based on the generated information.

First claim

What is claimed is:

1. A method, comprising:
forming a metal layer on a surface of an inspection target device, the inspection target device including a pattern, such that the metal layer is formed on the pattern and an outer surface of the metal layer is distal to the surface of the inspection target device;
emitting light incident on the outer surface of the metal layer, and adjusting the emitted light to be incident to the outer surface of the metal layer and normal to the outer surface of the metal layer;
detecting a spectrum of the light reflected from the outer surface of the metal layer; and
generating, based on the detected spectrum, information associated with a structural characteristic of the pattern formed on the surface of the inspection target device,
wherein the pattern includes a plurality of patterns, the patterns being spaced apart according to a particular period,
wherein the generating includes measuring a width of at least one pattern of the plurality of patterns and a distance between adjacent patterns, based on a material of the metal layer.

2. The method of claim 1 , wherein the generating includes,
comparing the detected spectrum with a theoretical spectrum of a theoretical model, the theoretical model having a pattern having a substantially common shape in relation to the pattern formed on the inspection target device; and
determining whether a characteristic of the theoretical spectrum corresponds to a characteristic of the detected spectrum, based on the comparing.

3. The method of claim 1 , wherein the generating includes determining a similarity between adjacent patterns.

4. The method of claim 1 , wherein the metal layer has a thickness that is less than half of a distance between adjacent patterns.

5. The method of claim 1 , wherein the generating includes calculating an error associated with the metal layer.

6. The method of claim 5 , wherein the calculating the error includes calculating the error based on,
the width of the at least one pattern,
a height of the at least one pattern,
the distance between adjacent patterns, and
a material of the metal layer.

7. The method of claim 1 , wherein the metal layer includes at least one of Au, Ag, Cu, and Al.

8. A method, comprising:
detecting light reflected from a metal layer on a surface of an inspection target device, the inspection target device including at least one pattern, the reflected light being a reflected beam of light incident on the surface of the metal layer;
determining a spectrum of the light reflected from the surface of the metal layer on the inspection target device;
generating, based on the determined spectrum, information associated with a structural characteristic of the at least one pattern formed on the surface of the inspection target device; and
forming a semiconductor device, using the inspection target device, based on the information associated with the structural characteristic of the pattern,
the forming the semiconductor device including
forming one or more lavers on a substrate, and
removing at least portions of the one or more layers to form a structure,

wherein the at least one pattern includes a plurality of patterns, the plurality of patterns being spaced apart according to a particular period,
wherein the generating includes measuring a width of at least one pattern of the plurality of patterns and a distance between adjacent patterns, based on, a material of the metal laver.

9. The method of claim 8 , further comprising:
removing the metal layer from the inspection target device based on the information associated with the structural characteristic of the pattern, prior to forming the semiconductor device using the inspection target device.

10. The method of claim 8 , wherein,
the generating includes,
comparing the determined spectrum with a theoretical spectrum of a theoretical model, the theoretical model having a pattern having a substantially common shape in relation to the pattern formed on the inspection target device, and
determining whether a characteristic of the theoretical spectrum corresponds to a characteristic of the determined spectrum, based on the comparing, and

the forming includes,
selectively incorporating the inspection target device into the semiconductor device based on the determining of whether the characteristic of the theoretical spectrum corresponds to the characteristic of the determined spectrum.

11. The method of claim 8 , wherein the metal layer is on a limited portion of the surface of the inspection target device.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Park Jun-Bum
• Kang Kyung-Sik
• Jeon Byeong-Hwan
• Joo Jae-Chol
• Kim Tae-Joong

Classifications

• H10P74/235

  comprising optical enhancement of defects or not-directly-visible states · CPC title

• H10P14/412

  Deposition of metallic or metal-silicide materials · CPC title

• H10P74/203 Primary

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• G01N21/95607

  using a comparative method · CPC title

• G01N21/553

  and using surface plasmons (fluorescence excitation G01N21/648; enhanced Raman G01N21/658) · CPC title