Thermal interface material with ion scavenger

Patent metadata

Field	Value
Publication number	US-10428257-B2
Application number	US-201816163255-A
Country	US
Kind code	B2
Filing date	Oct 17, 2018
Priority date	Jul 7, 2014
Publication date	Oct 1, 2019
Grant date	Oct 1, 2019

Abstract

A thermal interface material includes at least one polymer, at least one thermally conductive filler; and at least one ion scavenger. In some embodiments, the ion scavenger is a complexing agent selected from the group consisting of: nitrogen containing complexing agents, phosphorus containing complexing agents, and hydroxyl carboxylic acid based complexing agents.

First claim

The invention claimed is:

1. An electronic component comprising:
a heat sink having a copper surface;
an electronic chip;
a thermal interface material positioned between the heat sink and electronic chip and including a first surface in direct contact with the copper surface of the heat sink, the thermal interface material including:
at least one elastomeric polymer;
at least one thermally conductive filler present in a total amount between 75 wt. % and 95 wt. %, based on a total weight of the thermal interface material; and
at least one ion scavenger.

2. The electronic component of claim 1 , wherein the ion scavenger comprises 2′,3-bis[[3-[3,5-di-tert-butyl-4-hydroxyphenyl]propionic]]propionyl hydrazide in an amount between 0.1 wt. % and 5 wt. %, based on a total weight of the thermal interface material.

3. The electronic component of claim 2 , wherein the ion scavenger comprises 2′,3-bis[[3-[3,5-di-tert-butyl-4-hydroxyphenyl]propionic]]propionyl hydrazide in an amount between 0.1 wt. % and 2 wt. %, based on a total weight of the thermal interface material.

4. The electronic component of claim 1 , wherein the ion scavenger comprises decamethylenedicarboxylic acid disalicyloylhydrazide in an amount between 0.1 wt. % and 5 wt. %, based on a total weight of the thermal interface material.

5. The electronic component of claim 4 , wherein the ion scavenger comprises decamethylenedicarboxylic acid disalicyloylhydrazide in an amount between 0.1 wt. % and 2 wt. %, based on a total weight of the thermal interface material.

6. The electronic component of claim 1 , wherein the at least one thermally conductive filler is present in a total amount between 85 wt. % and 95 wt. %, based on a total weight of the thermal interface material.

7. The electronic component of claim 1 , wherein the elastomeric polymer is present in an amount between 2 wt. % and 10 wt. %, based on a total weight of the thermal interface material.

8. The electronic component of claim 1 , further comprising a phase change material in the form of a wax, the wax present in an amount between 0.5 wt. % and 3 wt. %, based on a total weight of the thermal interface material.

9. The electronic component of claim 1 , further comprising a coupling agent present in an amount between 0.1 wt. % and 1.5 wt. %, based on a total weight of the thermal interface material.

10. The electronic component of claim 1 , wherein the thermal interface material includes a second surface in direct contact with the electronic chip.

11. An electronic component comprising:
a heat sink having a nickel surface;
an electronic chip;
a thermal interface material positioned between the heat sink and electronic chip and including a first surface in direct contact with the nickel surface of the heat sink, the thermal interface material including:
at least one elastomeric polymer;
at least one thermally conductive filler present in a total amount between 75 wt. % and 95 wt. %, based on a total weight of the thermal interface material; and
at least one ion scavenger.

12. The electronic component of claim 11 , wherein the ion scavenger comprises 2′,3-bis[[3-[3,5-di-tert-butyl-4-hydroxyphenyl]propionic]]propionyl hydrazide in an amount between 0.1 wt. % and 5 wt. %, based on a total weight of the thermal interface material.

13. The electronic component of claim 12 , wherein the ion scavenger comprises 2′,3-bis[[3-[3,5-di-tert-butyl-4-hydroxyphenyl]propionic]]propionyl hydrazide in an amount between 0.1 wt. % and 2 wt. %, based on a total weight of the thermal interface material.

14. The electronic component of claim 11 , wherein the ion scavenger comprises decamethylenedicarboxylic acid disalicyloylhydrazide in an amount between 0.1 wt. % and 5 wt. %, based on a total weight of the thermal interface material.

15. The electronic component of claim 14 , wherein the ion scavenger comprises decamethylenedicarboxylic acid disalicyloylhydrazide in an amount between 0.1 wt. % and 2 wt. %, based on a total weight of the thermal interface material.

16. The electronic component of claim 11 , wherein the at least one thermally conductive filler is present in a total amount between 85 wt. % and 95 wt. %, based on a total weight of the thermal interface material.

17. The electronic component of claim 11 , wherein the elastomeric polymer is present in an amount between 2 wt. % and 10 wt. %, based on a total weight of the thermal interface material.

18. The electronic component of claim 11 , further comprising a phase change material in the form of a wax, the wax present in an amount between 0.5 wt. % and 3 wt. %, based on a total weight of the thermal interface material.

19. The electronic component of claim 11 , further comprising a coupling agent present in an amount between 0.1 wt. % and 1.5 wt. %, based on a total weight of the thermal interface material.

20. The electronic component of claim 11 , wherein the thermal interface material includes a second surface in direct contact with the electronic chip.

Assignees

• Honeywell Int Inc

Inventors

• Liu Ya Qun
• Zeng Liang
• Wang Hui
• Zhang Bright
• Huang Hong Min

Classifications

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W72/354

  comprising polymers · CPC title

• H10W72/353

  not comprising solid metals or solid metalloids, e.g. ceramics · CPC title

• H10W72/352

  comprising metals or metalloids, e.g. solders · CPC title

• H10W72/325

  Die-attach connectors having a filler embedded in a matrix · CPC title