Photosensitive resin composition, film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, and semiconductor device

Patent metadata

Field	Value
Publication number	US-2016160102-A1
Application number	US-201314904145-A
Country	US
Kind code	A1
Filing date	Jul 16, 2013
Priority date	Jul 16, 2013
Publication date	Jun 9, 2016
Grant date	—

Abstract

The present invention provides a photosensitive resin composition comprising an alkali-soluble resin having a phenolic hydroxyl group as an end group (A); a radiation-polymerizable compound (B); and a photoinitiator (C), a film adhesive, an adhesive sheet, an adhesive pattern, a semiconductor wafer with an adhesive layer, and a semiconductor device using the photosensitive resin composition.

First claim

1 . A photosensitive resin composition comprising:
an alkali-soluble resin having a phenolic hydroxyl group as an end group (A); a radiation-polymerizable compound (B); and a photoinitiator (C).

2 . The photosensitive resin composition according to claim 1 , wherein a glass transition temperature of the alkali-soluble resin is 40 to 150° C.

3 . The photosensitive resin composition according to claim 1 , wherein the alkali-soluble resin is a polyimide resin having phenolic hydroxyl groups as an end group and a side chain group.

4 . The photosensitive resin composition according to claim 1 , wherein the alkali-soluble resin is a polyimide resin obtainable by reacting
a tetracarboxylic dianhydride, a diamine comprising 10 to 80 mol % of a diamine with a phenolic hydroxyl group based on the total diamine, and an amine with a phenolic hydroxyl group.

5 . The photosensitive resin composition according to claim 4 , wherein the diamine comprises 10 to 80 mol % of an aliphatic etherdiamine represented by the following formula (8) based on the total diamine:
H 2 N—R 1 O—R 2  b O—R 3 —NH 2   (8)
wherein R 1 to R 3 each independently represent a C1-10 alkylene group; and b represents an integer of 2 to 80.

6 . The photosensitive resin composition according to claim 4 , wherein the diamine with a phenolic hydroxyl group comprises a diamine with a phenolic hydroxyl group represented by the following formula (A-1):

wherein R 21 represents a single bond or a divalent organic group.

7 . The photosensitive resin composition according to claim 1 , wherein the alkali-soluble resin is a polyimide resin having only a phenolic hydroxyl group as an alkali-soluble group.

8 . The photosensitive resin composition according to claim 1 , wherein the radiation-polymerizable compound comprises at least one (meth)acrylate having functionality of three or more.

9 . The photosensitive resin composition according to claim 1 , further comprising an epoxy resin (D).

10 . The photosensitive resin composition according to claim 9 , wherein the epoxy resin comprises at least one of a bisphenol F-type epoxy resin and a bisphenol A-type epoxy resin.

11 . The photosensitive resin composition according to claim 1 , further comprising a compound having an ethylenic unsaturated group and an epoxy group (E).

12 . The photosensitive resin composition according to claim 1 , further comprising a filler (F).

13 . The photosensitive resin composition according to claim 1 , further comprising a curing accelerator (G).

14 . The photosensitive resin composition according to claim 1 for an adhesive to be used for connecting semiconductor chips, and/or connecting a semiconductor chip and a supporting member for mounting a semiconductor chip.

15 . A film adhesive obtainable by forming the photosensitive resin composition according to claim 1 into a film shape.

16 . An adhesive sheet comprising a base, and an adhesive layer composed of the film adhesive according to claim 15 formed on the base.

17 . An adhesive pattern obtainable by exposing an adhesive layer to light, the adhesive layer composed of the film adhesive according to claim 15 laminated on an adherend, and developing the exposed adhesive layer with an alkali developing solution.

18 . A semiconductor wafer with an adhesive layer, comprising:
a semiconductor wafer, and an adhesive layer composed of the film adhesive according to claim 15 and laminated on the semiconductor wafer.

19 . A semiconductor device having a structure in which semiconductor chips are bonded using the photosensitive resin composition according to claim 1 and/or a structure in which a semiconductor chip and a supporting member for mounting a semiconductor chip are bonded using the photosensitive resin composition according to claim 1 .

Assignees

• Hitachi Chemical Co Ltd

Inventors

• Minegishi Tomonori
• Mitsukura Kazuyuki

Classifications

• H10W72/0198

  batch processes · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W99/00

  Subject matter not provided for in other groups of this subclass · CPC title

• H10W72/07338

  hardening the adhesive by curing, e.g. thermosetting · CPC title

• H10W72/07332

  Compression bonding, e.g. thermocompression bonding · CPC title