Thermal interface materials including thermally reversible gels

Patent metadata

Field	Value
Publication number	US-9260645-B2
Application number	US-71053810-A
Country	US
Kind code	B2
Filing date	Feb 23, 2010
Priority date	Feb 23, 2010
Publication date	Feb 16, 2016
Grant date	Feb 16, 2016

Abstract

Thermal interface materials are disclosed that include or are based on thermally reversible gels, such as thermally reversible gelled fluids, oil gels and solvent gel resins. In an exemplary embodiment, a thermal interface material includes at least one thermally conductive filler in a thermally reversible gel.

First claim

What is claimed is:

1. A thermal interface material comprising at least one thermally conductive filler in a thermally reversible gel, the thermally reversible gel comprising di-block styrenic copolymer whereby the thermal interface material comprises a gap pad that is soft at room temperature and that is operable for allowing heat generated by an operating electrical component to pass through the gap pad, wherein:
the thermal interface material has a hardness of about 48 Shore 00, the thermally reversible gel comprises di-block and tri-block styrenic copolymers and paraffinic oil, the paraffinic oil is about 14.1 percent of the gap pad by weight, the di-block styrenic copolymer is about 4.2 percent of the gap pad by weight, the tri-block styrenic copolymer is about 1.1 percent of the gap pad by weight, and the at least one thermally conductive filler is about 80.2 percent of the gap pad by weight; or
the thermal interface material has a hardness of about 75 Shore 00, the thermally reversible gel comprises di-block styrenic copolymer, a tri-block and di-block styrenic copolymer blend and paraffinic oil, the paraffinic oil is about 13.5 percent of the gap pad by weight, the di-block styrenic copolymer is about 11.7 percent of the gap pad by weight, the di-block and tri-block styrenic copolymer blend is about 3.4 percent of the gap pad by weight, and the at least one thermally conductive filler is about 81 percent of the gap pad by weight; or
the thermal interface material has a hardness of about 80 Shore 00, the thermally reversible gel comprises a di-block styrenic copolymer, a tri-block styrenic copolymer, and paraffinic oil, the paraffinic oil is about 43.2 percent of the gap pad by weight, the di-block styrenic copolymer is about 2.9 percent of the gap pad by weight, the tri-block styrenic copolymer is about 6.7 percent of the gap pad by weight, and the at least one thermally conductive filler is about 46.1 percent of the gap pad by weight; or
the thermal interface material has a hardness of about 88 Shore 00, the thermally reversible gel comprises a di-block styrenic copolymer, a tri-block styrenic copolymer, and paraffinic oil, the paraffinic oil is about 42.4 percent of the gap pad by weight, the di-block styrenic copolymer is about 2.8 percent of the gap pad by weight, the tri-block styrenic copolymer is about 6.6 percent of the gap pad by weight, and the at least one thermally conductive filler is about 47.1 percent of the gap pad by weight; or
the thermal interface material has a hardness of about 28 Shore 00, the thermally reversible gel comprises di-block styrenic copolymer, a tri-block and di-block styrenic copolymer blend and paraffinic oil, the paraffinic oil is about 42.5 percent of the gap pad by weight, the di-block styrenic copolymer is about 5.3 percent of the gap pad by weight, the di-block and tri-block styrenic copolymer blend is about 10.6 percent of the gap pad by weight, and the at least one thermally conductive filler is about 40.3 percent of the gap pad by weight.

2. The thermal interface material of claim 1 , wherein the thermally reversible gel is an oil gel, and wherein the thermal interface material is formulated to soften at a temperature of about 150 degrees Celsius.

3. The thermal interface material of claim 1 , wherein the at least one thermally conductive filler comprises one or more of boron nitride, alumina, aluminum, graphite, copper, and combinations thereof.

4. The thermal interface material of claim 1 , wherein the thermal interface material is formulated to soften at a temperature of about 150 degrees Celsius.

5. The thermal interface material of claim 1 , wherein the thermal interface material is free of silicone, and wherein the gap pad is compliant and operable for filling a gap between thermal transfer surfaces to thereby allow heat generated by an operating electrical component to pass from one of the thermal transfer surfaces through the gap pad to the other one of the thermal transfer surfaces.

6. The thermal interface material of claim 1 , wherein the thermally reversible gel comprises gelled fluid.

7. The thermal interface material of claim 1 , wherein the thermal interface material is configured to be operable for providing at least some electromagnetic interference (EMI) shielding.

8. The thermal interface material of claim 1 , wherein:
the thermal interface material has a thermal conductivity within a range from 0.3 Watts per meter-Kelvin (W/mK) to 3.37 W/mK; and
the thermal interface material is free of silicone.

9. An EMI shielding assembly including the thermal interface material of claim 1 .

10. A method relating to heat dissipation from one or more heat generating components, the method comprising positioning the thermal interface material of claim 1 relative to the one or more heat generating components, such that a thermally-conductive heat path is defined from the one or more heat generating components to the thermal interface material.

Assignees

• Bruzda Karen J
• Laird Technologies Inc

Inventors

• Bruzda Karen J

Classifications

• H10W40/735

  by melting or evaporation of solids · CPC title

• H10W40/70

  Fillings or auxiliary members in containers or in encapsulations for thermal protection or control · CPC title

• C09K5/14 Primary

  Solid materials, e.g. powdery or granular · CPC title

• H01L2924/00

  Electricity · mapped topic

• H01L23/42

  Electricity · mapped topic