Vacuum processing device

Patent metadata

Field	Value
Publication number	US-10425990-B2
Application number	US-201514931655-A
Country	US
Kind code	B2
Filing date	Nov 3, 2015
Priority date	Jun 11, 2013
Publication date	Sep 24, 2019
Grant date	Sep 24, 2019

Abstract

A vacuum processing apparatus according to this invention includes a heating unit arranged to face a processing surface of a substrate supported by a substrate support unit in a vacuum chamber, a cooling unit arranged to face a reverse surface of the substrate supported by the substrate support unit, a temperature correction unit configured to correct a temperature of a periphery of the substrate in order to reduce a temperature difference between a central portion and the periphery of the substrate by being arranged in a predetermined position between the substrate and the cooling unit when the heating unit heats the substrate, and a correction unit moving device configured to retract the temperature correction unit from the predetermined position.

First claim

The invention claimed is:

1. A vacuum processing device comprising:
a vacuum chamber;
a substrate support configured to support a substrate in said vacuum chamber;
a heater arranged to face a processing surface of the substrate supported by said substrate support;
a cooler arranged to face a reverse surface of the substrate supported by said substrate support;
a temperature correction unit configured to correct a temperature of a periphery of the substrate in order to reduce a temperature difference between a central portion and the periphery of the substrate by being arranged in a predetermined position between the substrate supported by said substrate support and said cooler when said heater heats the substrate; and
a correction unit moving unit configured to move said temperature correction unit between the predetermined position and a retraction position retracted from the predetermined position,
wherein said substrate support can is configured to move the substrate to a heating position where said heater heats the substrate, and a cooling position where said cooler cools the substrate,
wherein said substrate support includes:
a first support configured to support the substrate in the heating, position; and
a second support configured to receive the substrate supported by said first support in the heating position, and move the substrate to the cooling position,
wherein said correction unit moving unit is configured to have retracted said temperature correction unit to the retraction position in a timing where said second support receives the substrate from the first support in the heating position.

2. The vacuum processing device according to claim 1 , wherein
said vacuum chamber is airtightly connected to a transfer chamber including a transfer device configured to transfer the substrate into said vacuum chamber, and
said first support exchanges the substrate with said transfer device.

3. The vacuum processing device according to claim 1 , wherein said temperature correction unit is formed into a ring-like shape, having a diameter larger than that of the substrate.

4. The vacuum processing device according to claim 1 , wherein
said temperature correction unit includes a plurality of segments, and
said correction unit moving unit is configured to the plurality of segments in different directions.

5. The vacuum processing device according to claim 4 , wherein said temperature correction unit has a notch such that said temperature correction unit does not come in contact with said substrate support.

6. The vacuum processing device according to claim 1 , wherein when cooling the substrate, said cooler moves to a position where said cooler is in contact with the reverse surface of the substrate supported by said substrate support, and, when heating the substrate, said cooler moves away from the substrate and moves down.

7. The vacuum processing device according to claim 1 , wherein said temperature correction unit comprises a beat storage member configured to store heat radiated from said heater.

8. The vacuum processing device according to claim 1 , wherein said temperature correction unit comprises:
a heat storage member configured to store heat radiated from said heater; and
a heat blocking plate formed between said heat storage member and said cooler, and configured to block heat radiated from said heater.

9. The vacuum processing device according to claim 1 , wherein said temperature correction unit comprises a heater configured to heat the periphery of the substrate.

10. A vacuum processing device comprising:
a vacuum chamber:
a substrate support configured to support a substrate in said vacuum chamber;
a heater arranged to face a processing surface of the substrate supported by said substrate support;
a cooler arranged to face a reverse surface of the substrate supported by said substrate support;
a temperature correction unit configured to correct a temperature of a periphery of the substrate in order to reduce a temperature difference between a central portion and the periphery of the substrate by being arranged in a predetermined position between the substrate supported by said substrate support and said cooler when said heater heats the substrate; and
a correction unit moving unit configured to move said temperature correction unit between the predetermined position and a retraction position retracted from the predetermined position,
wherein said substrate support is configured to move the substrate to a heating position where said heater heats the substrate, and a cooling position where said cooler cools the substrate,
wherein said substrate support includes;
a first support configured to support the substrate in the heating position; and
a second support configured to receive the substrate supported by said first support in the heating position, and move the substrate to the cooling position,
wherein the retraction position is located in a horizontal direction to the predetermined position.

Assignees

• Canon Anelva Corp

Inventors

• Yasukawa Hidehiro
• Sugihara Masahiro

Classifications

• H10P72/7602

  the wafers being placed on a robot blade or gripped by a gripper for conveyance · CPC title

• H10P72/0462

  characterised by the construction of the processing chambers, e.g. modular processing chambers · CPC title

• H10P72/0436

  mainly by radiation · CPC title

• H10P72/0434 Primary

  mainly by convection · CPC title

• C23C14/541

  Heating or cooling of the substrates · CPC title