Optical systems fabricated by printing-based assembly

Patent metadata

Field	Value
Publication number	US-10424572-B2
Application number	US-201715402684-A
Country	US
Kind code	B2
Filing date	Jan 10, 2017
Priority date	Jan 17, 2007
Publication date	Sep 24, 2019
Grant date	Sep 24, 2019

Abstract

Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities. Optical systems of the present invention include devices and device arrays exhibiting a range of useful physical and mechanical properties including flexibility, shapeability, conformability and stretchablity.

First claim

We claim:

1. A lighting system, comprising:
a substrate having a receiving surface with a planarizing layer;
two or more electrodes disposed on the receiving surface;
a plurality of inorganic crystalline semiconductor light-emitting elements printed on the receiving surface, wherein each light-emitting element is aligned with and electrically connected to at least two of the two or more electrodes, and wherein the light emitting elements have at least a length or width physical dimension less than 200 μm;
wherein the inorganic crystalline semiconductor light-emitting elements are only partially embedded in the planarizing layer.

2. The lighting system of claim 1 , wherein the substrate has a thickness equal to or less than 175 microns.

3. The lighting system of claim 1 , wherein the substrate is polyethylene terephthalate (PET).

4. The lighting system of claim 1 , wherein the substrate is a bottom substrate and the lighting system further comprises a top substrate adhered to one or more of: the bottom substrate, the two or more electrodes, or the light-emitting elements.

5. The lighting system of claim 4 , wherein the top substrate has a thickness equal to or less than 175 microns.

6. The lighting system of claim 4 , wherein the planarizing layer is disposed between the top and bottom substrates.

7. The lighting system of claim 6 , wherein the planarizing layer has a thickness less than or equal to 20 microns and greater than or equal to 2 microns.

8. The lighting system of claim 4 , wherein the top substrate is PET.

9. The lighting system of claim 1 , wherein the lighting system has a bending radius equal to or less than 7, 5, 4.5, 3, or 0.85 centimeters.

10. The lighting system of claim 1 , wherein the electrodes are multi-layer electrodes.

11. The lighting system of claim 1 , wherein the electrodes have a thickness less than or equal to 10000 μm and greater than or equal to 10 nm.

12. The lighting system of claim 1 , wherein the light-emitting elements are inorganic light-emitting diodes.

13. The lighting system of claim 1 , wherein the light-emitting elements are printable light emitting diodes or lasers.

14. A method of making a lighting system, comprising:
providing a substrate having a receiving surface with a planarization layer and two or more electrodes disposed on the receiving surface;
providing a plurality of printable inorganic crystalline semiconductor light-emitting elements on an inorganic semiconductor source wafer;
dry transfer contact printing the plurality of printable inorganic crystalline semiconductor light-emitting elements from the source wafer to the receiving surface of the substrate, wherein each light emitting element is aligned with the two or more electrodes and each light emitting element is only partially embedded in the planarizing layer; and
electrically connecting each printed light-emitting element to the two or more electrodes.

15. The method of claim 14 , wherein the substrate is a bottom substrate, the method further comprising the step of adhering a top substrate to one or more of: the bottom substrate, the electrodes, or the light-emitting elements.

16. The method of claim 15 , further comprising injecting the planarization layer between the top and bottom substrates.

17. The method of claim 16 , further comprising curing the planarization layer.

18. The method of claim 17 , further comprising curing the encapsulation layer under low pressure or vacuum conditions.

19. The lighting system of claim 1 , wherein the substrate is flexible, bendable, shapeable, conformable and/or stretchable.

20. The lighting system of claim 1 , wherein at least a portion of a bridge element connects to each of the crystalline semiconductor light-emitting elements.

21. A lighting system, comprising:
a substrate having a receiving surface with a planarizing layer;
two or more electrodes disposed on the receiving surface;
a plurality of inorganic crystalline semiconductor light-emitting elements printed on the receiving surface, wherein each light-emitting element is aligned with and electrically connected to at least two of the two or more electrodes, and wherein the light emitting elements have at least a length or width physical dimension less than 200 μm;
wherein the substrate is flexible, bendable, shapeable, conformable and/or stretchable.

22. A lighting system, comprising:
a substrate having a receiving surface with a planarizing layer;
two or more electrodes disposed on the receiving surface;
a plurality of inorganic crystalline semiconductor light-emitting elements printed on the receiving surface, wherein each light-emitting element is aligned with and electrically connected to at least two of the two or more electrodes, and wherein the light emitting elements have at least a length or width physical dimension less than 200 μm;
wherein at least a portion of a bridge element connects to each of the crystalline semiconductor light-emitting elements.

Assignees

• Univ Illinois
• Semprius Inc
• X Celeprint Ltd

Inventors

• Rogers John
• Nuzzo Ralph
• Meitl Matthew
• Menard Etienne
• Baca Alfred
• Motala Michael
• Ahn Jong-Hyun
• Park Sang-Il
• Yu Chang-Jae
• Ko Heung Cho
• Stoykovich Mark
• Yoon Jongseung

Classifications

• H10P95/00

  Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W72/00

  Interconnections or connectors in packages · CPC title

• H10W72/07307

  the auxiliary member being a temporary substrate, e.g. a removable substrate · CPC title

• H10W72/0711

  Apparatus therefor · CPC title