Package substrate and semiconductor package including the same
US-2024429153-A1 · Dec 26, 2024 · US
Optical systems fabricated by printing-based assembly
US9117940B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9117940-B2 |
| Application number | US-201414209481-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 13, 2014 |
| Priority date | Jan 17, 2007 |
| Publication date | Aug 25, 2015 |
| Grant date | Aug 25, 2015 |
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Abstract
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Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities. Optical systems of the present invention include devices and device arrays exhibiting a range of useful physical and mechanical properties including flexibility, shapeability, conformability and stretchablity.
First claim
Opening claim text (preview).
We claim: 1. A method of making an integrated optical device comprising the steps of: transfer printing a plurality of printable semiconductor elements to a device substrate; and addressing an optical component or an array of optical components with the plurality of printable semiconductor elements on the device substrate, wherein each of the plurality of printable semiconductor elements are optically addressed to the optical component or to a unique individual member of the arr…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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- What does patent US9117940B2 cover?
- Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices.…
- Who is the assignee on this patent?
- Univ Illinois, Semprius Inc
- What technology area does this patent fall under?
- Primary CPC classification H10W90/00. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Aug 25 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).