Processing method for sector-shaped wafer piece

Patent metadata

Field	Value
Publication number	US-10424512-B2
Application number	US-201815994661-A
Country	US
Kind code	B2
Filing date	May 31, 2018
Priority date	Jun 1, 2017
Publication date	Sep 24, 2019
Grant date	Sep 24, 2019

Abstract

A sector-shaped wafer piece is processed according to the shape of the piece obtained by dividing a wafer into quarters. Information is collected on the shapes of four patterns of the quarter wafer pieces different in the position of a circular arc of an outer periphery and on processing feed quantities corresponding to the shapes of the four patterns. A pattern is selected by calculating a region of a square having vertical and horizontal sides equal to the two sides of the quarter wafer piece, imaging each of the sides to search for the presence/absence of a target pattern, and selecting that one of the four patterns to which the held quarter wafer piece corresponds. The held quarter wafer piece is processed along division lines with a processing feed quantity corresponding to the selected pattern.

First claim

What is claimed is:

1. A processing method for a sector-shaped wafer piece, for processing a sector-shaped quarter wafer piece obtained by dividing into quarters a disk-shaped wafer which has a device formed in each of regions on its front surface partitioned by a plurality of crossing division lines and which has at its outer periphery a notch indicative of its crystal orientation, the processing being performed along the division lines, and the processing being performed with a processing feed quantity according to a shape of the quarter wafer piece, the processing method comprising:
an information collecting step of collecting information on shapes of four patterns of the quarter wafer pieces which are different in position of a circular arch of an outer periphery in the case where the quarter wafer pieces with the crystal orientation positioned in a predetermined direction are each held by a holding surface of a chuck table, and on processing feed quantities corresponding to the shapes of the four patterns;
a wafer unit forming step of adhering a back surface of the quarter wafer piece to a dicing tape having an outer peripheral portion attached to an annular frame, to form a wafer unit;
a holding step of suction holding the quarter wafer piece of the wafer unit by a chuck table of a processing apparatus through the dicing tape after the wafer unit forming step is conducted;
an alignment step of imaging the quarter wafer piece by an imaging unit of the processing apparatus, and aligning the division line extending in a first direction to a processing feed direction, based on target patterns formed in the devices after the holding step is conducted;
a pattern selection step of selecting that one of the four patterns to which the quarter wafer piece held by the chuck table corresponds after the alignment step is conducted; and
a processing step of processing the quarter wafer piece held by the chuck table along the division line with the processing feed quantity corresponding to the selected pattern after the pattern selection step is conducted.

2. The processing method for a sector-shaped wafer piece according to claim 1 ,
wherein the pattern selection step includes:
a target pattern detection step of calculating a region of a square having vertical and horizontal sides equal to two sides of the quarter wafer piece, searching for the target pattern in the device at a center of each of the four sides of the square by the imaging unit, and detecting the target patterns from the two sides of the quarter wafer piece; and
a selection step of selecting, based on the positions of the sides where the target pattern has been detected, that one of a first quadrant, a second quadrant, a third quadrant, and a fourth quadrant of the wafer in an XY rectangular coordinate system before quadrisection to which the quarter wafer piece corresponds.

3. The processing method for a sector-shaped wafer piece according to claim 1 , wherein in the processing step, the division lines are cut by a cutting blade of a cutting apparatus.

4. The processing method for a sector-shaped wafer piece according to claim 1 , wherein in the processing step, processing is conducted by applying a laser beam along the division lines.

5. The processing method for a sector-shaped wafer piece according to claim 1 , wherein in the pattern selection step, a square is calculated, where the square includes two orthogonal sides of the quarter wafer piece and two imaginary sides, and a target pattern search zone is set at a central portion of each of the orthogonal sides and the imaginary sides.

6. The processing method for a sector-shaped wafer piece according to claim 5 , further comprising a target pattern searching step that includes searching for the target pattern in the device at a center of each of the orthogonal sides and imaginary sides of the square by the imaging unit, and detecting the target patterns based on the orthogonal sides and the imaginary sides of the square.

Assignees

• Disco Corp

Inventors

• Tanaka Makoto

Classifications

• H10P72/7416

  used during dicing or grinding · CPC title

• H10P72/0428

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• H10P95/00 Primary

  Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass · CPC title

• H10P74/23

  characterised by multiple measurements, corrections, marking or sorting processes · CPC title

• H10P72/7402

  Wafer tapes, e.g. grinding or dicing support tapes · CPC title