Substrate polishing apparatus
US-2015314418-A1 · Nov 5, 2015 · US
Polishing apparatus
US10414017B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10414017-B2 |
| Application number | US-201515512939-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 24, 2015 |
| Priority date | Oct 30, 2014 |
| Publication date | Sep 17, 2019 |
| Grant date | Sep 17, 2019 |
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- Title
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Abstract
Official abstract text for this publication.
A polishing apparatus includes: a plurality of polishing heads for holding a wafer, a polishing pad for polishing the wafer, a rotatable turn table having the polishing pad attached thereto, a turn table driving mechanism for rotating the turn table, a plurality of wafer-detecting sensors for detecting coming off of the wafer from the polishing head during polishing, wherein the polishing apparatus has the wafer-detecting sensor disposed above peripheral portions of the respective polishing heads and on each downstream side in a rotation direction of the turn table with respect to the respective polishing heads. The polishing apparatus can detect coming off of a wafer from a polishing head during polishing more rapidly, and can prevent a breakage of the wafer thereby.
First claim
Opening claim text (preview).
The invention claimed is: 1. A polishing apparatus comprising: a plurality of polishing heads for holding a wafer, a polishing pad for polishing the wafer, a rotatable turn table having the polishing pad attached thereto, a turn table driving mechanism for rotating the turn table, a plurality of wafer-detecting sensors for detecting coming off of the wafer from the polishing head during polishing, wherein the polishing apparatus has wafer-detecting sensors of the plurality of wafer-detecting sensors disposed above peripheral portions of the respective polishing heads, on a downstream side in a rotation direction of the turn table with respect to the respective polishing heads, and positioned to detect the wafer coming off from the respective polishing heads, the polishing apparatus also has wafer-detecting sensors of the plurality of wafer-detecting sensors disposed above peripheral portions of the respective polishing heads, on an upstream side in a rotation direction of the turn table with respect to the respective polishing heads, and positioned to detect the wafer coming off from the respective polishing heads, the turn table driving mechanism is a motor which rotates the turn table directly by the motor without using a speed reducer and has a function of forcibly stopping a rotation of the motor, wherein said motor is a direct drive servo motor, and in response to one of the plurality of wafer-detecting sensors detecting the wafer coming off from the respective polishing heads during polishing, the one of the plurality of wafer-detecting sensors outputs a detection signal to the turn table driving mechanism to stop a rotation of the turn table. 2. The polishing apparatus according to claim 1 , wherein each of the plurality of wafer-detecting sensors takes 80 μs or less to output a detection signal from detecting the wafer.
Assignees
Inventors
Classifications
Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title
involving optical means · CPC title
- B24B37/34Primary
Accessories · CPC title
- B24B37/10Primary
for single side lapping · CPC title
- B24B37/0053Primary
detecting loss or breakage of a workpiece during lapping · CPC title
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Frequently asked questions
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- What does patent US10414017B2 cover?
- A polishing apparatus includes: a plurality of polishing heads for holding a wafer, a polishing pad for polishing the wafer, a rotatable turn table having the polishing pad attached thereto, a turn table driving mechanism for rotating the turn table, a plurality of wafer-detecting sensors for detecting coming off of the wafer from the polishing head during polishing, wherein the polishing appar…
- Who is the assignee on this patent?
- Shinetsu Handotai Kk, Fujikoshi Machinery Corp
- What technology area does this patent fall under?
- Primary CPC classification B24B37/34. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Sep 17 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).