Estimation device

Patent metadata

Field	Value
Publication number	US-10413986-B2
Application number	US-201515738772-A
Country	US
Kind code	B2
Filing date	Jun 23, 2015
Priority date	Jun 23, 2015
Publication date	Sep 17, 2019
Grant date	Sep 17, 2019

Abstract

A soldering device includes a detection sensor which can detect a liquid level height of molten solder inside a solder bath. It is determined whether or not a detection height which is the detected liquid level height is greater than or equal to a first set height which is arbitrarily set. In a case where the detection height is greater than or equal to the first set height, it is estimated that the amount of molten solder capable of performing a soldering work for a predetermined number or more of boards is stored in the solder bath. The amount of molten solder stored in the solder bath is estimated by multiplying a difference between a detection height which is the detected liquid level height of the molten solder and a second set height which is preset, by an area inside the solder bath in a horizontal direction.

First claim

The invention claimed is:

1. An estimation device estimating an amount of molten solder inside a solder bath of a soldering device soldering leads of a lead component which is mounted on a board by jetting the molten solder stored in the solder bath, the soldering device including a detection sensor configured to detect a liquid level height of the molten solder inside the solder bath, the estimation device comprising:
a first estimation section programmed to:
determine whether or not a detection height that is the liquid level height of molten solder which is detected by the detection sensor is greater than or equal to a first set height which is arbitrarily set, and
in a case where the detection height is greater than or equal to the first set height, estimate that molten solder of an amount capable of performing a soldering work for a predetermined number or more of boards by using the soldering device is stored in the solder bath; and

a second estimation section programmed to estimate the amount of molten solder that is stored in the solder bath by multiplying a difference between the detection height and a preset second set height by an area of the solder bath in a horizontal direction.

2. The estimation device according to claim 1 , wherein
the estimation device includes at least the first estimation section, and
the first set height is a height corresponding to a capacity which is obtained by multiplying an amount of molten solder necessary for performing a soldering work for one board by using the soldering device by the predetermined number.

3. An apparatus comprising:
the estimation device according to claim 1 ; and
the soldering device, wherein
the soldering device includes:
a float that floats on the molten solder which is stored in the solder bath; and
a lifting and lowering device that lifts and lowers the soldering device,

the detection sensor is a sensor configured to detect an ON value in a case where a distance between the float and the detection sensor is less than or equal to a set distance,
the estimation device includes at least the first estimation section,
when a preset maximum amount of molten solder is stored in the solder bath, the ON value is detected by the detection sensor, and
in a case where
a lifting and lowering height of the soldering device by the lifting and lowering device in a state where a distance between the float and the detection sensor becomes a set distance is defined as a first device height, and
a liquid level height of molten solder in a case where the preset maximum amount of molten solder is stored in the solder bath is defined as a maximum liquid level height:
the first estimation section determines that the detection height is greater than or equal to the first set height when the ON value is detected by the detection sensor after the soldering device is lifted from the first device height by a distance corresponding to a difference between the maximum liquid level height and the first set height by using the lifting and lowering device.

4. The estimation device according to claim 1 , wherein
the estimation device includes at least the second estimation section, and
the second estimation section includes a calculating section programmed to calculate a number of boards capable of being soldered by the molten solder which is stored in the solder bath by dividing the amount of molten solder which is estimated to be stored in the solder bath by an amount of molten solder necessary for performing a soldering work for one board by using the soldering device.

5. An apparatus comprising:
the estimation device according to claim 1 ; and
the soldering device, wherein
the soldering device includes:
a float that floats on the molten solder which is stored in the solder bath; and
a lifting and lowering device that lifts and lowers the soldering device,

the detection sensor is a sensor configured to detect an ON value in a case where a distance between the float and the detection sensor is less than or equal to a set distance,
the estimation device includes at least the second estimation section,
the second set height is a liquid level height of molten solder in a case where a maximum amount of molten solder which is preset is stored in the solder bath,
when the maximum amount of molten solder which is preset is stored in the solder bath, the ON value is detected by the detection sensor, and
in a case where the lifting and lowering height of the soldering device by the lifting and lowering device is defined as a first device height in a state where the distance between the float and the detection sensor becomes the set distance;
the second estimation device estimates the amount of molten solder which is stored in the solder bath by using a lifted amount that is obtained by lifting the soldering device from the first height until the ON value is detected by the detection sensor as a difference between the detection height and the second set height.

Assignees

• Fuji Corp

Inventors

• Degura Kazuya
• Otsubo Satoru

Classifications

• H05K3/34

  by soldering · CPC title

• B23K3/0646 Primary

  Solder baths · CPC title

• H05K2203/0126

  Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes · CPC title

• H05K2203/163

  Monitoring a manufacturing process · CPC title

• B23K3/0653 Primary

  with wave generating means, e.g. nozzles, jets, fountains · CPC title