Method for producing a substrate coated with a stack including a conductive transparent oxide film
US-2016229741-A1 · Aug 11, 2016 · US
US10408976B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10408976-B2 |
| Application number | US-201715396888-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 3, 2017 |
| Priority date | Jan 19, 2016 |
| Publication date | Sep 10, 2019 |
| Grant date | Sep 10, 2019 |
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A light transmissive member includes a substrate having a light transmission property, wherein on one surface of the substrate, an antireflection layer in which a low-refractive index layer composed mainly of silicon oxide (SiO2) and a high-refractive index layer composed mainly of silicon nitride (SiN) are alternately stacked is formed, and on the other surface of the substrate, an antistatic layer including at least a transparent electrically conductive film layer is formed.
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What is claimed is: 1. A light transmissive member, comprising a substrate having a light transmission property, wherein on one surface of the substrate, an antireflection layer in which a layer composed of silicon oxide (SiO 2 ) and a layer composed of silicon nitride (SiNx) are alternately stacked is formed, on the other surface of the substrate, an antistatic layer including at least a transparent electrically conductive film layer is formed, the antistatic layer is formed by alternately stacking a first refractive index layer and a second refractive index layer having a lower refractive index than that of the first refractive index layer, one of the first refractive index layers is the transparent electrically conductive film layer, and different one of the first refractive index layers is a layer composed of the same material as that of the transparent electrically conductive film layer or a layer composed of silicon nitride, and the second refractive index layer is a layer composed of silicon oxide. 2. A light transmissive member, comprising a substrate having a light transmission property, wherein on one surface of the substrate, an antireflection layer in which a layer composed of silicon oxide (SiO 2 ) and a layer composed of silicon nitride (SiNx) are alternately stacked is formed, and on the other surface of the substrate, an antistatic layer including at least a transparent electrically conductive film layer is formed, the antistatic layer is formed by alternately stacking a first refractive index layer and a second refractive index layer having a lower refractive index than that of the first refractive index layer, one of the first refractive index layers is the transparent electrically conductive film layer, and different one of the first refractive index layers is a layer composed of the same material as that of the transparent electrically conductive film layer or a layer composed of silicon nitride, and the second refractive index layer is a layer having a lower refractive index than that of the transparent electrically conductive film layer and that of the layer composed of silicon nitride. 3. The light transmissive member according to claim 2 , wherein the second refractive index layer is a layer composed of magnesium fluoride (MgF 2 ). 4. The light transmissive member according to claim 1 , wherein the transparent electrically conductive film layer is a layer composed of a material for forming a transparent electrode. 5. The light transmissive member according to claim 1 , wherein the transparent electrically conductive film layer is a titanium oxide layer composed mainly of titanium oxide and containing, as a sub-component, at least one element selected from the group consisting of niobium (Nb), silicon (Si), zirconium (Zr), tantalum (Ta), aluminum (Al), and hafnium (HO. 6. The light transmissive member according to claim 1 , wherein the antistatic layer is formed by stacking 4 or more layers, and at least a second layer from the outermost layer of the antistatic layer is the transparent electrically conductive film layer. 7. The light transmissive member according to claim 1 , wherein on the antireflection layer, an antifouling layer composed of fluorine-containing organosilicon compound is formed. 8. The light transmissive member according to claim 1 , wherein the light transmissive member is a cover member, and the antireflection layer is formed in a portion on the outside between a portion on the inside and a portion on the outside of the cover member. 9. A timepiece, comprising the light transmissive member according to claim 8 , wherein the light transmissive member is provided for a case which houses a timepiece body. 10. A timepiece, comprising: the light transmissive member according to claim 8 ; a holding member which holds the light transmissive member; and a packing which is provided between the light transmissive member and the holding member and has electrical conductivity. 11. A timepiece, comprising: the light transmissive member according to claim 8 ; a holding member which holds the light transmissive member; and an adhesive which bonds the light transmissive member and the holding member to each other and has electrical conductivity. 12. A light transmissive member production method which is a method for producing a light transmissive member including a substrate having a light transmission property, wherein on one surface of the substrate, an antireflection layer in which a layer composed of silicon oxide (SiO 2 ) and a layer composed of silicon nitride (SiNx) are alternately stacked is formed, and on the other surface of the substrate, an antistatic layer including at least a transparent electrically conductive film layer is formed, the light transmissive member production method comprising a sputtering step in which the antireflection layer and the antistatic layer are formed by sputtering. 13. A light transmissive member production method which is a method for producing the light transmissive member according to claim 1 , comprising a sputtering step in which the antireflection layer and the antistatic layer are formed by sputtering. 14. A light transmissive member production method which is a method for producing the light transmissive member according to claim 2 , comprising a sputtering step in which the antireflection layer and the antistatic layer are formed by sputtering. 15. A light transmissive member production method which is a method for producing the light transmissive member according to claim 3 , comprising a sputtering step in which the antireflection layer and the antistatic layer are formed by sputtering. 16. A light transmissive member production method which is a method for producing the light transmissive member according to claim 4 , comprising a sputtering step in which the antireflection layer and the antistatic layer are formed by sputtering. 17. A light transmissive member production method which is a method for producing the light transmissive member according to claim 5 , comprising a sputtering step in which the antireflection layer and the antistatic layer are formed by sputtering. 18. A light transmissive member production method which is a method for producing the light transmissive member according to claim 1 , wherein as the transparent electrically conductive film layer, niobium-doped titanium dioxide is used, and as the second refractive index layer, a layer composed of silicon oxide is used, and the antistatic layer is formed by performing vapor deposition using an ion-assisted method. 19. A light transmissive member production method which is a method for producing the light transmissive member according to claim 2 , wherein as the transparent electrically conductive film layer, niobium-doped titanium dioxide is used, and as the second refractive index layer, a layer composed of silicon oxide is used, and the antistatic layer is formed by performing vapor deposition using an ion-assisted method.
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