Power amplifier module

Patent metadata

Field	Value
Publication number	US-10404226-B2
Application number	US-201715654219-A
Country	US
Kind code	B2
Filing date	Jul 19, 2017
Priority date	Jan 21, 2015
Publication date	Sep 3, 2019
Grant date	Sep 3, 2019

Abstract

A power amplifier module includes a substrate, a power amplifier having a first surface on which an electrode is defined and a second surface opposite the first surface, the first surface faces a principal surface of the substrate, a surface acoustic wave duplexer having a first surface on which an electrode is defined and a second surface opposite the first surface, the first surface faces the principal surface of the substrate, a heat dissipation unit defined on another principal surface of the substrate, a heat dissipation path that connects a connecting portion between the power amplifier and the principal surface to the heat dissipation unit, an insulating resin that covers the power amplifier and the surface acoustic wave duplexer, a conductive shield that covers the insulating resin, and a first conductive unit defined on the second surface of the surface acoustic wave duplexer and electrically connected to the conductive shield.

First claim

The invention claimed is:

1. A power amplifier module comprising:
a substrate having a first principal surface and a second principal surface;
a power amplifier having a first surface on which an electrode is defined and a second surface opposite the first surface, the power amplifier being mounted so that the first surface faces the first principal surface of the substrate;
a surface acoustic wave duplexer having a first surface on which an electrode is defined and a second surface opposite the first surface, the surface acoustic wave duplexer being mounted so that the first surface faces the first principal surface of the substrate;
a heat dissipation electrode on the second principal surface of the substrate;
a heat dissipation path that connects at least part of a mount between the power amplifier and the first principal surface of the substrate to the heat dissipation electrode;
an insulating resin that covers the power amplifier and the surface acoustic wave duplexer; and
a conductive shield that covers a surface of the insulating resin, wherein the second surface of the surface acoustic wave duplexer is electrically connected to the conductive shield.

2. The power amplifier module according to claim 1 , further comprising:
a metal layer on the second surface of the surface acoustic wave duplexer, and
a conductive path for electrically connecting the metal layer to the conductive shield.

3. The power amplifier module according to claim 2 , wherein the conductive path is a wire defined on the metal layer.

4. The power amplifier module according to claim 3 , wherein the wire has a cut portion that is cut on a conductive shield side, and the cut portion of the wire is connected to the conductive shield.

5. The power amplifier module according to claim 2 , wherein the conductive path is connected to the metal layer with a conductive paste.

6. The power amplifier module according to claim 2 , wherein the conductive path is a columnar metal or a metal pin.

7. The power amplifier module according to claim 1 , further comprising a metal layer on the second surface of the surface acoustic wave duplexer, wherein the metal layer is directly connected to the conductive shield.

8. The power amplifier module according to claim 1 , further comprising a ground wiring defined in the substrate, wherein the conductive shield is electrically connected to the ground wiring.

9. The power amplifier module according to claim 1 , further comprising:
a metal layer on the second surface of the power amplifier, and
a conductive path for electrically connecting the metal layer on the power amplifier to the conductive shield.

10. The power amplifier module according to claim 9 , wherein the conductive path for electrically connecting the metal layer on the power amplifier to the conductive shield is a wire defined on the metal layer on the power amplifier.

11. The power amplifier module according to claim 10 , wherein the wire defined on the metal layer on the power amplifier has a cut portion that is cut on a conductive shield side, and the cut portion of the wire defined on the metal layer on the power amplifier is connected to the conductive shield.

12. The power amplifier module according to claim 9 , wherein the conductive path for electrically connecting the metal layer on the power amplifier to the conductive shield is connected to the metal layer on the power amplifier with a conductive paste.

13. The power amplifier module according to claim 9 , wherein the conductive path for electrically connecting the metal layer of the power amplifier to the conductive shield is a columnar metal or a metal pin.

14. The power amplifier module according to claim 1 , further comprising a metal layer on the second surface of the power amplifier, wherein the metal layer on the second surface of the power amplifier is directly connected to the conductive shield.

Assignees

• Murata Manufacturing Co

Inventors

• Kitahara Takashi
• Nakayama Hiroaki
• Saimei Tsunekazu
• Noto Hiroki
• Kawasaki Koichiro

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/877

  Bump connectors and die-attach connectors · CPC title

• H10W72/20

  Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps · CPC title

• H10W70/635

  Through-vias · CPC title