Hall sensor with buried hall plate

Patent metadata

Field	Value
Publication number	US-10396122-B2
Application number	US-201715639327-A
Country	US
Kind code	B2
Filing date	Jun 30, 2017
Priority date	Nov 4, 2015
Publication date	Aug 27, 2019
Grant date	Aug 27, 2019

Abstract

A CMOS integrated circuit includes a Hall sensor having a Hall plate formed in a first isolation layer which is formed concurrently with a second isolation layer under a MOS transistor. A first shallow well with a conductivity type opposite from the first isolation layer is formed over, and extending to, the Hall plate. The first shallow well is formed concurrently with a second shallow well under the MOS transistor. The Hall sensor may be a horizontal Hall sensor for sensing magnetic fields oriented perpendicular to the top surface of the substrate of the integrated circuit, or may be a vertical Hall sensor for sensing magnetic fields oriented parallel to the top surface of the substrate of the integrated circuit.

First claim

What is claimed is:

1. An integrated circuit, comprising:
a substrate having a surface;
a first doped region extending from the surface to a first depth, the first doped region having a first conductivity type;
a second doped region within the first doped region, and extending from the surface to a second depth less than the first depth, the second doped region having a second conductivity type opposite of the first conductivity type;
a first transistor within the second doped region;
a second transistor outside of the first doped region and the second doped region; and
a Hall sensor having a Hall plate in the first doped region below the second depth and free of overlapping the second transistor.

2. The integrated circuit of claim 1 , wherein the first transistor includes a metal oxide semiconductor (MOS) transistor having a body in the second doped region and isolated by the first doped region.

3. The integrated circuit of claim 1 , wherein the Hall sensor includes:
first and second silicide layers spaced apart from each other along the surface;
a third doped region having the first conductivity type, and extending from the first silicide layer;
a fourth doped region having the first conductivity type, extending from the second silicide layer and laterally isolated from the third doped region; and
the Hall plate positioned under and connecting between the third doped region and the fourth doped region.

4. The integrated circuit of claim 3 , wherein:
each of the third doped region and the fourth doped region has a first dopant density; and
the Hall plate has a second dopant density lower than the first dopant density.

5. The integrated circuit of claim 3 , further comprising:
a current source coupled between the first silicide layer and the second silicide layer.

6. The integrated circuit of claim 3 , wherein the Hall sensor includes:
a fifth doped region positioned above the Hall plate and laterally between the third doped region and the fourth doped region, the fifth doped region having the second conductivity type.

7. The integrated circuit of claim 3 , wherein the Hall sensor includes:
an isolation structure positioned above the Hall plate and laterally between the third doped region and the fourth doped region.

8. The integrated circuit of claim 3 , wherein the Hall sensor includes:
a voltage sensor;
a third silicide layer coupled to the voltage sensor, the third silicide layer spaced apart and positioned between the first silicide layer and the second silicide layer along the surface; and
a fifth doped region extending from the third silicide layer and laterally isolated from the third doped region and the fourth doped region, the fifth doped region having the first conductivity type.

9. The integrated circuit of claim 1 , wherein the Hall plate is free of overlapping the second doped region.

10. The integrated circuit of claim 1 , wherein the Hall plate is directly under the second doped region.

Assignees

• Texas Instruments Inc

Inventors

• Green Keith Ryan
• Aggarwal Rajni J
• Sharma Ajit

Classifications

• H01L43/04

  Electricity · mapped topic

• H01L43/065

  Electricity · mapped topic

• H01L43/14

  Electricity · mapped topic

• H01L27/22 Primary

  Electricity · mapped topic

• H10D84/038

  using silicon technology, e.g. SiGe · CPC title