High-performance compliant heat-exchanger comprising vapor chamber

Patent metadata

Field	Value
Publication number	US-10388540-B2
Application number	US-201715456807-A
Country	US
Kind code	B2
Filing date	Mar 13, 2017
Priority date	Mar 13, 2017
Publication date	Aug 20, 2019
Grant date	Aug 20, 2019

Abstract

This invention relates to cooling devices for multi-chip semiconductor devices, system-on-a-package devices, and other packaged devices. Because of the non-uniform height across the surface in such large-chip and multi-chip assemblies, providing heat exchange can be troublesome. Many air cooled heat sinks are too stiff to adapt to such non-uniform or warped shapes of chips or to shape-changing chip surfaces during operation. In the present disclosure, application of a mechanical load perpendicular to the chip plane causes certain features to flex and adapt to the non-uniform height of the chip plane, providing improved heat exchange.

First claim

What is claimed is:

1. An apparatus for heat exchange comprising:
a base plate;
a first flexible element connected to the base plate; and
at least one sealed cavity;
wherein an inner surface of the at least one sealed cavity is formed at least by the first flexible element and the base plate and wherein the first flexible element and the base plate are directly connected;
further comprising an inflexible element connected to the first flexible element, and wherein the inflexible element is connected to a second flexible element by a bonding element, wherein the second element is connected to the base plate.

2. The apparatus of claim 1 , wherein the inflexible element has a shape that is selected from the group consisting of a block, a cylinder, a cone, a dome, a pyramid, and a prism.

3. The apparatus of claim 1 , wherein the at least one sealed cavity contains a fluid.

4. The apparatus of claim 3 , wherein the fluid is selected from the group consisting of acetone, hexane-n, ethanol, methanol, isopropyl alcohol, n-propyl alcohol, cyclohexane, acetaldehyde, diethyl ether, and pentane-n.

5. The apparatus of claim 1 , wherein a surface of a wall of the at least one sealed cavity is enlarged in surface area.

6. The apparatus of claim 5 , wherein the surface of the wall comprises a roughened surface.

7. The apparatus of claim 6 , further comprising at least one fin structure connected to the base plate.

8. The apparatus of claim 7 , further comprising at least one pin structure connected to the base plate.

9. A method for providing a heat sink to a non-uniform chip plane, the method comprising:
providing a multi-chip device having a non-uniform chip plane; and
providing a heat exchanger attached to the multi-chip device, wherein the heat exchanger comprises a base plate, a first flexible element connected to the base plate, an inflexible element connected to the first flexible element, a second flexible element connected to the base plate, and at least one sealed cavity, wherein an inner surface of the at least one sealed cavity is formed by at least the first flexible element, the second flexible element, the inflexible element, and the base plate, wherein the inflexible element is connected to the second flexible element by a bonding element, wherein the second element is connected to the base plate.

10. An electronic module comprising:
a substrate having a component surface;
a plurality of semiconductor chips mounted on the component surface of the substrate; and
a heat exchanger attached to a multi-chip device, wherein the heat exchanger comprises a base plate, a first flexible element connected to the base plate, a second flexible element connected to the base plate, an inflexible element connected to the first flexible element, and at least one sealed cavity, wherein an inner surface of the at least one sealed cavity is formed at least by the first flexible element, the second flexible element, the inflexible element, and the base plate, and wherein the inflexible element is connected to the second flexible element by a bonding element, wherein the second element is connected to the base plate.

11. The electronic module of claim 10 , wherein the inflexible element has a shape that is selected from the group consisting of a block, a cylinder, a cone, a pyramid, and a prism.

12. The electronic module of claim 10 , wherein the at least one sealed cavity contains a fluid.

13. The electronic module of claim 12 , wherein the fluid is selected from the group consisting of acetone, hexane-n, ethanol, methanol, isopropyl alcohol, n-propyl alcohol, cyclohexane, acetaldehyde, diethyl ether, and pentane-n.

14. The electronic module of claim 10 , further comprising at least one fin structure connected to the base plate.

15. The electronic module of claim 10 , wherein a surface of a wall of the at least one sealed cavity is enlarged in surface area.

Assignees

• IBM

Inventors

• Brunschwiler Thomas
• Meijer Ingmar
• Paredes Stephan
• Schlottig Gerd

Classifications

• H10W40/258

  Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence) · CPC title

• H10W40/73

  for cooling by change of state · CPC title

• H10W40/037 Primary

  Assembling together parts thereof · CPC title

• H01L23/3736

  Electricity · mapped topic

• H01L23/427

  Electricity · mapped topic