Method for an Electrical System
US-2025297898-A1 · Sep 25, 2025 · US
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Schlottig Gerd patents
Schlottig Gerd is listed as an inventor on 48 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Schlottig Gerd |
| Total patents | 48 |
| First publication | Jun 23, 2015 |
| Latest publication | Sep 25, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Method for Estimating a Consumed Lifetime of an Energy Storage Device
US-2025020736-A1 · Jan 16, 2025 · US
Method to Detect a Size Change in an Energy Storage Device
US-2024384976-A1 · Nov 21, 2024 · US
Diagnosis and prognosis of igbt modules
US-2024118333-A1 · Apr 11, 2024 · US
Power Semiconductor Module with Accessible Metal Clips
US-2023048878-A1 · Feb 16, 2023 · US
Manufacturing of flip-chip electronic device with carrier having heat dissipation elements free of solder mask
US-11251160-B2 · Feb 15, 2022 · US
Flip-chip electronic device with carrier having heat dissipation elements free of solder mask
US-10886254-B2 · Jan 5, 2021 · US
Manufacturing of flip-chip electronic device with carrier having heat dissipation elements free of solder mask
US-2020357774-A1 · Nov 12, 2020 · US
Disconnect assembly for active cooling of packaged electronics
US-10767939-B2 · Sep 8, 2020 · US
Sealing arrangement
US-10763189-B2 · Sep 1, 2020 · US
Recent patents
Latest publications not already listed above.
Counter-flow expanding channels for enhanced two-phase heat removal
US-10727158-B2 · Jul 28, 2020 · US
Counter-flow expanding channels for enhanced two-phase heat removal
US-10727159-B2 · Jul 28, 2020 · US
Counter-flow expanding channels for enhanced two-phase heat removal
US-2020118907-A1 · Apr 16, 2020 · US
Counter-flow expanding channels for enhanced two-phase heat removal
US-2020091037-A1 · Mar 19, 2020 · US
Disconnect assembly for active cooling of packaged electronics
US-2020072562-A1 · Mar 5, 2020 · US
Heat removal element with thermal expansion coefficient mismatch
US-10551132-B2 · Feb 4, 2020 · US
Disconnect assembly for active cooling of packaged electronics
US-2020011617-A1 · Jan 9, 2020 · US
Disconnect assembly for active cooling of packaged electronics
US-10527365-B1 · Jan 7, 2020 · US
Counter-flow expanding channels for enhanced two-phase heat removal
US-10529648-B2 · Jan 7, 2020 · US
High-performance compliant heat-exchanger comprising vapor chamber
US-10388540-B2 · Aug 20, 2019 · US
Heat removal element with thermal expansion coefficient mismatch
US-2019162484-A1 · May 30, 2019 · US
Flip-chip electronic device with carrier having heat dissipation elements free of solder mask
US-2019043838-A1 · Feb 7, 2019 · US
Compliant heat sink
US-2018374771-A1 · Dec 27, 2018 · US
Compliant heat sink
US-10157814-B1 · Dec 18, 2018 · US
Flip-chip electronic device with carrier having heat dissipation elements free of solder mask
US-10153250-B2 · Dec 11, 2018 · US
Releasable, threadless conduit connector for liquid manifold
US-10132433-B2 · Nov 20, 2018 · US
Releasable, threadless conduit connector for liquid manifold
US-10107426-B2 · Oct 23, 2018 · US
High-Performance Compliant Heat-Exchanger Comprising Vapor Chamber
US-2018261522-A1 · Sep 13, 2018 · US
Counter-flow expanding channels for enhanced two-phase heat removal
US-2018182686-A1 · Jun 28, 2018 · US
Releasable, threadless conduit connector for liquid manifold
US-10006571-B2 · Jun 26, 2018 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| IBM | 43 |
| Abb Schweiz Ag | 4 |
| Int Business Machines Corporatin | 1 |
| Hitachi Energy Switzerland Ag | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/724 | 21 |
| H10W90/00 | 18 |
| H10W90/734 | 16 |
| H10W70/02 | 16 |
| H10W90/722 | 14 |