Semiconductor die having edge with multiple gradients and method for forming the same
US-2018166328-A1 · Jun 14, 2018 · US
Method of processing workpiece
US10388534B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10388534-B2 |
| Application number | US-201815934443-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 23, 2018 |
| Priority date | Apr 4, 2017 |
| Publication date | Aug 20, 2019 |
| Grant date | Aug 20, 2019 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
A method of processing a plate-shaped workpiece that includes on a reverse side thereof a layered body containing metal which is formed in superposed relation to projected dicing lines includes the steps of holding the reverse side of the workpiece on a holding table, thereafter, applying a laser beam having a wavelength that is absorbable by the workpiece to a face side thereof along the projected dicing lines to form laser-processed grooves in the workpiece which terminate short of the layered body, and thereafter, cutting bottoms of the laser-processed grooves with a cutting blade to sever the workpiece together with the layered body along the projected dicing lines. The step of cutting bottoms of the laser-processed grooves includes the step of cutting bottoms of the laser-processed grooves while supplying a cutting fluid containing an organic acid and an oxidizing agent to the workpiece.
First claim
Opening claim text (preview).
What is claimed is: 1. A method of processing a plate-shaped workpiece that includes on a reverse side thereof a layered body containing metal which is formed in superposed relation to projected dicing lines, comprising the steps of: holding the reverse side of said workpiece on a holding table; thereafter, applying a laser beam having a wavelength that is absorbable by said workpiece to a face side thereof along the projected dicing lines to form laser-processed grooves in said workpiece, extending along the projected dicing lines, which terminate short of said layered body, thereby leaving a portion of said workpiece above said layered body; and thereafter, cutting bottoms of said laser-processed grooves with a cutting blade to sever said workpiece together with said layered body along said projected dicing lines; wherein said step of cutting bottoms of said laser-processed grooves includes the step of cutting bottoms of said laser-processed grooves while supplying a cutting fluid containing an organic acid and an oxidizing agent to said workpiece, wherein the organic acid modifies the metal in the layered body to restrain its ductility. 2. The method according to claim 1 , further comprising the step of: before said step of cutting bottoms of said laser-processed grooves, providing a protective member on the reverse side of said workpiece; wherein said step of cutting bottoms of said laser-processed grooves is performed while the reverse side of said workpiece is held through said protective member provided thereon. 3. The method according to claim 2 , wherein the cutting blade used in said step of cutting bottoms of said laser-processed grooves has a thickness smaller than the width of said laser-processed grooves. 4. The method according to claim 1 , further comprising the step of: after said step of applying a laser beam and before said step of cutting bottoms of said laser-processed grooves, providing a protective member on the face side of said workpiece; wherein said step of cutting bottoms of said laser-processed grooves is performed while the face side of said workpiece is held through said protective member provided thereon.
Assignees
Inventors
Classifications
used during dicing or grinding · CPC title
characterised by the mechanical construction of the susceptor, stage or support · CPC title
characterised by a plurality of separate clamping members, e.g. clamping fingers · CPC title
Wafer tapes, e.g. grinding or dicing support tapes · CPC title
Apparatus for mechanical treatment or grinding or cutting · CPC title
Patent family
Related publications grouped by family.
External sources
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US10388534B2 cover?
- A method of processing a plate-shaped workpiece that includes on a reverse side thereof a layered body containing metal which is formed in superposed relation to projected dicing lines includes the steps of holding the reverse side of the workpiece on a holding table, thereafter, applying a laser beam having a wavelength that is absorbable by the workpiece to a face side thereof along the proje…
- Who is the assignee on this patent?
- Disco Corp
- What technology area does this patent fall under?
- Primary CPC classification H10P54/00. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Aug 20 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).