Dual element fuse and methods of manufacture

Patent metadata

Field	Value
Publication number	US-10388480-B2
Application number	US-201615240548-A
Country	US
Kind code	B2
Filing date	Aug 18, 2016
Priority date	Aug 18, 2016
Publication date	Aug 20, 2019
Grant date	Aug 20, 2019

Abstract

A dual element electrical fuse includes at least one high overcurrent fusible element and a low overcurrent fusible element connected to one another inside a housing. The low overcurrent fusible element includes a single sided circuit board and a releasable conductive element that more simply provides low overcurrent protection and manufacturing efficiency with improved quality.

First claim

What is claimed is:

1. An electrical fuse comprising:
a housing; and
a low overcurrent fusible element connected in series between a first high overcurrent fusible element and a second high overcurrent fusible element inside the housing, wherein the low overcurrent fusible element comprises:
a nonconductive substrate having a first major surface and a second major surface opposite the first major surface;
a conductive layer provided on the first major surface of the nonconductive substrate, the conductive layer defining a first conductive portion and a second conductive portion separated from one another by a nonconductive gap, wherein each of the first conductive portion and the second conductive portion is series connected to a respective one of the first high overcurrent fusible element and the second high overcurrent fusible element and wherein the second major surface of the nonconductive substrate is not provided with a conductive layer;
a releasable conductive element extending on the second major surface of the nonconductive substrate, the releasable conductive element including a first end and a second end;
a low melting point solder extending on the first major surface of the nonconductive substrate without extending on the second major surface of the nonconductive substrate, the low melting point solder establishing a first current path from the first conductive portion on the first major surface of the nonconductive substrate to the first end of the releasable conductive element; and
a high melting point solder extending on the first major surface of the nonconductive substrate without extending on the second major surface of the nonconductive substrate, the high melting point solder establishing a second current path between the second end of the releasable conductive element and the second conductive portion on the first major surface.

2. The electrical fuse of claim 1 , wherein the nonconductive substrate includes an opening extending through the nonconductive substrate from the first major surface to the second major surface, the first end of the releasable conductive element extending in the opening from the second major surface of the nonconductive substrate.

3. The electrical fuse of claim 2 , further wherein the low melting point solder extends across the opening and the first conductive portion on the first major surface of the nonconductive substrate.

4. The electrical fuse of claim 2 , wherein the nonconductive substrate material includes an opening extending through the nonconductive substrate material from the first major surface to the second major surface, the second end of the releasable conductive element extending in the opening from the second major surface of the nonconductive substrate.

5. The electrical fuse of claim 4 , wherein the high melting point solder extends across the opening and the second conductive portion on the first major surface of the nonconductive substrate.

6. The electrical fuse of claim 5 , wherein the high melting point solder defines a current path between the second end of the releasable conductive element and the second conductive portion on the first major surface of the nonconductive substrate.

7. The electrical fuse of claim 1 , wherein the nonconductive substrate includes four openings respectively extending through the nonconductive substrate from the first major surface to the second major surface at respectively spaced apart locations.

8. The electrical fuse of claim 7 , wherein the first conductive portion extends around a first pair of the four openings on the first major surface of the nonconductive substrate, and wherein the second conductive portion extends around a second pair of the four openings on the first major surface of the nonconductive substrate.

9. The electrical fuse of claim 8 , wherein the high melting point solder is applied over the second conductive portion on the first major surface of the nonconductive substrate and the low melting point solder is applied over the first conductive portion on the first major surface of the nonconductive substrate.

10. The electrical fuse of claim 9 , wherein the first end of the releasable conductive element is attached to first conductive portion on the first major surface of the nonconductive substrate via the low melting point solder.

11. The electrical fuse of claim 8 , further comprising a high melting point fusible material applied over the low melting point solder on the first major surface of the nonconductive substrate.

12. The electrical fuse of claim 11 , wherein a second end of the releasable conductive element is attached to the second conductive portion on the first major surface of the nonconductive substrate via the high melting point solder.

13. The electrical fuse of claim 1 , wherein the releasable conductive element comprises a strip of conductive shape memory material.

14. The electrical fuse of claim 13 , wherein the strip of conductive shape memory material comprises a copper alloy.

15. The electrical fuse of claim 1 , wherein each of the first and second high overcurrent fusible elements comprises a strip of material defining a plurality of weak spots.

16. The electrical fuse of claim 1 , wherein the housing is substantially cylindrical.

17. The electrical fuse of claim 1 , further comprising first and second terminal elements coupled to the housing and connected to each respective one of the first and second high overcurrent fusible elements.

18. The electrical fuse of claim 17 , wherein the first and second terminal elements comprise first and second end caps.

19. The electrical fuse of claim 1 , wherein the conductive layer comprises copper.

Assignees

• Eaton Intelligent Power Ltd

Inventors

• Still Frederick Eugene
• Miller Abraham Joshua
• Jaquez Gilberto

Classifications

• H01H85/175

  characterised by the casing shape or form · CPC title

• H01H85/06

  characterised by the fusible material (H01H85/11 takes precedence) · CPC title

• H01H2085/0004

  making use of shape-memory material · CPC title

• H01H85/08

  characterised by the shape or form of the fusible member · CPC title

• H01H85/202

  for fuses with ferrule type end contacts · CPC title