Methods of atomic layer etching (ALE) using sequential, self-limiting thermal reactions

Patent metadata

Field	Value
Publication number	US-10381227-B2
Application number	US-201515534215-A
Country	US
Kind code	B2
Filing date	Dec 18, 2015
Priority date	Dec 18, 2014
Publication date	Aug 13, 2019
Grant date	Aug 13, 2019

Abstract

The invention includes a method of promoting atomic layer etching (ALE) of a surface. In certain embodiments, the method comprises sequential reactions with a metal precursor and a halogen-containing gas. The invention provides a solid substrate obtained according to any of the methods of the invention. The invention further provides a porous substrate obtained according to any of the methods of the invention. The invention further provides a patterned solid substrate obtained according to any of the methods of the invention.

First claim

What is claimed is:

1. A method of etching a solid substrate comprising a first metal compound using atomic layer etching (ALE), the method comprising the sequential steps of:
(a) contacting the solid substrate, wherein the substrate comprises a first metal compound comprising at least one first ligand, with a gaseous second metal precursor, wherein the second metal precursor comprises at least one second ligand selected from the group consisting of monodentate ligands, chelates, and any combinations thereof;
wherein the at least one second ligand from the second metal precursor is transferred to the first metal, and wherein the at least one first ligand from the first metal compound is transferred to the second metal, whereby a first metal precursor is formed on the substrate;

(b) contacting the solid substrate formed in step (a) with a halogen-containing gas, whereby a first metal halide is formed; and
(c) optionally repeating steps (a) and (b) one or more times;
wherein the monodentate ligand comprises at least one selected from the group consisting of alkyl, hydride, carbonyl, halide, alkoxide, alkylamide, silylamide, and any combinations thereof; and,
wherein the chelate comprises at least one selected from the group consisting of β-diketonate, amidinate, acetamidinate, β-diketiminate, diamino alkoxide, metallocene and any combinations thereof;

whereby the solid substrate is etched.

2. The method of claim 1 , wherein the solid substrate is contained in a single system and is sequentially contacted with the gaseous compound of the second metal in step (a) and the halogen-containing gas in step (b), wherein the solid substrate is purged with an inert gas after at least one of step (a) and step (b).

3. The method of claim 1 , wherein at least one selected from the group consisting of step (a) and step (b) is run at a temperature that is equal to or greater than a value ranging from about 100° C. to about 450° C.

4. The method of claim 1 , wherein the first metal compound comprises at least one selected from the group consisting of metal oxide, metal nitride, metal phosphide, metal sulfide, metal arsenide, metal fluoride, metal silicide, metal boride, metal carbide, metal selenide, metal telluride, elemental metal, metal alloy, hybrid organic-inorganic material, and any combinations thereof, wherein before step (a) takes place the elemental metal is converted to the corresponding metal halide.

5. The method of claim 1 , wherein the solid substrate is first submitted to a chemical treatment that results in the formation, on at least a portion of the surface of the solid substrate, of a metal compound selected from the group consisting of a metal oxide, metal nitride, metal phosphide, metal sulfide, metal arsenide, metal fluoride, metal silicide, metal boride, metal carbide, metal selenide, metal telluride, elemental metal, metal alloy, hybrid organic-inorganic material, and any combinations thereof, wherein before step (a) takes place the elemental metal is converted to the corresponding metal halide.

6. The method of claim 1 , wherein the first metal comprises at least one selected from the group consisting of Al, Hf, Zr, Fe, Ni, Co, Mn, Mg, Rh, Ru, Cr, Si, Ti, Ga, In, Zn, Pb, Ge, Ta, Cu, W, Mo, Pt, Cd, Sn and any combinations thereof.

7. The method of claim 1 , wherein the second metal comprises at least one selected from the group consisting of Sn, Ge, Al, B, Ga, In, Zn, Ni, Pb, Si, Hf, Zr, Ti and any combinations thereof.

8. The method of claim 1 , wherein the β-diketonate comprises at least one selected from the group consisting of acac (acetylacetonate), hfac (hexafluoroacetylacetonate), tfac (trifluroacetylacetonate), ttmhd (tetramethylheptanedionate) and any combinations thereof.

9. The method of claim 1 , wherein the halogen-containing gas comprises a hydrogen halide.

10. The method of claim 1 , wherein the halogen-containing gas comprises at least one selected from the group consisting of F 2 , ClF 3 , NF 3 , SF 6 , SF 4 , XeF 2 , Cl 2 , Br 2 , BCl 3 , I 2 and any combinations thereof.

11. The method of claim 1 , wherein the halogen-containing gas comprises at least one selected from the group consisting of F 2 , ClF 3 , NF 3 , SF 6 , SF 4 , XeF 2 , Cl 2 , Br 2 , BCl 3 , I 2 , CF 4 , CF 2 Cl 2 , CCl 4 , CF 3 Cl, C 2 F 6 , CHF 3 and any combinations thereof, and wherein the halogen-containing gas is ionized in a plasma to produce at least one halogen radical and/or ion.

12. The method of claim 1 , wherein the solid substrate is pretreated by sequential contacting with a gaseous second metal precursor, and a halogen-containing gas.

13. The method of claim 1 , wherein the solid substrate comprises at least one additional metal compound, and ALE of the first metal compound is selective over ALE of the at least one additional metal compound.

14. The method of claim 1 , wherein, before step (a) takes place, the first metal compound is converted to the corresponding metal halide by contacting the first metal compound with a halogen-containing gas.

15. The method of claim 1 , wherein step (c) is carried out.

16. The method of claim 1 , wherein step (a) and step (b) are carried out at spatially distinct locations.

17. A method of modifying a porous substrate, wherein the porous substrate comprises a first metal compound, the method comprising the sequential steps of:
(a) contacting the porous substrate, wherein the substrate comprises a first metal compound comprising at least one first ligand, with a gaseous second metal precursor, wherein the second metal precursor comprises at least one second ligand selected from the group consisting of monodentate ligands, chelates and any combinations thereof,
wherein the at least one second ligand from the second metal precursor is transferred to the first metal, and wherein the at least one first ligand from the first metal compound is transferred to the second metal, whereby a first metal precursor is formed on the substrate;

(b) contacting the porous substrate formed in step (a) with a halogen-containing gas, whereby a first metal halide is formed; and
(c) optionally repeating steps (a) and (b) one or more times;

wherein the modifying comprises at least one activity selected from the group consisting of:
forming or enlarging pores in the porous substrate;
patterning the solid substrate;
selectively removing a portion of the solid substrate;
smoothing the surface of the solid substrate;
removing at least a fraction of an impurity from the solid substrate, wherein a portion of a surface of the solid substrate has an exposed first metal compound; and
reducing the size of at least one 3D architecture feature on a surface of the solid substrate.

18. The method of claim 17 , wherein the modifying comprises patterning the solid substrate, and wherein the surface of the starting solid substrate is at least partially masked, whereby only a portion of the surface of the solid substrate is exposed.

19. The method of claim 17 , wherein, before step (a) takes place, the first metal compound is converted to the corresponding metal halide by contacting the first metal compound with a halogen-containing gas.

20. The method of claim 17 , wherein step (c) is carried out.

21. The method of claim 17 , wherein step (a) and step (b) are carried out at spatially distinct locations.

22. The method of claim 17 , wherein the solid substrate is contained in a single system and is sequentially contacted with the gaseous compound of

Assignees

• Univ Colorado Regents

Inventors

• George Steven M
• Lee Younghee

Classifications

• H10P95/70

  Chemical treatments · CPC title

• H10P72/0604

  Process monitoring, e.g. flow or thickness monitoring · CPC title

• H10P72/0421

  for drying etching · CPC title

• H10P52/00

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• H10P50/285

  of materials not containing Si, e.g. PZT or Al2O3 · CPC title