Surface modification for metal-containing photoresist deposition
US-12586765-B2 · Mar 24, 2026 · US
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Lee Younghee patents
Lee Younghee is listed as an inventor on 28 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lee Younghee |
| Total patents | 28 |
| First publication | Aug 9, 2018 |
| Latest publication | Mar 24, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Selectively etching for nanowires
US-12550646-B2 · Feb 10, 2026 · US
Integration of dry development and etch processes for euv patterning in a single process chamber
US-2026036908-A1 · Feb 5, 2026 · US
Integration of dry development and etch processes for EUV patterning in a single process chamber
US-12474640-B2 · Nov 18, 2025 · US
Integration of dry development and etch processes for euv patterning in a single process chamber
US-2025291255-A1 · Sep 18, 2025 · US
Post-development treatment of metal-containing photoresist
US-2025244678-A1 · Jul 31, 2025 · US
Co-deposition and etch process
US-2025243585-A1 · Jul 31, 2025 · US
All-in-one dry development for metal-containing photoresist
US-2025244677-A1 · Jul 31, 2025 · US
High energy atomic layer etch of a carbon containing layer
US-2025218774-A1 · Jul 3, 2025 · US
Selective etch using deposition of a metalloid or metal containing hardmask
US-12341021-B2 · Jun 24, 2025 · US
Recent patents
Latest publications not already listed above.
All-in-one dry development for metal-containing photoresist
US-2025060674-A1 · Feb 20, 2025 · US
Selective etch using a sacrificial mask
US-12027375-B2 · Jul 2, 2024 · US
Apparatus and process for euv dry resist sensitization by gas phase infusion of a sensitizer
US-2024192590-A1 · Jun 13, 2024 · US
Control of metallic contamination from metal-containing photoresist
US-2024036474-A1 · Feb 1, 2024 · US
Method of forming photo-sensitive hybrid films
US-2023314946-A1 · Oct 5, 2023 · US
Surface modification for metal-containing photoresist deposition
US-2023230811-A1 · Jul 20, 2023 · US
Selective etch using deposition of a metalloid or metal containing hardmask
US-2023118701-A1 · Apr 20, 2023 · US
Alloy film etch
US-2023047486-A1 · Feb 16, 2023 · US
Post application/exposure treatments to improve dry development performance of metal-containing euv resist
US-2023031955-A1 · Feb 2, 2023 · US
Deposition of self assembled monolayer for enabling selective deposition and etch
US-11450532-B2 · Sep 20, 2022 · US
Deposition of self assembled monolayer for enabling selective deposition and etch
US-2022208555-A1 · Jun 30, 2022 · US
Selective etch using a sacrificial mask
US-2022122848-A1 · Apr 21, 2022 · US
Selectively etching for nanowires
US-2021272814-A1 · Sep 2, 2021 · US
Enhancement of thermal atomic layer etching
US-10787744-B2 · Sep 29, 2020 · US
Methods of atomic layer etching (ALE) using sequential, self-limiting thermal reactions
US-10381227-B2 · Aug 13, 2019 · US
Enhancement of Thermal Atomic Layer Etching
US-2019055654-A1 · Feb 21, 2019 · US
Atomic layer etching processes using sequential, self-limiting thermal reactions comprising oxidation and fluorination
US-10208383-B2 · Feb 19, 2019 · US
Atomic layer etching processes using sequential, self-limiting thermal reactions comprising oxidation and fluorination
US-2018223437-A1 · Aug 9, 2018 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Lam Res Corp | 23 |
| Univ Colorado Regents | 5 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P76/4085 | 12 |
| H10P50/73 | 12 |
| G03F7/0042 | 12 |
| H10P50/283 | 11 |
| H01L21/31144 | 10 |