Chip card and method of forming a chip card

Patent metadata

Field	Value
Publication number	US-10380477-B2
Application number	US-201715406832-A
Country	US
Kind code	B2
Filing date	Jan 16, 2017
Priority date	Jan 20, 2016
Publication date	Aug 13, 2019
Grant date	Aug 13, 2019

Abstract

A chip card is provided. The chip card may include a chip card substrate and an antenna structure disposed in or over the chip card substrate, the antenna structure including a wire arranged to form a first antenna portion configured to contactlessly couple to a chip card external device and a second antenna portion configured to couple to a chip antenna, wherein the wire may include an electrically conductive material coated with an electrically insulating material, wherein the wire of the first antenna portion may be arranged such that a direction of laying progress of the wire of at least some adjacent wire portions are opposite to each other, such that the at least some adjacent wire portions may form a capacitor, wherein the isolation material of the at least some adjacent wire portions may be physically contacting each other.

First claim

What is claimed is:

1. A chip card, comprising:
a chip card substrate; and
an antenna structure comprising an insulated wire arranged in or over the chip card substrate to form a first antenna portion configured to contactlessly couple to a chip card external device and a second antenna portion configured to couple to a chip antenna;
wherein the insulated wire comprises an insulated material coated around an electrically conductive material core;
wherein the first antenna portion comprises a first antenna subportion arranged in a first direction and a second antenna subportion arranged in a second direction opposite to the first direction; wherein the first antenna subportion is laterally adjacent and horizontally parallel to the second antenna subportion, such that the at least some laterally adjacent insulated wire portions form a capacitor; and
wherein the electrically insulating material of the at least some adjacent insulated wire portions is physically contacting each other.

2. The chip card according to claim 1 , further comprising a chip comprising at least one electronic component.

3. The chip card according to claim 1 , wherein the at least some laterally adjacent insulated wire portions comprise a plurality of first insulated wire portions having a first direction of the laying progress and at least one second insulated wire portion having an opposite second direction of the laying progress, and wherein two first insulated wire portions of the plurality of first insulated wire portions and one second insulated wire portion of the at least one second insulated wire portion are arranged in a triangular configuration.

4. The chip card according to claim 3 , wherein the at least one second insulated wire portion comprises a plurality of second insulated wire portions, wherein the plurality of first insulated wire portions is arranged in a first plane, and wherein the plurality of second insulated wire portions is arranged in a second plane parallel to the first plane.

5. The chip card according to claim 1 , wherein the at least some laterally adjacent insulated wire portions comprise a first insulated wire portion having a first direction of the laying progress and a second insulated wire portion having an opposite second direction of the laying progress, and wherein the first insulated wire portion and the second insulated wire portion are arranged in a single plane.

6. The chip card according to claim 5 , wherein a width of a cross section of the insulated wire in the single plane is larger than a height of the cross section of the insulated wire orthogonal to the single plane.

7. The chip card according to claim 1 , wherein the electrically conductive material comprises copper or a copper alloy.

8. The chip card according to claim 1 , wherein the electrically insulating material comprises a polymer material.

9. The chip card according to claim 1 , wherein the insulated wire comprises an adhesive coating around the electrically insulating material of the insulated wire: wherein the adhesive coating adhesively connects the first antenna subportion of insulated wire to the laterally adjacent and horizontally parallel second antenna subportion.

Assignees

• Infineon Technologies Ag

Inventors

• Pueschner Frank
• Stampka Peter
• Hoffner Siegfried
• Pohl Jens

Classifications

• G06K19/07779

  the inductive antenna being a coil · CPC title

• G06K19/0776

  the adhering arrangement being a layer of adhesive, so that the record carrier can function as a sticker · CPC title

• G06K19/07794

  the record carrier comprising a booster or auxiliary antenna in addition to the antenna connected directly to the integrated circuit · CPC title

• G06K19/07775 Primary

  the antenna being on-chip · CPC title

• H01Q1/2283

  mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package · CPC title