Method for producing a contactless microcircuit

Patent metadata

Field	Value
Publication number	US-9218562-B2
Application number	US-201314412491-A
Country	US
Kind code	B2
Filing date	May 3, 2013
Priority date	Jul 2, 2012
Publication date	Dec 22, 2015
Grant date	Dec 22, 2015

Abstract

The invention relates to a method for manufacturing a contactless microcircuit antenna coil, including steps of: depositing a first electrically conducting layer on a first face of a wafer, and forming in the first layer an antenna coil in a spiral having several turns, including an internal turn coupled to an internal contact pad and an external turn coupled to an external contact pad, the external turn following the entire contour of antenna coil except for a zone through which a conducting path coupling the external contact pad to the external turn can pass, the external and internal contact pads of the antenna coil being formed in a central zone of the external turn, the antenna coil having a bypass zone in which each turn bypasses the external contact pad.

First claim

The invention claimed is:

1. A method for manufacturing a contactless microcircuit antenna coil, comprising steps of:
depositing a first electrically conducting layer on a first face of a wafer, and
forming in the first layer an antenna coil in a spiral comprising several turns, comprising an internal turn coupled to an internal contact pad and an external turn coupled to an external contact pad,
wherein the external turn follows the entire contour of antenna coil except for a zone through which a conducting path coupling the external contact pad to the external turn can pass, the external and internal contact pads of the antenna coil being formed in a central zone of the external turn, the antenna coil comprising a bypass zone in which each turn passes around the external contact pad in the central zone.

2. The method according to claim 1 , wherein the bypass zone of the antenna coil is pre-formed to support a microcircuit across the entire width and at least partially over the length of the latter.

3. The method according to claim 1 , wherein the layer comprises a support structure for supporting a microcircuit, the support structure being able to be coupled to the internal turn of the antenna coil.

4. The method according to claim 1 , comprising steps of:
depositing a second electrically conducting layer on a second face of the wafer,
forming contact pads in the second layer, and
forming holes in the wafer from the first layer, down to the contact pads of the second layer.

5. A method for manufacturing a contactless module, comprising steps of:
executing the method according to claim 1 ,
securing a microcircuit onto a central zone of the antenna coil, and
coupling contact pads of the microcircuit to the contact pads of the antenna coil, through wires.

6. The method according to claim 5 , comprising steps of:
depositing a second electrically conducting layer on a second face of the wafer
forming contact pads in the second layer, and
forming holes in the wafer from the first layer, down to the contact pads of the second layer, and
coupling contact pads of the microcircuit to the contact pads of the second layer through wires passing in the holes.

7. The method according to claim 5 , comprising a step of depositing an electrically insulating protection layer on the microcircuit and the connecting wires.

8. The method according to claim 5 , wherein the wafer belongs to a board in which several contactless modules are collectively formed, the method comprising a step of cutting the board to individualize the modules, performed after connecting each microcircuit.

9. The method for manufacturing a microcircuit card comprising steps of:
executing the method according to claim 5 , to obtain a contactless module,
forming an antenna coil in a card, and
implanting the module into the card, the antenna coil of the card having a part close to the antenna coil of the microcircuit to establish a coupling by induction between the two antenna coils.

10. The method according to claim 5 , wherein the card belongs to a board in which contactless microcircuit cards are collectively formed, the method comprising a step of cutting the board to individualize the cards, performed after forming the card antenna coils in the board, and before implanting one module into each card.

11. A contactless microcircuit antenna coil, comprising:
a wafer covered on a first face with a first layer in which an antenna coil is formed, the antenna coil comprising several turns in a spiral, including an internal turn coupled to a contact pad inside the internal turn and an external turn coupled to an external contact pad,
wherein the external turn follows the entire contour of antenna coil except for a zone through which a conducting path coupling the external contact pad to the external turn can pass, the external and internal contact pads of the antenna coil being formed in a central zone of the external turn, the antenna coil comprising a bypass zone in which each turn passes around the external contact pad.

12. The antenna coil according to claim 11 , wherein the turns in the bypass zone are pre-formed to support a microcircuit across the entire width and at least partially over the length of the latter.

13. The antenna coil according to claim 11 , wherein the first layer comprises a support structure to support a microcircuit, the support structure being able to be coupled to the internal turn of the antenna coil.

14. The antenna coil according to claim 11 , comprising a second electrically conducting layer covering a second face of the wafer, the second layer forming contact pads, and holes passing through the wafer from the first face and reaching the contact pads of the second layer.

15. A contactless module comprising:
an antenna coil according to claim 11 , and
a microcircuit secured onto a central zone of the antenna coil and comprising contact pads coupled to the contact pads of the antenna coil through wires.

16. The contactless module according to claim 15 , comprising a second electrically conducting layer covering a second face of the wafer, the second layer forming contact pads, and wires coupling contact pads of the microcircuit to the contact pads of the second layer, by passing through holes formed in the wafer from the first layer and reaching the contact pads of the second layer.

17. The contactless module according to claim 15 , comprising an electrically insulating protection layer covering the microcircuit and the connecting wires.

18. A microcircuit card comprising an antenna coil and a module according to claim 15 , the antenna coil of the card having a part close to the antenna coil of the module, to establish a coupling by induction between the two antenna coils.

Assignees

• Inside Secure

Inventors

• Boiron Ghislain
• Pic Pierre

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• Y10T29/49018

  with other electrical component · CPC title

• G06K19/07749 Primary

  the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card · CPC title

• G06K19/07754

  the connection being galvanic · CPC title

• Y10T29/49016

  Antenna or wave energy "plumbing" making · CPC title