Metal chip card body
US-2020065641-A1 · Feb 27, 2020 · US
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Hoffner Siegfried patents
Hoffner Siegfried is listed as an inventor on 9 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Hoffner Siegfried |
| Total patents | 9 |
| First publication | Oct 8, 2015 |
| Latest publication | Feb 27, 2020 |
Notable patents
Publications ranked by popularity score, then publication date.
Chip card and method of forming a chip card
US-10380477-B2 · Aug 13, 2019 · US
Chip card module, chip card, chip card arrangement, method of forming a chip card module, and method of forming a chip card
US-10282655-B2 · May 7, 2019 · US
Chip card module, chip card, chip card arrangement, method of forming a chip card module, and method of forming a chip card
US-2018032854-A1 · Feb 1, 2018 · US
Chip card substrate and method of forming a chip card substrate
US-2017246844-A1 · Aug 31, 2017 · US
Chip card and method of forming a chip card
US-2017206448-A1 · Jul 20, 2017 · US
Chip card substrate and method of forming a chip card substrate
US-9533473-B2 · Jan 3, 2017 · US
Chip card substrate and method of forming a chip card substrate
US-2015283794-A1 · Oct 8, 2015 · US
Chip card substrate and method of forming a chip card substrate
US-2015286921-A1 · Oct 8, 2015 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 9 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G06K19/07775 | 4 |
| H10W70/699 | 4 |
| B32B7/12 | 4 |
| B32B2425/00 | 4 |
| B32B27/36 | 4 |