Structural adhesive compositions

Patent metadata

Field	Value
Publication number	US-10377928-B2
Application number	US-201514964795-A
Country	US
Kind code	B2
Filing date	Dec 10, 2015
Priority date	Dec 10, 2015
Publication date	Aug 13, 2019
Grant date	Aug 13, 2019

Abstract

An adhesive composition comprising an epoxy compound and a compound comprising at least one aminimide functional group is disclosed. The compound comprising the at least one aminimide functional group is present in an amount from 2-8% by weight based on total weight of the adhesive composition and reacts with the epoxy compound upon activation by an external energy source. The adhesive composition also may comprise an amidine salt.

First claim

We claim:

1. An adhesive composition comprising:
an epoxy compound;
a polymeric compound comprising at least two aminimide functional groups, wherein the polymeric compound reacts with the epoxy compound upon activation by an external energy source; wherein the polymeric compound is present in an amount of 2-8% by weight based on total weight of the adhesive composition; and
a secondary latent catalyst; a reaction product of reactants comprising an amidine and a second component selected from the group consisting of a carbonic acid, a salt of a carbonic acid, a carbonate, or combinations thereof;
wherein the adhesive composition has less than a 100% increase in viscosity when stored at 25° C. for 90 days.

2. The adhesive composition of claim 1 , wherein the epoxy compound is present in an amount of 50% to 90% by weight based on total composition weight.

3. The adhesive composition of claim 1 , wherein the epoxy comprises an epoxy-capped polyester.

4. The adhesive composition of claim 1 , wherein the polymeric compound comprises a reaction product of reactants comprising a polyepoxide, a hydrazine comprising a trivalent nitrogen, and a reactant comprising a carbonyl group.

5. The adhesive composition of claim 1 , wherein the polymeric compound further comprises at least one additional functional group.

6. The adhesive composition of claim 1 , further comprising an amidine salt.

7. The adhesive composition of claim 1 , further comprising rubber particles having a core/shell structure.

8. The adhesive composition of claim 1 , wherein the external energy source comprises a temperature of at least 100° C.

9. A method for forming a bonded substrate comprising:
applying the adhesive composition of claim 1 to a first substrate;
contacting a second substrate to the adhesive composition such that the adhesive composition is located between the first substrate and the second substrate; and
curing the adhesive composition.

10. An adhesive comprising the composition of claim 1 in a cured state.

11. An adhesive composition comprising:
an epoxy compound;
a monomeric compound comprising at least one aminimide functional group, wherein the monomeric compound reacts with the epoxy compound upon activation by an external energy source; wherein the monomeric compound is present in an amount of 2-8% by weight based on total weight of the adhesive composition;
a secondary latent catalyst; and
a reaction product of reactants comprising an amidine and a second component selected from the group consisting of a carbonic acid, a salt of a carbonic acid, a carbonate, or combinations thereof;
wherein the adhesive composition has less than a 100% increase in viscosity when stored at 25° C. for 90 days.

12. The adhesive composition of claim 11 , wherein the epoxy compound is present in an amount of 50% to 90% by weight based on total composition weight.

13. The adhesive composition of claim 11 , wherein the epoxy contains an epoxy-capped polyester.

14. The adhesive composition of claim 11 , wherein the monomeric compound comprises a reaction product of reactants comprising a monoepoxide, a hydrazine comprising a trivalent nitrogen, and a reactant comprising a carbonyl group.

15. The adhesive composition of claim 11 , further comprising rubber particles having a core/shell structure.

16. The adhesive composition of claim 11 , wherein the external energy source comprises a temperature of at least 100° C.

17. A method for forming a bonded substrate comprising:
applying the adhesive composition of claim 11 to a first substrate;
contacting a second substrate to the adhesive composition such that the adhesive composition is located between the first substrate and the second substrate; and
curing the adhesive composition.

18. An adhesive comprising the composition of claim 11 in a cured state.

19. An adhesive composition comprising:
an epoxy compound;
an aminimide-containing compound present in an amount of 2% to 8% by weight based on total weight of the adhesive composition;
a reaction product of reactants comprising an amidine and a second component selected from the group consisting of a carbonic acid, a salt of a carbonic acid, a carbonate, or combinations thereof; and
a secondary latent catalyst;
wherein the epoxy, the aminimide-containing compound, and the reaction product react upon activation by an external energy source; and
wherein the adhesive composition has less than a 100% increase in viscosity when stored at 25° C. for 90 days.

20. The adhesive composition of claim 19 , wherein the aminimide is a reaction product of a polyepoxide, a hydrazine comprising a trivalent nitrogen, and a reactant comprising a carbonyl group.

21. The adhesive composition of claim 19 , wherein the aminimide is a reaction product of a monoepoxide, a hydrazine comprising a trivalent nitrogen, and a reactant comprising a carbonyl group.

22. The adhesive composition of claim 19 , further comprising rubber particles having a core/shell structure.

23. A method for forming a bonded substrate comprising:
applying the adhesive composition of claim 19 to a first substrate;
contacting a second substrate to the adhesive composition such that the adhesive composition is located between the first substrate and the second substrate; and
curing the adhesive composition.

24. An adhesive comprising the composition of claim 19 in a cured state.

Assignees

• Ppg Ind Ohio Inc

Inventors

• Chao Tien-Chieh
• Nakajima Masayuki
• Zhou Hongying
• Swarup Shanti
• Desai Umesh C

Classifications

• C08G59/4042

  Imines; Imides · CPC title

• C08G59/1477

  containing nitrogen · CPC title

• C08G59/44

  Amides · CPC title

• C08G59/1455

  Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof · CPC title

• C09J163/00 Primary

  Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins · CPC title