Tin-antimony-based high temperature solder for downhole components

Patent metadata

Field	Value
Publication number	US-10376995-B2
Application number	US-201415104179-A
Country	US
Kind code	B2
Filing date	Dec 12, 2014
Priority date	Dec 13, 2013
Publication date	Aug 13, 2019
Grant date	Aug 13, 2019

Abstract

A downhole tool conveyable within a wellbore extending into a subterranean formation, wherein the downhole tool comprises a first component, a second component, and a solder electrically and mechanically coupling the first and second components, wherein the solder comprises or consists of: from 9.6 to 10.2 weight % of antimony; from 0.01 to 0.25 weight % of manganese; and tin.

First claim

What is claimed is:

1. An apparatus, comprising:
a downhole tool conveyable within a wellbore extending into a subterranean formation, wherein the downhole tool comprises:
a first component;
a second component; and
a solder electrically and mechanically coupling the first and second components, wherein the solder consists essentially of: antimony, manganese, and tin.

2. The apparatus of claim 1 wherein the solder consists essentially of:
from about 9.2 to about 10.8 percent, based on total weight of the solder, of antimony;
from about 0.01 to about 0.25 percent, based on total weight of the solder, of manganese; and tin.

3. The apparatus of claim 1 wherein the solder consists essentially of:
from about 9.6 to about 10.2 percent, based on total weight of the solder, of antimony;
from about 0.01 to about 0.25 percent, based on total weight of the solder, of manganese; and tin.

4. The apparatus of claim 1 wherein the solder consists essentially of:
from about 9 to about 11 percent, based on total weight of the solder, of antimony;
from about 0.1 to about 0.25 percent, based on total weight of the solder, of manganese; and tin.

5. The apparatus of claim 1 wherein the solder consists of:
from about 9.6 to about 10.2 percent, based on total weight of the solder, of antimony;
from about 0.1 to about 0.25 percent, based on total weight of the solder, of manganese; and tin.

6. The apparatus claim 1 wherein the downhole tool is or comprises at least one of: an acoustic tool; a conveyance tool; a density tool; a directional drilling tool; a downhole fluid analysis (DFA) tool; a drilling tool; an electromagnetic (EM) tool; a fishing tool; a formation evaluation tool; a gravity tool; an intervention tool; a logging while drilling (LWD) tool; a magnetic resonance tool; a measurement while drilling (MWD) tool; a monitoring tool; a mud logging tool; a neutron tool; a nuclear tool; a perforating tool; a photoelectric factor tool; a porosity tool; a reservoir characterization tool; a reservoir fluid sampling tool; a reservoir pressure tool; a reservoir solid sampling tool; a resistivity tool; a sand control tool; a seismic tool; a stimulation tool; a surveying tool; a telemetry tool; and/or a tough logging condition (TLC) tool.

7. The apparatus of claim 1 , wherein the downhole tool is conveyable within the wellbore by at least one of: coiled tubing; drill pipe; slickline; wired drill pipe (WDP); and/or wireline.

8. The apparatus of claim 1 , wherein the downhole tool is or comprises at least one of:
a cased-hole tool; and/or
an open-hole tool.

9. The apparatus of claim 1 , wherein the solder consists essentially of:
from about 5 to about 9.6 percent, based on total weight of the solder, of antimony;
from about 0.01 to about 0.25 percent, based on total weight of the solder, of manganese; and tin.

10. The apparatus of claim 9 , wherein the solder consists of:
from about 5 to about 9.6 percent, based on total weight of the solder, of antimony;
from about 0.01 to about 0.25 percent, based on total weight of the solder, of manganese; and tin.

11. The apparatus of claim 1 , wherein the solder has a melting point of from about 240° C. to about 250° C.

12. The apparatus of claim 1 , wherein the solder has a melting point of at least about 242° C.

13. An apparatus, comprising:
a downhole tool conveyable within a wellbore extending into a subterranean formation, wherein the downhole tool comprises:
a first component;
a second component; and
a solder electrically and mechanically coupling the first and second components, wherein the solder consists of:
from about 9 to about 11 percent, based on total weight of the solder, of antimony;
from about 0.01 to about 0.25 percent, based on total weight of the solder, of manganese; and tin.

14. The apparatus of claim 13 wherein the solder consists of:
from about 9.2 to about 10.8 percent, based on total weight of the solder, of antimony;
from about 0.01 to about 0.25 percent, based on total weight of the solder, of manganese; and tin.

15. The apparatus of claim 13 wherein the solder consists of:
from about 9.6 to about 10.2 percent, based on total weight of the solder, of antimony;
from about 0.01 to about 0.25 percent, based on total weight of the solder, of manganese; and tin.

16. The apparatus of claim 13 , wherein the solder has a melting point of from about 240° C. to about 250° C.

17. The apparatus of claim 13 , wherein the solder has a melting point of at least about 242° C.

Assignees

• Schlumberger Technology Corp

Inventors

• Dupouy Francis
• Kostinovsky Mark
• Kleitz Suriyakan Vongtragool
• Patel Chandradip Pravinbhai

Classifications

• B23K35/0244

  Powders, particles or spheres; Preforms made therefrom · CPC title

• E21B47/00

  Survey of boreholes or wells (monitoring pressure or flow of drilling fluid E21B21/08) · CPC title

• B23K35/0222

  for use in soldering or brazing (B23K35/0205 takes precedence) · CPC title

• C22C13/02

  with antimony or bismuth as the next major constituent · CPC title

• B23K2101/002

  Drill-bits · CPC title