Additive manufacturing process of 3D electronic substrate
US-12226822-B2 · Feb 18, 2025 · US
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Kostinovsky Mark patents
Kostinovsky Mark is listed as an inventor on 6 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Kostinovsky Mark |
| Total patents | 6 |
| First publication | Oct 27, 2016 |
| Latest publication | Feb 18, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Additive manufactured 3d electronic substrate
US-2023381863-A1 · Nov 30, 2023 · US
Additive manufactured 3D electronic substrate
US-11765839-B2 · Sep 19, 2023 · US
Additive manufactured 3d electronic substrate
US-2020120813-A1 · Apr 16, 2020 · US
Tin-antimony-based high temperature solder for downhole components
US-10376995-B2 · Aug 13, 2019 · US
Tin-Antimony-Based High Temperature Solder for Downhole Components
US-2016311065-A1 · Oct 27, 2016 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Schlumberger Technology Corp | 6 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H05K3/4664 | 4 |
| H05K3/1241 | 4 |
| H05K1/0284 | 4 |
| H05K3/1283 | 2 |
| H05K3/341 | 2 |