Cut-and-clinch apparatus and board work machine

US10375869B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10375869-B2
Application numberUS-201415129355-A
CountryUS
Kind codeB2
Filing dateMar 28, 2014
Priority dateMar 28, 2014
Publication dateAug 6, 2019
Grant dateAug 6, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A cut-and-clinch apparatus that cuts and bends protruding parts of two lead wires of a lead component to be respectively inserted through two of a plurality of through-holes formed in a circuit board, the cut-and-clinch apparatus includes a pair of movable elements that are used in a case where the respective protruding parts of the two lead wires are cut and bent and that are made to approach each other and separate from each other, and a movable element position control section that controls the positions of the pair of movable elements, on the basis of image data obtained by the pair of movable elements being imaged.

First claim

Opening claim text (preview).

The invention claimed is: 1. A cut-and-clinch apparatus that cuts and bends protruding parts of two lead wires of a lead component to be respectively inserted through two of a plurality of through-holes formed in a circuit board, the cut-and-clinch apparatus comprising: a pair of movable elements that approach and separate from each other and the respective protruding parts of the two lead wires are cut and bent by the pair of movable elements; and a movable element position control section that controls the positions of the pair of movable elements on the basis of image data obtained by imaging the pair of movable elements. 2. The cut-and-clinch apparatus according to claim 1 , further comprising: (a) a cut-and-clinch unit including the pair of movable elements; and (b) a unit horizontal movement device that horizontally moves cut-and-clinch unit, wherein the movable element position control section includes (i) a central point deviation amount acquisition section that acquires a central point deviation amount that is a deviation amount between a target central point and an actual central point of the pair of movable elements acquired on the basis of the image data, and (ii) a horizontal movement control section that controls the unit horizontal movement device on the basis of the central point deviation amount acquired by the central point deviation amount acquisition section, to bring the actual central point of the pair of movable elements close to the target central point. 3. The cut-and-clinch apparatus according to claim 1 , wherein the pair of movable elements are made to approach each other and separate from each other by one driving source. 4. The cut-and-clinch apparatus according to claim 1 , further comprising: (a) a cut-and-clinch unit including the pair of movable elements; and (b) a unit rotation device that rotates the cut-and-clinch unit around a plumb line, wherein the movable element position control section includes (i) an axis deviation angle acquisition section that acquires an axis deviation angle that is an angle deviation between a target axis, and an axis that is acquired on the basis of the image data and actually passes through the pair of movable elements, and (ii) a rotation control section that controls the unit rotation device on the basis of the axis deviation angle acquired by the axis deviation angle acquisition section to bring the axis that actually passes through the pair of movable elements close to a posture parallel to the target axis. 5. The cut-and-clinch apparatus according to claim 1 , wherein the movable element position control section includes (i) an actual position acquisition section that acquires respective actual positions of the pair of movable elements on the basis of the image data, and (ii) a position correcting section that corrects the positions of the pair of movable elements on the basis of one or more of (x) a central point deviation amount that is a deviation amount between a target central point and an actual central point of the pair of movable element, (y) an axis deviation angle that is an angle deviation between a target axis and an axis that actually passes through the pair of movable elements, and (z) a pitch deviation amount that is a deviation amount between a target pitch and an actual pitch of the pair of movable elements, the central point deviation amount, the axis deviation angle, and the pitch deviation amount being acquired on the basis of the respective actual positions of the pair of movable elements acquired by the actual position acquisition section. 6. A board work machine including a pair of movable elements that are made to approach each other and separate from each other on the same straight line by one driving source, the board work machine comprising: an imaging device that images each of the pair of movable elements; an actual central point acquisition section that acquires an actual central point of the pair of movable elements on the basis of image data of the pair of movable elements imaged by the imaging device; and a movable element position control section that controls the positions of the pair of movable elements, on the basis of a central point deviation amount that is a deviation amount of the actual central point, which is acquired by the actual central point acquisition section, from the target central point.

Assignees

Inventors

Classifications

  • Mechanical treatments, e.g. punching, cutting, deforming or cold welding · CPC title

  • Crimping apparatus or processes (H01R43/042 takes precedence) · CPC title

  • to trim electric component · CPC title

  • to sever electric terminal from supply strip · CPC title

  • to sever product to length · CPC title

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Frequently asked questions

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What does patent US10375869B2 cover?
A cut-and-clinch apparatus that cuts and bends protruding parts of two lead wires of a lead component to be respectively inserted through two of a plurality of through-holes formed in a circuit board, the cut-and-clinch apparatus includes a pair of movable elements that are used in a case where the respective protruding parts of the two lead wires are cut and bent and that are made to approach …
Who is the assignee on this patent?
Fuji Corp
What technology area does this patent fall under?
Primary CPC classification H05K13/0473. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Aug 06 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).