Method and apparatus for correction of pressure sensors

Patent metadata

Field	Value
Publication number	US-10371591-B2
Application number	US-201615349479-A
Country	US
Kind code	B2
Filing date	Nov 11, 2016
Priority date	Nov 11, 2016
Publication date	Aug 6, 2019
Grant date	Aug 6, 2019

Abstract

A differential pressure sensor includes one or more semiconductor dies which are thinned at portions of the die to create a chamber defining a sensitive diaphragm, having piezoresistive elements defined at a surface of the diaphragm. A first diaphragm is in fluid communication with a first fluid on an upper surface of the first diaphragm and is in fluid communication with a second fluid on a lower surface of the first diaphragm. A second diaphragm is in fluid communication with ambient pressure at an upper and a lower surface of the second diaphragm. The piezoresistive elements corresponding to the second diaphragm are electrically connected to the piezoresistive elements of the first diaphragm so as to compensate the output of the second diaphragm with respect to the output of the first diaphragm.

First claim

What is claimed is:

1. A pressure sensor comprising:
a first pressure sensing die comprising a semiconductor material and having a first sensitive diaphragm;
a second pressure sensing die comprising a semiconductor material and having a second sensitive diaphragm; and
a housing containing the first pressure sensing die and the second pressure sensing die, the housing containing a first fluid at a first pressure in fluid communication with a first surface of the first sensitive diaphragm of the first pressure sensing die, and a second fluid at a second pressure in fluid communication with a second surface of the first sensitive diaphragm of the first pressure sensing die, and wherein a first and second surface of the second sensitive diaphragm of the second pressure sensing die are in fluid communication with a third fluid at a third pressure.

2. The pressure sensor of claim 1 , further comprising a base, wherein the first pressure sensing die is attached to a first surface of the base, the first sensitive diaphragm of the first pressure sensing die being aligned with an aperture extending through the base from the first surface of the base to the second surface of the base opposite the first surface, the second pressure sensing die attached to the first surface of the base such that a ventilation channel is defined for an inner volume of the second pressure sensing die between the second pressure sensing die and the base.

3. The pressure sensor of claim 2 , wherein said housing comprises:
an upper housing member attached to the first surface of the base, the upper housing member defining a first septum between the first pressure sensing die and the second pressure sensing die defining a first isolated volume containing the first pressure sensing die and a second isolated volume containing the second pressure sensing die, said second isolated volume configured to be at the third pressure.

4. The pressure sensor of claim 3 , wherein the upper housing member comprises a first input port in fluid communication with the first isolated volume containing the first pressure sensing die and the first sensitive diaphragm of the first pressure sensing die.

5. The pressure sensor of claim 4 , the housing further comprising a lower housing member attached to the second surface of the base opposite the first surface of the base, the lower housing member having a second input port in fluid communication with the second surface of the first sensitive diaphragm of the first pressure sensing die.

6. The pressure sensor of claim 5 , wherein the first fluid at the first pressure when introduced to the first input port applies the first pressure to the first surface of the first sensitive diaphragm of the first pressure sensing die and the second fluid at the second pressure when introduced to the second input port applied the second pressure to the second surface of the first sensitive diaphragm of the first pressure sensing die, thereby producing a differential pressure applied to the first sensitive diaphragm of the first pressure sensing die.

7. The pressure sensor of claim 1 , wherein the first sensitive diaphragm of the first pressure sensing die comprises a plurality of piezoresistors defined in the first surface of the first sensitive diaphragm of the first pressure sensing die arranged in a first bridge circuit and the second sensitive diaphragm of the second pressure sensing die comprises a second plurality of piezoresistors defined in the first surface of the second sensitive diaphragm of the second pressure sensing die arranged in a second bridge circuit, wherein the first bridge circuit and the second bridge circuit are connected such that an output signal of the second bridge circuit is subtracted from an output signal of the first bridge circuit.

8. The pressure sensor of claim 7 , wherein the output signal of the second bridge circuit is representative of an error due to non-pressure related factors, and a result of subtraction of the output signal of the second bridge circuit from the output signal of the first bridge circuit is representative of a corrected output signal of the pressure sensor.

9. The pressure sensor of claim 1 , further comprising
a base,
wherein the first pressure sensing die attached to a first surface of the base, the first sensitive diaphragm of the first pressure sensing die being aligned with an aperture extending through the base from the first surface of the base to a second surface of the base opposite the first surface, the second pressure sensing die attached to the first surface of the base, the second sensitive diaphragm of the second pressure sensing die being aligned with a second aperture extending through the base from the first surface to the second surface opposite the first surface.

10. The pressure sensor of claim 9 , further comprising:
a first upper housing member comprising a first pressure inlet in fluid communication with a first surface of the first sensitive diaphragm of the first pressure sensing die; and
an opening configured to allow fluid communication between the third pressure and a first surface of the second sensitive diaphragm of the second pressure sensing die.

11. The pressure sensor of claim 10 , further comprising:
a second lower housing member comprising a second pressure inlet in fluid communication with a second surface of the first sensitive diaphragm of the first pressure sensing die, a second septum for separating the first sensitive diaphragm of the first pressure sensing die from the second sensitive diaphragm of the second pressure sensing die, and an opening configured to allow fluid communication between the third pressure and a second surface of the second sensitive diaphragm of the second pressure sensing die.

12. A differential pressure sensor comprising:
a sensor housing including a base plate having an aperture defined therein, wherein a first side of the base plate is configured to be in fluid communication with a first fluid at a first pressure at the aperture and a second side of the base plate is configured to be in fluid communication with a second fluid at a second pressure at the aperture;
a pressure sensing die assembly attached to the first side of said base plate, the pressure sensing die assembly comprising:
a pressure sensing die attached to the base plate, the pressure sensing die comprising:
a first chamber defining a first diaphragm having a first upper side configured to be in fluid communication with said first fluid and a lower side configured to be in fluid communication with the aperture and the second fluid;
at least one pressure sensitive electrical element formed in or on the first diaphragm, the at least one pressure sensitive electrical element exhibiting varying resistance responsive to deflection of the first diaphragm representative of a differential pressure between the first pressure and the second pressure;
a second chamber defining a second diaphragm including a second upper side configured to be in fluid communication with an ambient pressure and a second lower side configured to be in fluid communication with the ambient pressure;
at least one pressure sensitive electrical element formed in or on the second diaphragm, the at least one pressure sensitive electrical element exhibiting varying resistance responsive to deflection of said second diaphragm representative of a common mode error corresponding to the pressure sensing die assembly; and

one or more electrical conductors electrically connected to one or both of the at least one pressure sensitive electrical element bonded to the first diaphragm and the at least one pressure sensitive electrical element bonded to

Assignees

• Measurement Spec Inc

Inventors

• Wagner David E
• Kachenko Natasha V
• Hoffman James H

Classifications

• G01L13/026 Primary

  involving double diaphragm · CPC title

• G01L19/04

  Means for compensating for effects of changes of temperature {, i.e. other than electric compensation} · CPC title

• G01L19/147

  Details about the mounting of the sensor to support or covering means · CPC title

• G01L13/025 Primary

  using diaphragms · CPC title

• G01L15/00

  Devices or apparatus for measuring two or more fluid pressure values simultaneously · CPC title