Coplanar process fluid pressure sensor module

US9752945B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9752945-B2
Application numberUS-201414282367-A
CountryUS
Kind codeB2
Filing dateMay 20, 2014
Priority dateOct 31, 2011
Publication dateSep 5, 2017
Grant dateSep 5, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A coplanar process fluid pressure sensor module is provided. The module includes a coplanar base and a housing body. The coplanar base has a pair of process fluid pressure inlets, each having an isolator diaphragm. The housing body is coupled to the coplanar base at an interface between the coplanar base and the housing body. A differential pressure sensor is operably coupled to the pair of process fluid pressure inlets, and is disposed proximate the coplanar base within the housing body.

First claim

Opening claim text (preview).

What is claimed is: 1. A coplanar process fluid pressure sensor module, the module comprising: a rectangular coplanar base having a pair of process fluid pressure inlets, each having an isolator diaphragm adjacent an outer face, the coplanar base having a flat surface opposite the inlets which includes a recess formed therein; a housing body coupled to the coplanar base at an interface between the coplanar base and the housing body, the interface arranged on the coplanar base opposite the outer face; a differential pressure sensor operably coupled to the pair of process fluid pressure inlets, and being disposed adjacent the coplanar base within the housing body and positioned at least partially in the recess; and a stiffener plate having an aperture through which the housing body passes, the stiffener plate configured to clamp the housing body between itself and the coplanar base. 2. The coplanar process fluid pressure sensor module of claim 1 , wherein the coplanar base is formed of a first metal and the housing body is formed of a material different than the first metal. 3. The coplanar process fluid pressure sensor module of claim 2 , wherein the housing body is formed of a different grade of material than the first metal. 4. The coplanar process fluid pressure sensor module of claim 3 , wherein the first metal is stainless steel. 5. The coplanar process fluid pressure sensor module of claim 4 , wherein the coplanar base and the housing body are coupled at the interface by a weld. 6. The coplanar process fluid pressure sensor module of claim 2 , wherein the housing body is formed of a different metal than the first metal. 7. The coplanar process fluid pressure sensor module of claim 6 , wherein the different material is aluminum. 8. The coplanar process fluid pressure sensor module of claim 6 , wherein the coplanar base is coupled to the housing body at the interface via a shrink fit. 9. The coplanar process fluid pressure sensor module of claim 6 , wherein the coplanar base is coupled to the housing body at the interface by swaging. 10. The coplanar process fluid pressure sensor module of claim 2 , wherein the coplanar base is formed using metal injection molding. 11. The coplanar process fluid pressure sensor module of claim 2 , wherein the housing body is formed from casting. 12. The coplanar process fluid pressure sensor module of claim 2 , wherein the housing body is forged. 13. The coplanar process fluid pressure sensor module of claim 2 , wherein the housing body is drawn. 14. The coplanar process fluid pressure sensor module of claim 2 , wherein the housing body is screw machined. 15. The coplanar process fluid pressure sensor module of claim 2 , wherein the housing body is formed from pipe stock. 16. The coplanar process fluid pressure sensor module of claim 2 , wherein the differential pressure sensor is coupled directly to a circuit board disposed in an electronics housing separate from the housing body. 17. The coplanar process fluid pressure sensor module of claim 2 , and further comprising a temperature sensor disposed within the housing body. 18. The coplanar process fluid pressure sensor module of claim 1 , wherein the housing body includes a lip having a diameter greater than the aperture. 19. The coplanar process fluid pressure sensor module of claim 1 , wherein the housing body includes an o-ring surface to maintain an o-ring therein. 20. A coplanar process fluid pressure sensor module, the module comprising: a rectangular steel coplanar base having a pair of process fluid pressure inlets, each having an isolator diaphragm adjacent an outer surface, the coplanar base having a flat surface opposite the inlets which includes a recess formed therein; a cylindrical housing body coupled to the coplanar base at an interface between the steel coplanar base and the housing body, the cylindrical housing body having an externally threaded portion, the interface arranged on the steel coplanar base opposite the outer surface; a differential pressure sensor operably coupled to the pair of process fluid pressure inlets, and being disposed proximate the coplanar base within the housing body and positioned at least partially in the recess; and a stiffener plate having an aperture through which the housing body passes, the stiffener plate configured to clamp the housing body between itself and the coplanar base.

Assignees

Inventors

Classifications

  • Multiple part housings · CPC title

  • G01L13/026Primary

    involving double diaphragm · CPC title

  • using diaphragms · CPC title

  • being part of the housing (other details about the housing G01L19/14) · CPC title

  • Constructional details of non-semiconductive diaphragms · CPC title

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What does patent US9752945B2 cover?
A coplanar process fluid pressure sensor module is provided. The module includes a coplanar base and a housing body. The coplanar base has a pair of process fluid pressure inlets, each having an isolator diaphragm. The housing body is coupled to the coplanar base at an interface between the coplanar base and the housing body. A differential pressure sensor is operably coupled to the pair of pro…
Who is the assignee on this patent?
Rosemount Inc
What technology area does this patent fall under?
Primary CPC classification G01L13/026. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Sep 05 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).