Optical systems fabricated by printing-based assembly

Patent metadata

Field	Value
Publication number	US-10361180-B2
Application number	US-201715402718-A
Country	US
Kind code	B2
Filing date	Jan 10, 2017
Priority date	Jan 17, 2007
Publication date	Jul 23, 2019
Grant date	Jul 23, 2019

Abstract

Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities. Optical systems of the present invention include devices and device arrays exhibiting a range of useful physical and mechanical properties including flexibility, shapeability, conformability and stretchablity.

First claim

We claim:

1. A light-emitting system, comprising:
a transparent substrate having a receiving surface with an area between 0.05 m 2 and 10 m 2 ;
a plurality of contact printed crystalline semiconductor elements;
wherein the semiconductor elements are provided on the receiving surface of the substrate with a density equal to or greater than 5 elements per millimeter; and
wherein the optical system has an optical transparency of 50% or greater at a selected wavelength and each of the semiconductor elements has at least a length or width physical dimension less than or equal to 200 microns.

2. The light emitting system of claim 1 , wherein the positions of the semiconductor elements are longitudinally aligned to each other and parallel to within 3 degrees.

3. The light emitting system of claim 1 , wherein the light-emitting system is a display.

4. The light emitting system of claim 1 , wherein each of the semiconductor elements is a light-emitting diode (LED), or a laser.

5. The light emitting system of claim 1 , wherein the semiconductor elements cover less than or equal to 10% of the receiving surface of the transparent substrate.

6. The light emitting system of claim 1 , wherein the semiconductor elements cover less than or equal to 1% of the receiving surface of the transparent substrate.

7. The light emitting system of claim 1 , wherein the semiconductor elements cover less than or equal to 0.1% of the receiving surface of the transparent substrate.

8. The light emitting system of claim 1 , further comprising:
a first and second electrodes provided on the receiving surface, wherein the semiconductor elements are in electrical contact with at least one of the first and second electrodes, and wherein the semiconductor elements provide a fill factor between the first and second electrodes less than or equal to 10%.

9. The light emitting system of claim 1 , further comprising one or more electrical interconnects, electrodes, insulators or electro-optical elements connected to at least one of the semiconductor elements.

10. The light emitting system of claim 1 , further comprising one or more optical components, dielectric structures, conductive structures, adhesive layers or structures, connecting structures, encapsulating structures, planarizing structures, electro-optic elements, or thin film structures or arrays of one or more optical components, dielectric structures, conductive structures, adhesive layers or structures, connecting structures, encapsulating structures, planarizing structures, electro-optic elements, or thin film structures.

11. The light emitting system of claim 1 , wherein the transparent substrate is a flexible substrate.

12. The light emitting system of claim 1 , wherein the semiconductor elements have a density of less than 50 elements per millimeter.

Assignees

• Univ Illinois
• Semprius Inc
• X Celeprint Ltd

Inventors

• Rogers John
• Nuzzo Ralph
• Meitl Matthew
• Menard Etienne
• Baca Alfred
• Motala Michael
• Ahn Jong-Hyun
• Park Sang-Il
• Yu Chang-Jae
• Ko Heung Cho
• Stoykovich Mark
• Yoon Jongseung

Classifications

• H10P95/00

  Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W72/00

  Interconnections or connectors in packages · CPC title

• H10W72/07307

  the auxiliary member being a temporary substrate, e.g. a removable substrate · CPC title

• H10W72/0711

  Apparatus therefor · CPC title