Composition for forming conductive pattern and resin structure having conductive pattern

Patent metadata

Field	Value
Publication number	US-10354774-B2
Application number	US-201515317023-A
Country	US
Kind code	B2
Filing date	Aug 3, 2015
Priority date	Aug 4, 2014
Publication date	Jul 16, 2019
Grant date	Jul 16, 2019

Abstract

The present invention relates to a composition for forming a conductive pattern that enables forming conductive micropatterns on various polymer resin products or resin layers by a simplified process without deformation of the polymer resin products or resin layers, and enables effectively satisfying requirements of the art, and a resin structure having a conductive pattern.

First claim

The invention claimed is:

1. A composition for forming a conductive pattern by electromagnetic wave irradiation, comprising:
polymer resin; and
a non-conductive metal compound comprising a compound represented by Chemical Formula 1,
wherein metal nuclei can be formed form the non-conductive metal compound by the electromagnetic wave irradiation:
Cu 3-x M x P 2 O 8   [Chemical Formula 1]

wherein, in Chemical Formula 1,
M is one or more metal selected form the group consisting of Ti, V, Cr, Mn, Fe, Co, Ni, Y, Zn, Nb, Mo, Tc, Pd, Ag, Ta, W, Pt and Au, and x is a rational number of more than 0 and less than 3.

2. The composition for forming a conductive pattern by electromagnetic wave irradiation according to claim 1 , wherein the non-conductive metal compound has a triclinic structure, and belongs to a P 1 space group.

3. The composition for forming a conductive pattern by electromagnetic wave irradiation according to claim 1 , wherein the non-conductive metal compound has a three dimensional structure in which square planar CuO 4 or MO 4 ; a trigonal bipyramid of CuO 5 or MO 5 ; and a tetrahedron of PO 4 are three-dimensionally connected while sharing oxygen.

4. The composition for forming a conductive pattern by electromagnetic wave irradiation according to claim 1 , wherein the polymer resin includes thermosetting resin.

5. The composition for forming a conductive pattern by electromagnetic wave irradiation according to claim 4 , wherein the polymer resin includes one or more selected from the group consisting of ABS resin, polyalkylene terephthalate resin, polycarbonate resin, polypropylene resin and polyphthalamide resin.

6. The composition for forming a conductive pattern by electromagnetic wave irradiation according to claim 1 , wherein the non-conductive metal compound is included in the content of 0.1 to 15 wt %, based on the total composition.

7. The composition for forming a conductive pattern by electromagnetic wave irradiation according to claim 1 , further comprising one or more additives selected from the group consisting of a flame retardant, a heat stabilizer, a UV stabilizer, a lubricant, an antioxidant, an inorganic filler, a color additive, an impact modifier and a functional reinforcing agent.

8. The composition for forming a conductive pattern by electromagnetic wave irradiation according to claim 1 , wherein the polymer resin includes thermoplastic resin.

9. A resin structure having a conductive pattern comprising:
a polymer resin substrate;
a non-conductive metal compound dispersed in the polymer resin substrate, and comprising a compound represented by Chemical Formula 1;
an adhesion active surface comprising metal nuclei exposed to a predetermined region of a surface of the polymer resin substrate; and
a conductive metal layer formed on the adhesion active surface that forms the conductive pattern:
Cu 3-x M x P 2 O 8   [Chemical Formula 1]

wherein, in Chemical Formula 1,
M is one or more metal selected form the group consisting of Ti, V, Cr, Mn, Fe, Co, Ni, Y, Zn, Nb, Mo, Tc, Pd, Ag, Ta, W, Pt and Au, and x is a rational number of more than 0 and less than 3.

10. The resin structure having a conductive pattern according to claim 9 , wherein the predetermined region on which the adhesion active surface and the conductive metal layer are formed corresponds to a region of the polymer resin substrate to which electromagnetic wave is irradiated.

Assignees

• Lg Chemical Ltd

Inventors

• Jeong Han Nah
• Lee Ha Na
• Park Cheol-Hee
• Park Chee-Sung
• Kim Jae Hyun
• Jun Shin Hee
• Lee Ryul
• Kim Min Ji

Classifications

• Y10T428/24917

  including metal layer · CPC title

• Y10T428/24909

  Free metal or mineral containing · CPC title

• Y10T428/24851

  Intermediate layer is discontinuous or differential · CPC title

• Y10T428/24802

  Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] · CPC title

• H01B1/22 Primary

  the conductive material comprising metals or alloys · CPC title