Composition for forming conductive pattern and resin structure having conductive pattern

Patent metadata

Field	Value
Publication number	US-10065860-B2
Application number	US-201515505535-A
Country	US
Kind code	B2
Filing date	Sep 17, 2015
Priority date	Sep 17, 2014
Publication date	Sep 4, 2018
Grant date	Sep 4, 2018

Abstract

The present invention relates to a composition for forming conductive patterns and a resin structure having a conductive pattern, capable of forming a conductive micropattern on various polymer resin products or resin layers using a simplified process and exhibiting excellent heat dissipation characteristics. The composition for forming conductive patterns comprises: a polymer resin; a non-conductive metal compound represented by a specific chemical formula; and a heat-dissipating material, wherein a metal nucleus is formed from the non-conductive metal compound by the irradiation of electromagnetic waves.

First claim

What is claimed is:

1. A composition for forming a conductive pattern by irradiation of electromagnetic waves, comprising:
a polymer resin;
a non-conductive metal compound including at least one phosphate selected from the group consisting of phosphates represented by Chemical Formulas 1 to 4 below; and
a carbide, a carbon-based material, a nitride-based material, a metal oxide, or a mixture thereof as a heat-dissipating material,
wherein a metal nucleus is formed from the non-conductive metal compound by the irradiation of the electromagnetic waves:
A x B 2 P 3 O 12   [Chemical Formula 1]

Cu 3-y M 1 y P 2 O 8   [Chemical Formula 2]

Cu 2-z M 2 z P 2 O 7   [Chemical Formula 3]

Cu 4 P 2 O 9   [Chemical Formula 4]

in Chemical Formula 1, x is a rational number from 0.5 to 1, A is at least one metal selected from the group consisting of Li, Na, Cu, Ag and Au, and B is at least one metal selected from the group consisting of Sn, Ti, Zn and Hf,
in Chemical Formula 2, y is a rational number from 0 to less than 3, M 1 is at least one metal selected from the group consisting of Ti, V, Cr, Mn, Fe, Co, Ni, Y, Zn, Nb, Mo, Tc, Pd, Ag, Ta, W, Pt and Au, and
in Chemical Formula 3, z is a rational number from 0 to less than 2, M 2 is at least one metal selected from the group consisting of Zn, Mg, Ca, Sr and Ba.

2. The composition for forming a conductive pattern by irradiation of electromagnetic waves of claim 1 , wherein:
the phosphate represented by Chemical Formula 1 has a trigonal structure of R 3 c space group.

3. The composition for forming a conductive pattern by irradiation of electromagnetic waves of claim 1 , wherein:
the phosphate represented by Chemical Formula 1 has a triclinic structure of P 1 space group or a monoclinic structure of Cc or C2/c space group.

4. The composition for forming a conductive pattern by irradiation of electromagnetic waves of claim 1 , wherein:
the phosphate represented by Chemical Formula 2 has a triclinic structure of P 1 space group.

5. The composition for forming a conductive pattern by irradiation of electromagnetic waves of claim 1 , wherein:
the phosphate represented by Chemical Formula 3 includes a structure in which Cu or M 2 is surrounded by five oxygen atoms in a distorted square pyramid form; or a structure in which Cu or M is surrounded by six oxygen atoms in a distorted octahedron form.

6. The composition for forming a conductive pattern by irradiation of electromagnetic waves of claim 1 , wherein:
the phosphate represented by Chemical Formula 4 has a triclinic structure of P 1 space group or an orthorhombic structure of Pnma space group.

7. The composition for forming a conductive pattern by irradiation of electromagnetic waves of claim 1 , wherein:
the non-conductive metal compound has an average particle size of 0.1 to 6 μm.

8. The composition for forming a conductive pattern by irradiation of electromagnetic waves of claim 1 , wherein:
the heat-dissipating material includes silicon carbide as the carbide; carbon black, carbon nanotube, graphite, graphene, or a mixture thereof as the carbon-based material; boron nitride, silicon nitride, aluminum nitride or a mixture thereof as the nitride-based material; or magnesium oxide, aluminum oxide, beryllium oxide, zinc oxide, or a mixture thereof as the metal oxide.

9. The composition for forming a conductive pattern by irradiation of electromagnetic waves of claim 1 , wherein:
the polymer resin includes a thermosetting resin or a thermoplastic resin.

10. The composition for forming a conductive pattern by irradiation of electromagnetic waves of claim 1 , wherein:
the polymer resin includes at least one selected from the group consisting of an acrylonitrile poly-butadiene styrene (ABS) resin, a polyalkylene terephthalate resin, a polyamide resin, a polyphenylether resin, a polyphenylene sulfide resin, a polycarbonate resin, a polypropylene resin, and a polyphthalamide resin.

11. The composition for forming a conductive pattern by irradiation of electromagnetic waves of claim 1 , wherein:
the non-conductive metal compound has a content of 0.1 to 10 wt % based on the total composition, the heat-dissipating material has a content of 1 to 50 wt % based on the total composition, and the polymer resin has a residual content.

12. The composition for forming a conductive pattern by irradiation of electromagnetic waves of claim 1 , further comprising:
at least one additive selected from the group consisting of a flame retardant, a heat stabilizer, a ultraviolet (UV) stabilizer, a lubricant, an anti-oxidant, an inorganic filler, a color additive, an impact-reinforcing agent, and a functional reinforcing agent.

13. A resin structure having a conductive pattern comprising:
a polymer resin substrate;
a non-conductive metal compound including at least one phosphate selected from the group consisting of phosphates represented by Chemical Formulas 1 to 4 below dispersed in the polymer resin substrate;
a carbide, a carbon-based material, a nitride-based material, a metal oxide or a mixture thereof as a heat-dissipating material dispersed in the polymer resin substrate;
an adhesion-activated surface including a metal nucleus exposed on a surface of a predetermined region of the polymer resin substrate; and
a conductive metal layer formed on the adhesion-activated surface:
A x B 2 P 3 O 12   [Chemical Formula 1]

Cu 3-y M 1 y P 2 O 8   [Chemical Formula 2]

Cu 2-z M 2 z P 2 O 7   [Chemical Formula 3]

Cu 4 P 2 O 9   [Chemical Formula 4]

in Chemical Formula 1, x is a rational number from 0.5 to 1, A is at least one metal selected from the group consisting of Li, Na, Cu, Ag and Au, and B is at least one metal selected from the group consisting of Sn, Ti, Zn and Hf,
in Chemical Formula 2, y is a rational number from 0 to less than 3, M 1 is at least one metal selected from the group consisting of Ti, V, Cr, Mn, Fe, Co, Ni, Y, Zn, Nb, Mo, Tc, Pd, Ag, Ta, W, Pt and Au, and
in Chemical Formula 3, z is a rational number from 0 to less than 2, M 2 is at least one metal selected from the group consisting of Zn, Mg, Ca, Sr and Ba.

14. The resin structure having a conductive pattern of claim 13 , wherein:
the predetermined region in which the adhesion-activated surface and the conductive metal layer are formed corresponds to a region irradiated with electromagnetic waves on the polymer resin substrate.

Assignees

• Lg Chemical Ltd

Inventors

• Choi Kwon Il
• Ham Myong Jo
• Lee Eon Seok
• Park Cheol-Hee
• Jeong Han Nah
• Kim Jae Hyun
• Jun Shin Hee
• Seong Eun Kyu

Classifications

• H05K2203/107

  Using laser light · CPC title

• H01B1/026

  Alloys based on copper · CPC title

• C08G65/38

  derived from phenols · CPC title

• C01P2004/38

  cube-like · CPC title

• H05K2203/072

  Electroless plating, e.g. finish plating or initial plating · CPC title