Adhesive composition

Patent metadata

Field	Value
Publication number	US-10351736-B2
Application number	US-201615560444-A
Country	US
Kind code	B2
Filing date	Mar 24, 2016
Priority date	Mar 24, 2015
Publication date	Jul 16, 2019
Grant date	Jul 16, 2019

Abstract

Provided are an adhesive composition and an organic electronic device (OED) including the same, and particularly, an adhesive composition, which may form a structure effectively blocking moisture or oxygen flowing into an OED from the outside, realize a top-emission OED and exhibit excellent handleability and processability, and an OED including the same.

First claim

What is claimed is:

1. An adhesive composition for encapsulating an organic electronic element, comprising:
a heat-curable resin which comprises a polyester resin, an isocyanate resin or an epoxy resin;
a photocurable compound which comprises an acrylate compound; and
an olefin-based resin having a water vapor transmission rate (WVTR) of 50 g/m 2 ·day or less, and satisfying General Equation 1,
wherein the olefin-based resin, the heat-curable resin and the photocurable compound are included at 40 to 90 parts by weight, 5 to 50 parts by weight and 1 to 40 parts by weight, respectively:
F≥ 600 g f   [General Equation 1]

where F is a shear strength, the adhesive composition is applied in a circle on a lower glass having a size of 5 cm×9 cm (width×length), and an upper glass having a size of 5 cm×9 cm (width×length) is laminated on the adhesive composition to overlap the lower glass 5 cm in a widthwise direction and 2.5 cm in a lengthwise direction, thereby preparing a specimen in which the adhesive composition is disposed between the upper and lower glasses in a circle having a diameter of 17 mm and a thickness of 20 μm, and the specimen is irradiated with light in the UV-A wavelength range at a dose of 3 J/cm 2 , the upper glass and lower glass were fixed to a texture analyzer (XT2 plus), and the upper glass was pulled in a lengthwise direction at 0.1 mm/sec at 25° C. to measure a force, and the maximum value of the measured force is defined as F.

2. The adhesive composition of claim 1 , wherein the olefin-based resin has a weight average molecular weight of 100,000 or less.

3. The adhesive composition of claim 1 , wherein the heat-curable resin comprises one or more heat-curable functional groups.

4. The adhesive composition of claim 3 , wherein the heat-curable functional group comprises an epoxy group, a glycidyl group, an isocyanate group, a hydroxyl group, a carboxyl group or an amide group.

5. The adhesive composition of claim 1 , wherein the heat-curable resin is comprised at 10 to 70 parts by weight with respect to 100 parts by weight of the olefin-based resin.

6. The adhesive composition of claim 1 , further comprising:
a heat-curing agent.

7. The adhesive composition of claim 6 , wherein the heat-curing agent is a latent curing agent.

8. The adhesive composition of claim 1 , wherein the photocurable compound comprises a multifunctional active energy ray-polymerizable compound.

9. The adhesive composition of claim 1 , wherein the photocurable compound is comprised at 10 to 100 parts by weight with respect to 100 parts by weight of the olefin-based resin.

10. The adhesive composition of claim 1 , further comprising:
a photoradical initiator at 0.1 to 20 parts by weight with respect to 100 parts by weight of the photocurable compound.

11. The adhesive composition of claim 1 , further comprising:
a moisture absorbent.

12. The adhesive composition of claim 11 , wherein the moisture absorbent is comprised at 5 to 100 parts by weight with respect to 100 parts by weight of the olefin-based resin.

Assignees

• Lg Chemical Ltd

Inventors

• Kim So Young
• Lee Seung Min
• Shim Jung Sup
• Yang Se Woo

Classifications

• C09J5/06

  involving heating of the applied adhesive · CPC title

• C09J123/00 Primary

  Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers · CPC title

• C09J2203/326

  for bonding electronic components such as wafers, chips or semiconductors · CPC title

• C09J11/04

  inorganic · CPC title

• C09J7/35

  Heat-activated · CPC title