Adhesive resin composition and film
US-2024343946-A1 · Oct 17, 2024 · US
Heat-activated
Heat-activated · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C09J7/35 |
| Official title | Heat-activated |
| Display label | Heat-activated |
| Total patents | 1,290 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 76 |
| 2016 | 67 |
| 2017 | 79 |
| 2018 | 93 |
| 2019 | 103 |
| 2020 | 117 |
| 2021 | 140 |
| 2022 | 140 |
| 2023 | 134 |
| 2024 | 168 |
| 2025 | 148 |
| 2026 | 25 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Hot melt adhesives and uses thereof
US-2024228837-A1 · Jul 11, 2024 · US
Fabric or flexible material with hot melt adhesive for inflatable safety products
US-2024208655-A1 · Jun 27, 2024 · US
Hot-melt pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet
US-2024093060-A1 · Mar 21, 2024 · US
Adhesive delivery system
US-2024059937-A1 · Feb 22, 2024 · US
Hot-melt composition
US-2024059931-A1 · Feb 22, 2024 · US
Hot-melt adhesive resin film and production method thereof
US-11904577-B2 · Feb 20, 2024 · US
Protective film-laminated adhesive sheet
US-2015368518-A1 · Dec 24, 2015 · US
Heat activated pressure sensitive adhesive
US-2015368521-A1 · Dec 24, 2015 · US
Multilayer heat-shrinkable film and containers made therefrom
US-9217097-B2 · Dec 22, 2015 · US
Low application temperature amorphous poly-α-olefin adhesive
US-9193891-B2 · Nov 24, 2015 · US
Film for back surface of flip-chip semiconductor, dicing-tape-integrated film for back surface of semiconductor, process for producing semiconductor device, and flip-chip semiconductor device
US-9196533-B2 · Nov 24, 2015 · US
Multi-layered structure and a method of sealing or shaping using a multi-layered structure
US-2015328861-A1 · Nov 19, 2015 · US
Adhesive resin compositions, and laminates and flexible printed wiring boards using same
US-9181464-B2 · Nov 10, 2015 · US
Activatable adhesive, labels, and related methods
US-9181462-B2 · Nov 10, 2015 · US
Adhesive tape
US-2015315424-A1 · Nov 5, 2015 · US
Method for manufacturing a label laminate
US-9175192-B2 · Nov 3, 2015 · US
Manufacturing method of semiconductor device
US-9177921-B2 · Nov 3, 2015 · US
Adhesive and method of encapsulating organic electronic device using the same
US-2015287940-A1 · Oct 8, 2015 · US
Solvent-Based Low Temperature Heat Seal Coating
US-2015275032-A1 · Oct 1, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C09J7/35?
- CPC C09J7/35 is the Cooperative Patent Classification code for “Heat-activated.”
- How many patents are filed under CPC C09J7/35 (Heat-activated)?
- Our database includes 1,290 publications tagged with this CPC code.
- Is patent activity under CPC C09J7/35 growing?
- Publication counts under this code: 168 in 2024 vs 148 in 2025 (latest complete years).