Method and apparatus for metering and vaporizing a fluid

Patent metadata

Field	Value
Publication number	US-10344747-B2
Application number	US-201514976067-A
Country	US
Kind code	B2
Filing date	Dec 21, 2015
Priority date	Dec 21, 2015
Publication date	Jul 9, 2019
Grant date	Jul 9, 2019

Abstract

A vaporization device, including a fluid supply containing a vaporizable fluid; a plurality of bubble pumps operative to pump fluid from the fluid supply to outlets of the bubble pumps; and a fluid vaporization heater located adjacent the outlets of the bubble pumps to receive fluid from the bubble pumps.

First claim

The invention claimed is:

1. A vaporization device, comprising:
a fluid supply containing a vaporizable fluid;
a plurality of bubble pumps, each bubble pump having an inlet in flow communication with the fluid supply for receiving the vaporizable fluid therefrom, and each bubble pump also including a fluid flow path, flow sequencing heaters located within the fluid flow path, and an outlet, wherein each bubble pump is operative to pump the vaporizable fluid from the fluid supply to each outlet of each bubble pump; and
a planar fluid vaporization heater made of a thin film resistor material, the vaporization heater being separate from the bubble pumps located adjacent to the outlets of the plurality of bubble pumps, wherein the fluid supply and the plurality of bubble pumps are incorporated onto a printed circuit board, the fluid vaporization heater having a heated fluid contact surface to receive the vaporizable fluid from the outlet of each bubble pump and to heat and thereby vaporize the received fluid into the atmosphere.

2. The vaporization device of claim 1 , wherein the plurality of bubble pumps and the fluid vaporization heater are located on parallel planes.

3. The vaporization device of claim 1 , wherein an angular position of the plurality of bubble pumps relative to the fluid vaporization heater is variable.

4. The vaporization device of claim 1 , wherein the fluid supply comprises a plurality of fluid supplies.

5. The vaporization device of claim 4 , wherein the plurality of fluid supplies comprises a number of fluid supplies and the plurality of bubble pumps comprises an equal number of bubble pumps.

6. The vaporization device of claim 1 , wherein the fluid vaporization heater comprises one or more fluid vaporization heaters.

7. The vaporization device of claim 1 , wherein the plurality of bubble pumps and the fluid vaporization heater are fabricated on a common substrate.

8. The vaporization device of claim 1 , wherein the plurality of bubble pumps and the fluid vaporization heater are fabricated on different substrates.

9. The vaporization device of claim 1 , wherein the fluid supply is located vertically above the plurality of bubble pumps.

10. The vaporization device of claim 1 , wherein the fluid vaporization heater is incorporated onto the printed circuit board.

11. The vaporization device of claim 10 , wherein the fluid supply has an inlet located at an end of the printed circuit board opposite the fluid vaporization heater.

12. A vaporization device, comprising:
a plurality of fluid supplies each containing a vaporizable fluid;
a plurality of bubble pumps, each bubble pump having an inlet in flow communication with one of the plurality of fluid supplies for receiving fluid therefrom, and each bubble pump also including a fluid flow path, flow sequencing heaters located within the fluid flow path, and an outlet, wherein each bubble pump is operative to pump the vaporizable fluid from the fluid supply to which it is in fluid communication with to the outlet of each bubble pump; and
a planar fluid vaporization heater made of a thin film resistor material, the vaporization heater being separate from the bubble pumps located adjacent to the outlets of the plurality of bubble pumps, wherein the fluid supply and the plurality of bubble pumps are incorporated onto a printed circuit board, the fluid vaporization heater having a heated fluid contact surface to receive the vaporizable fluid from each outlet of each bubble pump and to heat and thereby vaporize the received fluid into the atmosphere.

13. The vaporization device of claim 12 , wherein at least two of the plurality of bubble pumps share one of the plurality of fluid supplies.

14. The vaporization device of claim 12 , wherein the plurality of fluid supplies comprises a number of fluid supplies and the plurality of bubble pumps comprises an equal number of bubble pumps.

15. The vaporization device of claim 12 , wherein the fluid vaporization heater comprises one or more fluid vaporization heaters.

16. A vaporization device, comprising:
a fluid supply containing a vaporizable fluid; a plurality of bubble pumps operative to pump the vaporizable fluid from the fluid supply to outlets of the plurality of bubble pumps; and a planar fluid vaporization heater made of a thin film resistor material, the vaporization heater being separate from the bubble pumps located adjacent to the outlets of the plurality of bubble pumps to receive the vaporizable fluid from the plurality of bubble pumps, wherein the fluid supply and the plurality of bubble pumps are incorporated onto a printed circuit board, the fluid vaporization heater being operative to heat and thereby vaporize the received fluid into the atmosphere.

17. The vaporization device of claim 16 , wherein the plurality of bubble pumps and the fluid vaporization heater are fabricated on a same substrate.

18. The vaporization device of claim 16 , wherein the plurality of bubble pumps and the fluid vaporization heater are fabricated on different substrates.

19. A method of vaporizing fluid, comprising the steps of:
providing a fluid supply containing a vaporizable fluid; providing a plurality of bubble pumps in fluid communication with the fluid supply and operating the plurality of bubble pumps to pump the vaporizable fluid from the fluid supply to outlets of the plurality of bubble pumps; providing a planar fluid vaporization heater made of a thin film resistor material, the vaporization heater being separate from the bubble pumps adjacent to the outlets of the plurality of bubble pumps to receive the vaporizable fluid from the plurality of bubble pumps, wherein the fluid supply and the plurality of bubble pumps are incorporated onto a printed circuit board, and operating the fluid vaporization heater to heat and thereby vaporize the received fluid into the atmosphere.

Assignees

• Funai Electric Co

Inventors

• Barkley Lucas D

Classifications

• F04B19/24

  Pumping by heat expansion of pumped fluid · CPC title

• B01L2300/0887

  Laminated structure · CPC title

• B01L2200/0678

  Facilitating or initiating evaporation · CPC title

• F04B23/025

  the pump being located directly adjacent the reservoir · CPC title

• B01L3/0268

  using pulse dispensing or spraying, eg. inkjet type, piezo actuated ejection of droplets from capillaries · CPC title