Composition for polishing silicon wafers

Patent metadata

Field	Value
Publication number	US-10344185-B2
Application number	US-201515309281-A
Country	US
Kind code	B2
Filing date	Jun 17, 2015
Priority date	Jun 24, 2014
Publication date	Jul 9, 2019
Grant date	Jul 9, 2019

Abstract

Provided is a composition for polishing silicon wafers, having an excellent effect of reducing haze and having low agglomerating property. A composition for polishing silicon wafers provided here includes: an amido group-containing polymer A; and an organic compound B not containing an amido group. The amido group-containing polymer A has, on a main chain, a building block S derived from a monomer represented by General Formula (1). Molecular weight M A of the amido group-containing polymer A and molecular weight M B of the organic compound B have a relation satisfying 200≤M B <M A .

First claim

The invention claimed is:

1. A composition for polishing silicon wafers used in the presence of abrasives, comprising:
a silicon-wafer polishing removal accelerator;
an amido group-containing polymer A;
an organic compound B not containing an amido group; and
water,
wherein the abrasives are colloidal silica, and
wherein the amido group-containing polymer A having, on a main chain, a building block S derived from a monomer represented by General Formula (1),

in the General Formula (1), R 1 is a hydrogen atom; an alkyl group, an alkenyl group, an alkynyl group, an aralkyl group, an alkoxy group, an alkoxyalkyl group, or an alkylol group having the number of carbon atoms of 1 to 6; an acetyl group; a phenyl group; a benzyl group; a chloro group; a difluoromethyl group; a trifluoromethyl group; or a cyano group, X is (CH 2 ) n , where n is an integer of 4 to 6, (CH 2 ) 2 O(CH 2 ) 2 or (CH 2 ) 2 S(CH 2 ) 2 ,
the organic compound B being a nonionic compound and selected from oxyalkylene polymer, polyoxyalkylene adduct, and copolymers of plurality types of oxyalkylenes,
the amido group-containing polymer A having molecular weight M A and the organic compound B having molecular weight MB, the molecular weight M A and the molecular weight MB having a relation satisfying 200≤M B <M A .

2. The composition for polishing silicon wafers according to claim 1 , wherein a ratio (MA/MB) of the molecular weight MA of the amido group-containing polymer A to the molecular weight MB of the organic compound B is more than 5.

3. The composition for polishing silicon wafers according to claim 1 , wherein the molecular weight MB of the organic compound B is less than 1×10 4 .

4. The composition for polishing silicon wafers according to claim 1 , wherein the molecular weight MA of the amido group-containing polymer A is less than 50×10 4 .

5. The composition for polishing silicon wafers according to claim 1 , wherein in the General Formula (1), R 1 is a hydrogen atom or a methyl group.

6. The composition for polishing silicon wafers according to claim 1 , wherein in the General Formula (1), X is (CH 2 ) 2 O(CH 2 ) 2 .

7. The composition for polishing silicon wafers according to claim 1 , wherein the proportion of the mole number of the building block S relative to the mole number of all building blocks contained in the molecular structure of the polymer is 97% by mole or more.

8. The composition for polishing silicon wafers according to claim 1 , wherein the pH of the composition is 9.5 or more and 12.0 or less.

9. The composition for polishing silicon wafers according to claim 1 , wherein the molecular weight MB of the organic compound B is 1.8×10 4 or less.

10. The composition for polishing silicon wafers according to claim 1 , wherein the content of the amido group-containing polymer A in the polishing composition is greater than zero to 0.1% by mass.

Assignees

• Fujimi Inc

Inventors

• Tsuchiya Kohsuke
• Tansho Hisanori
• Suga Yusuke

Classifications

• H10P90/129

  by polishing · CPC title

• H10P90/128

  by edge treatment, e.g. chamfering · CPC title

• H10P70/15

  by wet cleaning only (H10P70/52 takes precedence) · CPC title

• H10P52/402

  of semiconductor materials · CPC title

• B24B37/00

  Lapping machines or devices; Accessories (B24B3/00 takes precedence) · CPC title