Wiping device and stack manufacturing apparatus

Patent metadata

Field	Value
Publication number	US-10343191-B2
Application number	US-201515302260-A
Country	US
Kind code	B2
Filing date	Apr 13, 2015
Priority date	Apr 30, 2014
Publication date	Jul 9, 2019
Grant date	Jul 9, 2019

Abstract

An object is to eliminate a harmful effect when a film is bonded by wiping an adhering sealant (30a). Characterized is a wiping device (200) including a stage (230) that supports a sheet-like member (220), a wiping means (210) that wipes an adhering object (30a) adhering on a peripheral portion of the sheet-like member (220), a wiping cloth (241) that is attachably and detachably provided for the wiping means (210), and a solvent (261) that adheres to the wiping cloth (241), in which the wiping means (210) is provided with the wiping cloth (241), makes the solvent (261) adhere to the wiping cloth (241), and wipes the adhering object (30a), or a stack manufacturing apparatus (1000) including such a wiping device (200).

First claim

The invention claimed is:

1. A wiping device comprising:
a stage that supports a sheet-like member;
wiping means that wipes an adhering object adhering on a peripheral portion of the sheet-like member;
a wiping cloth that is attachably and detachably provided for the wiping means; and
a solvent that adheres to the wiping cloth,
wherein the wiping means is provided with the wiping cloth, makes the solvent adhere to the wiping cloth, and wipes the adhering object, and
wherein the wiping means straddles a region where the adhering object adheres from an inside to an outside and is inclined such that an inner side precedes an outer side.

2. The wiping device according to claim 1 ,
wherein, in the wiping means, the wiping cloth is replaced after wiping a predetermined region in a region where the adhering object adheres.

3. The wiping device according to claim 2 ,
wherein the wiping means wipes the predetermined region with the same wiping surface of the wiping cloth.

4. The wiping device according to claim 2 ,
wherein the wiping means wipes the predetermined region with the same wiping surface of the wiping cloth and wipes another predetermined region with another wiping surface of the wiping cloth.

5. The wiping device according to claim 4 ,
wherein the wiping surfaces are surfaces on a right side and a left side of the wiping cloth.

6. The wiping device according to claim 4 ,
wherein the wiping surfaces are a surface on a front side and a right side of the wiping cloth, a surface on the front side and a left side thereof, a surface on a back side and the right side thereof, and a surface on the back side and the left side thereof.

7. The wiping device according to claim 1 ,
wherein excess solvent removal means is included, and
wherein an excess amount of the solvent is removed by the excess solvent removal means of the wiping means.

8. A wiping device comprising:
a stage that supports a sheet-like member;
wiping means that wipes an adhering object adhering on a peripheral portion of the sheet-like member;
a wiping cloth that is attachably and detachably provided for the wiping means; and
a solvent that adheres to the wiping cloth,
wherein the wiping means straddles the region where the adhering object adheres from an inside to an outside and is inclined such that an inner side precedes an outer side,
wherein the wiping means is provided with the wiping cloth, makes the solvent adhere to the wiping cloth, and wipes the adhering object,
wherein, in the wiping means, the wiping cloth is replaced after wiping a predetermined region in a region where the adhering object adheres, and
wherein wiping surfaces are surfaces on a right side and a left side of the wiping cloth.

9. The wiping device according to claim 8 ,
wherein the wiping means wipes the predetermined region with the same wiping surface of the wiping cloth.

10. The wiping device according to claim 8 ,
wherein the wiping means wipes the predetermined region with the same wiping surface of the wiping cloth and wipes another predetermined region with another wiping surface of the wiping cloth.

11. The wiping device according to claim 8 ,
wherein excess solvent removal means is included, and
wherein an excess amount of the solvent is removed by the excess solvent removal means of the wiping means.

12. A wiping device comprising:
wiping means that wipes an adhering object adhering on a peripheral portion of a sheet-like member,
wherein a wiping cloth is attachable to the wiping means, and
wherein the wiping means straddles a region where the adhering object adheres from an inside to an outside and is inclined such that an inner side precedes an outer side.

Assignees

• Semiconductor Energy Lab

Inventors

• Ohno Masakatsu
• Kumakura Kayo
• Idojiri Satoru
• Hirakata Yoshiharu
• Yokoyama Kohei

Classifications

• H10P95/11

  Separation of active layers from substrates · CPC title

• H10P95/00

  Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass · CPC title

• H10P72/0428

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• H10P72/0412

  using mainly scrubbing means, e.g. brushes · CPC title

• H10P70/60

  Cleaning only by mechanical processes · CPC title