Substrate cleaning apparatus

Patent metadata

Field	Value
Publication number	US-10340158-B2
Application number	US-201615058277-A
Country	US
Kind code	B2
Filing date	Mar 2, 2016
Priority date	May 6, 2015
Publication date	Jul 2, 2019
Grant date	Jul 2, 2019

Abstract

Provided is a substrate cleaning apparatus including: a cleaning bath configured to accommodate a substrate having a first surface and a second surface; a substrate support configured to support the substrate; first and second nozzle bars provided in the cleaning bath to be rotatable in a plane parallel with the substrate, each of the first and the second nozzle bars including a passage; a plurality of nozzles provided along a longitudinal direction of each of the first and the second nozzle bars and configured to spray the cleaning solution from the passage of each of the first and the second nozzle bars to the substrate; and first and second brushes, the first brush provided on a first side of the substrate and configured to clean the first surface and the second brush provided on a second side of the substrate and configured to clean the second surface of the substrate.

First claim

What is claimed is:

1. A substrate cleaning apparatus, comprising:
a cleaning bath comprising a cleaning space configured to accommodate a substrate having a first surface and a second surface opposite to the first surface;
a substrate support configured to support the substrate in the cleaning bath;
a connection bar;
a first nozzle bar and a second nozzle bar, each of the first nozzle bar and the second nozzle bar including a first end and a second end opposite to the first end, the first end of each of the first nozzle bar and the second nozzle bar being pivoted at the connection bar such that the second end of each of the first nozzle bar and the second nozzle bar is rotatable in a plane parallel with the first surface and the second surface of the substrate, each of the first nozzle bar and the second nozzle bar including a passage through which a cleaning solution flows;
a plurality of nozzles provided along a longitudinal direction of each of the first nozzle bar and the second nozzle bar and configured to spray the cleaning solution from the passage of each of the first nozzle bar and the second nozzle bar to the substrate; and
a first brush and a second brush, the first brush provided on a first side of the substrate and configured to clean the first surface and the second brush provided on a second side opposite to the first side of the substrate and configured to clean the second surface of the substrate.

2. The substrate cleaning apparatus of claim 1 , wherein the first brush is configured to slidably move toward or away from the substrate, and
wherein the second brush is configured to slidably move toward or away from the substrate.

3. The substrate cleaning apparatus of claim 1 , wherein each of the first nozzle bar and the second nozzle bar is configured to rotate about a respective end portion of each nozzle bar between a first position on the plane and a second position on the plane, each of the first nozzle bar and the second nozzle bar extending in a first direction at the first position and each of the first nozzle bar and the second nozzle bar extending in a second direction perpendicular to the first direction in the cleaning bath.

4. The substrate cleaning apparatus of claim 1 , further comprising a head portion configured to rotate the connection bar about a longitudinal axis of the connection bar,
wherein the connection bar comprises a connection passage connected to with the passage of each of the first nozzle bar and the second nozzle bar; and
wherein the head portion is configured to supply the cleaning solution to the connection passage.

5. The substrate cleaning apparatus of claim 4 , wherein the head portion comprises:
a drive shaft fixed to the connection bar to rotate with the connection bar; and
a drive shaft driving unit configured to the rotate the drive shaft on an axis of the drive shaft.

6. The substrate cleaning apparatus of claim 5 , wherein the head portion further comprises a rotary union configured to guide the cleaning solution to flow into a fluid passage formed through the drive shaft.

7. The substrate cleaning apparatus of claim 5 , wherein the head portion further comprises an outer connection tube connected to the connection passage in the connection bar and configured to supply the cleaning solution.

8. The substrate cleaning apparatus of claim 1 , wherein each of the first nozzle bar and the second nozzle bar is configured to rotate about an longitudinal axis of each of the first nozzle bar and the second nozzle bar to adjust a spraying angle of the nozzle.

9. The substrate cleaning apparatus of claim 1 , wherein the substrate support comprises a plurality of rollers configured to support and to rotate the substrate.

10. The substrate cleaning apparatus of claim 1 , further comprising an aging plate provided in the cleaning bath and configured to age cleaning nodules of each of the first brush and the second brush.

11. The substrate cleaning apparatus of claim 10 , wherein the aging plate comprises a plurality of aging protrusions provided on the aging plate.

12. The substrate cleaning apparatus of claim 11 , wherein the aging plate further comprises a flow guide pathway provided between the plurality of aging protrusions which extend in a direction parallel with a vertical direction of the cleaning bath.

13. The substrate cleaning apparatus of claim 10 , wherein the aging plate is provided on an inner wall of the cleaning bath.

14. The substrate cleaning apparatus of claim 1 , further comprising a gas exhaust portion configured to exhaust a gas generated from the cleaning bath to an exterior of the substrate cleaning apparatus.

15. A substrate cleaning apparatus, comprising:
a cleaning bath comprising a cleaning space configured to accommodate a substrate in a first direction;
a substrate support configured to support the substrate in the first direction in the cleaning bath;
a spraying unit configured to spray a cleaning solution at a first surface and a second surface of the substrate in the cleaning bath;
a pair of brushes movable in a second direction perpendicular to the first direction with respect to the substrate and configured to clean the first surface and the second surface of the substrate via contact; and
an aging plate provided in the cleaning bath and configured to age cleaning nodules of the pair of brushes.

16. The substrate cleaning apparatus of claim 15 , wherein the spraying unit comprises:
a pair of nozzle bars configured to be rotatable in planes parallel with the substrate, each of the pair of nozzle bars comprising a passage through which a cleaning solution flows; and
a plurality of nozzles provided along a longitudinal direction of each of the pair of nozzle bars and configured to be in communication with the passage to spray the cleaning solution to the substrate.

17. The substrate cleaning apparatus of claim 16 , wherein each nozzle bar of the pair of nozzle bars is configured to rotate about an end portion of the nozzle bar between a first position and a second position, each nozzle bar extending in a first direction at the first position and each nozzle bar extending in a second direction perpendicular to the first direction in the cleaning bath.

18. The substrate cleaning apparatus of claim 17 , further comprising:
a connection bar connected to an end portion of each nozzle bar and comprising a connection passage connected to with the passage of each of the pair of nozzle bars; and
a head portion configured to rotate the connection bar about a longitudinal axis of the connection bar and to supply the cleaning solution to the connection passage.

19. The substrate cleaning apparatus of claim 15 , wherein the aging plate comprises a plurality of aging protrusions provided on the aging plate.

20. A substrate cleaning apparatus, comprising:
a cleaning bath configured to accommodate a substrate having a first surface and a second surface opposite to the first surface, the cleaning bath comprising a first sidewall and a second sidewall provided opposite to the first sidewall;
a substrate support configured to support the substrate in the cleaning bath;
a connection bar configured to be rotated along a longitudinal axis of the connection bar;
a first nozzle bar provided between the first sidewall and the first surface, pivoted at the connection bar and configured to be rotated together with the connection bar;
a second nozzle bar provided between the second sidewall and the second surface, pivoted at the connection b

Assignees

• Samsung Electronics Co Ltd

Inventors

• Lee Eun-Seok
• Ryu Chang-Gil
• Song Geun-Young
• Lee Jae-Chang
• Choi Yun-Seok
• Hong Jin-Suk

Classifications

• H10P72/0416

  with the semiconductor substrates being dipped in baths or vessels · CPC title

• H10P72/0414

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/0412 Primary

  using mainly scrubbing means, e.g. brushes · CPC title

• B05B1/20

  Perforated pipes or troughs, e.g. spray booms; Outlet elements therefor · CPC title

• H01L21/67046 Primary

  Electricity · mapped topic