Package-on-package structure with organic interposer

Patent metadata

Field	Value
Publication number	US-10319607-B2
Application number	US-201414466647-A
Country	US
Kind code	B2
Filing date	Aug 22, 2014
Priority date	Aug 22, 2014
Publication date	Jun 11, 2019
Grant date	Jun 11, 2019

Abstract

A device comprises a substrate having a die mounted on the first side of the substrate and a moldable underfill (MUF) disposed on the first side of the substrate and around the die. An interposer is mounted on the first side of the substrate, with the interposer having lands disposed on a first side of the interposer. The interposer mounted to the substrate by connectors bonded to a second side of the interposer, the connectors providing electrical connectivity between the interposer and the substrate. A package is mounted on the first side of the interposer and is electrically connected to the lands. At least one of the lands is aligned directly over the die and wherein a pitch of the connectors is different than a pitch of the lands.

First claim

What is claimed is:

1. A device comprising:
a substrate having a die mounted on a first side of the substrate;
a moldable underfill (MUF) disposed on the first side of the substrate, the MUF disposed over and around the die, the MUF comprising a substantially continuous distribution of material over and around the die, the MUF having voids therein, the voids each defined by respective sidewalls of the MUF;
an interposer mounted on the first side of the substrate, the interposer having lands disposed on a first side of the interposer, and the interposer mounted to the substrate by connectors bonded to a second side of the interposer, the connectors each comprising a first pillar disposed on the first side of the substrate, a second pillar disposed on the second side of the interposer, and a connecting member bonding the first pillar to the second pillar, wherein the connecting member comprises a different conductive material than the first pillar and the second pillar, the connectors providing electrical connectivity between the interposer and the substrate, each of the connectors disposed in a respective void of the MUF, the first pillar and the second pillar of each connector spaced apart from the sidewalls of the MUF defining the respective void, the connecting member contacting the sidewalls of the MUF defining the respective void, the second pillars extending through a protection layer on the second side of the interposer to contact second lands disposed on the second side of the interposer, the protection layer contacting sidewalls of the second pillars, the protection layer having a thickness greater than a thickness of a portion of the MUF extending between the die and the interposer;
a solder resist layer on the first side of the substrate, the solder resist layer being disposed between the substrate and the MUF, the solder resist layer comprising a first opening, the die being mounted to the substrate through the first opening, wherein the first opening has a width greater than a width of the die, and wherein the first pillars extend through the solder resist layer; and
a package mounted on the first side of the interposer and electrically connected to the lands, wherein at least one of the lands is aligned directly over the die, and a pitch of the connectors is different than a pitch of the lands.

2. The device of claim 1 , wherein the second pillars have a first pitch between about 200 μm and about 400 μm, wherein the lands have a second pitch between about 350 μm and about 650 μm, and the first pitch is less than the second pitch.

3. The device of claim 1 , wherein each of the first pillars and the second pillars has a height that is equal to or less than a width of the respective pillar, wherein a first portion of the first pillar is spaced apart from the sidewalls of the MUF, and wherein a second portion of the first pillar contacts the sidewalls of the MUF, wherein the MUF contacts the protection layer, and wherein each of the voids has a conical shape.

4. The device of claim 1 , wherein the connecting member is a solder ball.

5. The device of claim 1 , wherein a top surface of the MUF is spaced apart from the protection layer, the protection layer contacting sidewalls of the second lands, the protection layer further contacting surfaces of the second lands proximal the die, wherein the die is mounted to the substrate by second connectors bonded to the first side of the substrate, the MUF extending between the die and the substrate and between the second connectors.

6. The device of claim 1 , wherein the interposer comprises:
an organic substrate having a first side and a second side opposite the first side;
a first redistribution layer on the first side of the organic substrate, the package mounted on the first redistribution layer;
a second redistribution layer on the second side of the organic substrate, the second redistribution layer comprising the protection layer and the second lands, the second redistribution layer mounted to the substrate by the connectors; and
vias extending through the organic substrate and electrically connecting the package to the substrate.

7. The device of claim 6 , wherein the vias extend through the organic substrate from the first redistribution layer to the second redistribution layer.

8. A device comprising:
a lower substrate having a die disposed on a first side of the lower substrate;
first pillars disposed on the first side of the lower substrate, the first pillars comprising a first conductive material, wherein the first pillars have a first pitch;
a moldable underfill (MUF) disposed on the first side of the lower substrate, the MUF comprising a substantially continuous distribution of MUF material over and adjacent the die, wherein the MUF surrounds the die and each of the first pillars;
a solder resist layer between the lower substrate and a portion of the MUF, the first pillars extending through the solder resist layer, wherein a lowermost surface of the MUF is closer to the first side of the lower substrate than an uppermost surface of the solder resist layer;
an interposer mounted over the first side of the lower substrate, the interposer comprising:
an organic substrate having a first side and a second side opposite the first side;
a first redistribution layer on the first side of the organic substrate, the first redistribution layer comprising lands, wherein the lands have a second pitch greater than the first pitch, and wherein at least one of the lands is aligned directly over the die, the first redistribution layer configured for mounting an overlying package, the overlying package comprising an upper substrate;
a second redistribution layer on the second side of the organic substrate, wherein a top surface of the MUF is in contact with the second redistribution layer;
vias extending through the organic substrate and electrically connecting the first redistribution layer to the second redistribution layer; and
second pillars disposed on the second redistribution layer, the second pillars comprising the first conductive material;

conductive connectors bonding the first pillars to the second pillars and providing electrical connectivity between the interposer and the lower substrate, the conductive connectors comprising a second conductive material different from the first conductive material, wherein the second pillars contact the second redistribution layer, and wherein the MUF comprises a single layer of material which surrounds and contacts sidewalls of the first pillars, the second pillars, and the conductive connectors; and
a die attach film extending between a top surface of the die and a bottom surface of the second redistribution layer, the die attach film comprising a material different from the material of the MUF, the die attach film having a width equal to a width of the die, the die attach film contacting the die, the second redistribution layer, and the MUF.

9. The device of claim 8 , wherein the conductive connectors comprise a solder material, wherein the die is bonded to the lower substrate by second conductive connectors, wherein an underfill comprising a different material than the MUF extends between the die and the lower substrate, and wherein the underfill extends between the second conductive connectors.

10. The device of claim 8 , wherein the second pillars have a pitch between about 200 μm and about 400 μm, and the lands have a pitch between about 350 μm and about 650 μm.

11. The device of claim 8 , wherein a portion of the MUF is disposed between a bottom surface of the die and a topmost surface of the lower substrate, wherein a second portion of the MUF is disposed between a top surface of the

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Wu Jiun Yi
• Liang yu-min
• Lii Mirng-Ji
• Lee Chien-Hsun
• Wang Tsung-Ding
• Cheng Jung Wei

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/732

  between stacked chips · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/722

  between stacked chips · CPC title