Sensor device and method for manufacture

Patent metadata

Field	Value
Publication number	US-9370109-B2
Application number	US-201414166509-A
Country	US
Kind code	B2
Filing date	Jan 28, 2014
Priority date	Aug 7, 2008
Publication date	Jun 14, 2016
Grant date	Jun 14, 2016

Abstract

A sensor device has a ceramic carrier substrate. At least two conductor tracks are arranged on the carrier substrate. The sensor device has at least one ceramic component that is in the form of a chip and is connected to the conductor tracks in an electrically conductive manner. The at least one ceramic component is mechanically connected to the conductor tracks by means of a screen printing paste which has been burnt in.

First claim

What is claimed is:

1. A method of manufacturing a sensor device, the method comprising:
providing a ceramic carrier substrate; and
connecting a ceramic component in the form of a chip to the carrier substrate in a mechanically fixed manner using an electrically conductive screen printing paste that can be burnt in, the connecting the ceramic component to the carrier substrate comprising:
applying the screen printing paste to the ceramic carrier substrate thereby forming at least two conductor tracks on the carrier substrate;
arranging the ceramic component on the carrier substrate such that the ceramic component electrically contacts and connects the screen printing paste via at least two connection regions; and
performing a burning-in process so that the screen printing paste is burnt into the ceramic carrier substrate and the ceramic component, wherein the ceramic component and the screen printing paste enter a mechanically stable connection during the burning process.

2. The method as claimed in claim 1 , wherein connecting comprises applying the electrically conductive screen printing paste to the carrier substrate and to at least one connection region of the ceramic component.

3. The method as claimed in claim 2 , wherein the applied screen printing paste of the carrier substrate and of the ceramic component are connected.

4. The method as claimed in claim 3 , further comprising performing a burning-in operation after the applied screen printing paste of the carrier substrate and of the ceramic component are connected.

5. The method as claimed in claim 1 , wherein arranging the ceramic component on the carrier substrate comprises arranging a plurality of ceramic components on the carrier substrate.

6. The method as claimed in claim 1 , wherein the sensor device is designed to detect temperatures up to 1,000° C.

Assignees

• Epcos Ag

Inventors

• Kloiber Gerald
• Strallhofer Heinz
• Freiberger Norbert

Classifications

• H05K2201/10636

  Leadless chip, e.g. chip capacitor or resistor · CPC title

• H05K2203/1453

  Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors · CPC title

• H05K3/321 Primary

  by conductive adhesives · CPC title

• H05K1/0306

  Inorganic insulating substrates, e.g. ceramic, glass · CPC title

• G01K7/22

  the element being a non-linear resistance, e.g. thermistor (G01K7/26 takes precedence) · CPC title