Thermal interface materials including a coloring agent

Patent metadata

Field	Value
Publication number	US-10312177-B2
Application number	US-201615554806-A
Country	US
Kind code	B2
Filing date	Oct 12, 2016
Priority date	Nov 17, 2015
Publication date	Jun 4, 2019
Grant date	Jun 4, 2019

Abstract

The present disclosure provides thermal interface materials that are useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material also includes a coloring agent selected from the group consisting of: an iron based inorganic pigment; and an organic pigment.

First claim

The invention claimed is:

1. A thermal interface material comprising:
at least one polymer;
at least one thermally conductive filler; and
at least one coloring agent in the form of an organic pigment having a formula selected from the group consisting of Formulas (I)-(XVI):

wherein each R is independently selected from H, alkyl, aryl, and halogen; and

2. The thermal interface material of claim 1 , wherein the thermal interface material comprises 0.5 wt. % to 2 wt. % of the coloring agent based on 100 wt. % of the thermal interface material without the coloring agent.

3. The thermal interface material of claim 1 , wherein the thermal interface material comprises 1 wt. % to 20 wt. % of the coloring agent based on 100 wt. % of the thermal interface material without the coloring agent.

4. The thermal interface material of claim 1 , wherein the thermal interface material has a thermal impedance of 0.05° C. cm 2 /W to 0.3° C. cm 2 /W.

5. The thermal interface material of claim 1 , wherein the thermal interface material comprises:
5 wt. % to 10 wt. % of the at least one polymer;
85 wt. % to 95 wt. % of the at least one thermally conductive filler;
0.1 wt. % and 5 wt. % of a phase change material; and
0.5 wt. % to 20 wt. % of the coloring agent, based on 100 wt. % of the thermal interface material without the coloring agent.

6. A dispensable thermal interface material comprising:
at least one polymer;
at least one thermally conductive filler;
a coloring agent selected from the group consisting of: α-Fe 2 O 3 ; α-Fe 2 O 3 .H 2 O; Fe 3 O 4 ; and an organic pigment having a formula selected from the group consisting of Formulas (I)-(XVI):

wherein each R is independently selected from H, alkyl, aryl, and halogen; and

and
at least one solvent.

7. The dispensable thermal interface material of claim 6 , wherein the solvent is an isoparaffinic fluid.

8. The dispensable thermal interface material of claim 6 , wherein the solvent comprises from 1 wt. % to 20 wt. % based on the total weight of a mixture including the thermal interface material and the solvent.

9. The dispensable thermal interface material of claim 6 , wherein the dispensable thermal interface material as described above has the viscosity in the range of 10 Pa·s to 100,000 Pa·s.

10. The dispensable thermal interface material of claim 6 , wherein the coloring agent is an organic pigment of Formula (I).

11. The dispensable thermal interface material of claim 6 , wherein the coloring agent is selected from the group consisting of α-Fe 2 O 3 ; α-Fe 2 O 3 .H 2 O and Fe 3 O 4 .

12. The thermal interface material of claim 1 , wherein the coloring agent comprises a compound of the following formula:

13. The thermal interface material of claim 1 , wherein the thermally conductive filler is present in an amount between 75 wt. % and 97 wt. %, based on a total weight of the thermal interface material.

14. The dispensable thermal interface material of claim 6 , wherein the coloring agent comprises a compound of the following formula:

15. The dispensable thermal interface material of claim 6 , wherein the thermally conductive filler is present in an amount between 75 wt. % and 97 wt. %, based on a total weight of the thermal interface material.

16. A thermal interface material comprising:
at least one polymer;
at least one thermally conductive filler;
at least one phase change material; and
at least one coloring agent selected from the group consisting of iron based inorganic pigments and organic pigments.

17. The thermal interface material of claim 16 , wherein the iron based inorganic pigment is selected from the group consisting of α-Fe 2 O 3 ; α-Fe 2 O 3 .H 2 O; and Fe 3 O 4 .

18. The thermal interface material of claim 16 , wherein the at least one coloring agent has a formula selected from the group consisting of Formulas (I)-(XVI):

wherein each R is independently selected from H, alkyl, aryl, and halogen; and

19. The thermal interface material of claim 16 , wherein the coloring agent comprises a compound of the following formula:

20. The thermal interface material of claim 16 , wherein the thermally conductive filler is present in an amount between 75 wt. % and 97 wt. %, based on a total weight of the thermal interface material.

Assignees

• Honeywell Int Inc
• Zhang Liqiang
• Mao Yaqin
• Duan Huifeng
• Kang Haigang
• Liu Ya Qun
• Shen Ling
• Zhang Kai

Inventors

• Zhang Liqiang
• Mao Yaqin
• Duan Huifeng
• Kang Haigang
• Liu Ya Qun
• Shen Ling
• Zhang Kai

Classifications

• C09K5/063

  Materials absorbing or liberating heat during crystallisation; Heat storage materials · CPC title

• C09K5/06

  the change of state being from liquid to solid or vice versa · CPC title

• C08L23/26

  modified by chemical after-treatment (saponified copolymers C08L23/0861; unsaturated acid salts C08L23/0876) · CPC title

• H10W40/251

  Organics · CPC title

• H10W40/70 Primary

  Fillings or auxiliary members in containers or in encapsulations for thermal protection or control · CPC title