Method of forming metal coating

Patent metadata

Field	Value
Publication number	US-10301735-B2
Application number	US-201515118327-A
Country	US
Kind code	B2
Filing date	Feb 9, 2015
Priority date	Feb 14, 2014
Publication date	May 28, 2019
Grant date	May 28, 2019

Abstract

A method of forming a metal coating includes: disposing a solid electrolyte membrane (13) between an anode (11) and a substrate (B) which forms a cathode; bringing a solution (L) containing metal ions into contact with an anode-side portion of the solid electrolyte membrane (13); and causing, in a state where the solid electrolyte membrane (13) is in contact with the substrate (B), a current to flow from the anode (11) to the cathode so as to form a metal coating formed of the metal on the surface of the substrate (B). The metal coating is formed by repeating a current-flowing period (T) in which a current flows from the anode (11) to the cathode and a non-current-flowing period (N) in which a current does not flow between the anode (11) and the cathode.

First claim

The invention claimed is:

1. A method of forming a metal coating comprising:
disposing a solid electrolyte membrane between an anode and a substrate which forms a cathode;
bringing a solution containing metal ions into contact with an anode-side portion of the solid electrolyte membrane; and
causing, in a state where the solid electrolyte membrane is in contact with the substrate, a current to flow from the anode to the cathode such that metal is deposited on a surface of the substrate from the metal ions contained in the solid electrolyte membrane to form the metal coating formed of the metal on the surface of the substrate,
wherein the metal coating is formed by repeating a first current-flowing period in which a current flows from the anode to the cathode and a non-current-flowing period in which the current does not flow between the anode and the cathode,
a current waveform including the first current-flowing period and the non-current-flowing period is formed of a rectangular current waveform, and
the first current-flowing period is shifted to the non-current-flowing period after causing, in a second current-flowing period which is shorter than the first current-flowing period, the current to flow from the cathode to the anode,
wherein the rectangular current waveform includes a rising time and a falling time, and
wherein the non-current-flowing period is set to be longer than a total time which is a sum of a current-flowing period including the first current-flowing period and the second current-flowing period, the rising time, and the falling time.

Assignees

• Toyota Motor Co Ltd

Inventors

• Yanagimoto Hiroshi
• Hiraoka Motoki
• Sato Yuki
• Shinmei Yoshitaka

Classifications

• C25D3/00 Primary

  Electroplating: Baths therefor · CPC title

• C25D17/14

  for pad-plating · CPC title

• C25D17/001

  Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells · CPC title

• C25D5/02 Primary

  Electroplating of selected surface areas · CPC title

• C25D5/18 Primary

  Electroplating using modulated, pulsed or reversing current · CPC title