Surface integrated waveguides and circuit structures therefor

Patent metadata

Field	Value
Publication number	US-10299368-B2
Application number	US-201615387278-A
Country	US
Kind code	B2
Filing date	Dec 21, 2016
Priority date	Dec 21, 2016
Publication date	May 21, 2019
Grant date	May 21, 2019

Abstract

Apparatus, and corresponding method, relates generally to a microelectronic device. In such an apparatus, a first conductive layer is for providing a lower interior surface of a circuit structure. A plurality of wire bond wires are interconnected to the lower interior surface and spaced apart from one another for providing at least one side of the circuit structure. A second conductive layer is for providing an upper interior surface of the circuit structure spaced apart from the lower interior surface by and interconnected to the plurality of wire bond wires. The plurality of wire bond wires, the first conductive layer and the second conductive layer in combination define at least one opening in the at least one side for a signal port of the circuit structure. Such circuit structure may be a signal guide circuit structure, such as for a signal waveguide or signal cavity for example.

First claim

What is claimed is:

1. An apparatus for a microelectronic device, comprising:
a first conductive layer for providing a lower interior surface of a circuit structure;
a plurality of wire bond wires interconnected to the lower interior surface of the first conductive layer with wire bonds and spaced apart from one another for providing at least one side of the circuit structure;
a second conductive layer for providing an upper interior surface of the circuit structure spaced apart from the lower interior surface by and interconnected to the plurality of wire bond wires; and
the plurality of wire bond wires, the first conductive layer and the second conductive layer in combination defining at least one opening in the at least one side for a signal port of the circuit structure.

2. The apparatus according to claim 1 , wherein the at least one opening is for electromagnetic signals with wavelengths in a range of approximately 0.5 to 1.5 mm for suppressing at least one of crosstalk, electromagnetic interference or electromagnetic radiation with wavelengths longer than 1.5 mm.

3. The apparatus according to claim 1 , wherein the at least one opening is for electromagnetic signals with wavelengths in a range of approximately 0.5 to 3.0 mm for suppressing at least one of crosstalk, electromagnetic interference or electromagnetic radiation with wavelengths longer than 3.0 mm.

4. The apparatus according to claim 1 , wherein the at least one opening is for electromagnetic signals with wavelengths in a range of approximately 3.0 to 15 mm for suppressing at least one of crosstalk, electromagnetic interference or electromagnetic radiation with wavelengths longer than 15 mm.

5. The apparatus according to claim 1 , wherein the lower conductive layer is formed on or as part of an upper surface of a substrate.

6. The apparatus according to claim 5 , wherein the circuit structure is for a cavity.

7. The apparatus according to claim 5 , wherein the circuit structure is for a waveguide.

8. The apparatus according to claim 7 , wherein the waveguide is for electromagnetic signals with wavelengths in a range of approximately 0.5 to 1.5 mm.

9. The apparatus according to claim 7 , wherein the waveguide is for electromagnetic signals with wavelengths in a range of approximately 0.5 to 3.0 mm.

10. The apparatus according to claim 7 , wherein the waveguide is for electromagnetic signals with wavelengths in a range of approximately 3 to 15 mm.

11. The apparatus according to claim 7 , wherein:
the signal port is a first signal port;
the plurality of wire bond wires comprises a first set and a second set of the plurality of wire bond wires interconnected to the lower conductive layer and the upper conductive layer for providing a first side and a second side, respectively, opposite one another for the at least one side of the circuit structure; and
the first set, the second set, the first conductive layer, and the second conductive layer in combination defining a first opening and a second opening for the at least one opening in the at least one side for the first signal port and a second signal port, respectively, of the circuit structure.

12. The apparatus according to claim 11 , wherein the plurality of wire bond wires are spaced apart from one another by less than 1/10 th of a signal wavelength for use of the circuit structure with wavelengths less than approximately 1.5 mm.

Assignees

• Invensas Corp

Inventors

• Huang Shaowu
• Delacruz Javier A

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H01P5/19

  of the junction type · CPC title

• H05K1/0228 Primary

  Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors (balanced signal pairs H05K1/0245) · CPC title

• H01P11/002

  Manufacturing hollow waveguides · CPC title

• H01P7/065

  integrated in a substrate · CPC title