Chip packaging method, chip packaging module, and embedded substrate chip packaging structure
US-2024413138-A1 · Dec 12, 2024 · US
Via density and placement in radio frequency shielding applications
US8948712B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8948712-B2 |
| Application number | US-201213485572-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 31, 2012 |
| Priority date | May 31, 2012 |
| Publication date | Feb 3, 2015 |
| Grant date | Feb 3, 2015 |
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Abstract
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Aspects of the present disclosure relate to determining the location and/or density of vias that form part of an RF isolation structure of a packaged module and the resulting RF isolation structures. From electromagnetic interference (EMI) data, locations of where via density can be increased and/or decreased without significantly degrading the EMI performance of the RF isolation structure can be identified. In certain embodiments, one or more vias can be added and/or removed from a selected area of the packaged module based on the EMI data.
First claim
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What is claimed is: 1. A packaged module comprising: a substrate configured to receive at least one component; a radio frequency (RF) component coupled to a major surface of the substrate; a ground contact disposed below the RF component, the ground contact configured to receive a ground potential from external to the packaged module; a plurality of vias in the substrate, the plurality of vias disposed around the RF component, the plurality of vias having a higher density in…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8948712B2 cover?
- Aspects of the present disclosure relate to determining the location and/or density of vias that form part of an RF isolation structure of a packaged module and the resulting RF isolation structures. From electromagnetic interference (EMI) data, locations of where via density can be increased and/or decreased without significantly degrading the EMI performance of the RF isolation structure can …
- Who is the assignee on this patent?
- Chen Howard E, Read Matthew Sean, Nguyen Hoang Mong, and 4 more
- What technology area does this patent fall under?
- Primary CPC classification H10W42/20. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Feb 03 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).