Growth of metal on a dielectric

Patent metadata

Field	Value
Publication number	US-10294561-B2
Application number	US-201815911950-A
Country	US
Kind code	B2
Filing date	Mar 5, 2018
Priority date	Dec 3, 2015
Publication date	May 21, 2019
Grant date	May 21, 2019

Abstract

A method for forming metal on a dielectric includes forming a seed layer on a surface including a reactant element. A first metal layer is formed on the seed layer wherein the first metal layer wets the seed layer. A second metal layer is formed on the first metal layer wherein the second metal layer wets the first metal layer. Diffuse the reactant element of the seed layer into the first metal layer by annealing to convert the first metal layer to a dielectric layer.

First claim

The invention claimed is:

1. A method comprising:
forming a first metal layer on a seed layer, wherein the first metal layer wets the seed layer; and
annealing to diffuse a reactant element of the seed layer into the first metal layer to convert the first metal layer to a dielectric layer.

2. The method as recited in claim 1 , further comprising forming the seed layer on a surface.

3. The method as recited in claim 1 , wherein the reactant ent has a greater affinity for the first metal layer than the seed layer.

4. The method as recited in claim 1 , wherein the seed layer includes a metal oxide and the reactant element includes oxygen.

5. The method as recited in claim 1 , wherein the seed layer includes a metal nitride and the reactant element includes nitrogen.

6. The method as recited in claim 1 , wherein the first metal layer includes Mg and the dielectric layer includes MgO.

7. The method as recited in claim 1 , further comprising forming a second metal layer on the first metal layer, wherein the second metal layer wets the first metal layer.

8. The method as recited in claim 7 , further comprising forming a cap on the second metal layer.

9. The method as recited in claim 7 , wherein the second metal layer includes FeCo or an alloy thereof.

10. A method comprising:
forming a second metal layer on a first metal layer, wherein the second metal layer wets the first metal layer;
reacting the second metal layer with a reactant element; and
annealing to diffuse the reactant element of the second metal layer into at least the first metal layer to convert the first metal layer to a first dielectric layer.

11. The method as recited in claim 10 , further comprising forming the first metal layer on a seed layer, wherein the first metal layer wets the seed layer.

12. The method as recited in claim 11 , further comprising forming the seed layer on a surface.

13. The method as recited in claim 10 , wherein the reactant element includes one of oxygen or nitrogen.

14. The method as recited in claim 10 , wherein the first metal layer includes Mg and the dielectric layer includes MgO.

15. The method as recited in claim 10 , wherein the reactant element has a greater affinity for the first metal layer than the second metal layer.

16. The method as recited in claim 10 , wherein the second metal layer includes FeCo or an alloy thereof.

17. The method as recited in claim 10 , further comprising forming a dielectric layer on the second metal layer.

18. The method as recited in claim 10 , further comprising forming a cap on the second metal layer.

19. The method as recited in claim 10 , further comprising forming a third metal layer on the second metal layer, wherein the annealing further diffuses the reactant element of the second metal layer is into the third metal layer to convert the third metal layer to a second dielectric layer.

20. The method as recited in claim 19 , wherein the third metal layer includes Mg and the third dielectric layer includes MgO.

Assignees

• IBM

Inventors

• Hu Guohan
• Worledge Daniel C

Classifications

• C23C18/1689

  After-treatment · CPC title

• C23C14/14

  Metallic material, boron or silicon · CPC title

• C23C18/50

  with alloys based on iron, cobalt or nickel · CPC title

• C23C16/06 Primary

  characterised by the deposition of metallic material · CPC title

• C23C18/31

  Coating with metals · CPC title