Substrate treatment apparatus and substrate treatment method

Patent metadata

Field	Value
Publication number	US-10290491-B2
Application number	US-201715670349-A
Country	US
Kind code	B2
Filing date	Aug 7, 2017
Priority date	Apr 1, 2015
Publication date	May 14, 2019
Grant date	May 14, 2019

Abstract

In one embodiment, a substrate treatment apparatus includes a housing configured to house a substrate. The apparatus further includes a chemical supplying module configured to supply one or more chemicals in a gas state to the substrate in the housing, the one or more chemicals including a first chemical that contains a silylation agent. The apparatus further includes a cooling module configured to cool the substrate in the housing while any of the one or more chemicals is supplied to the substrate in the housing.

First claim

The invention claimed is:

1. A substrate treatment apparatus comprising:
a housing configured to house a plurality of substrates;
a chemical supplying module configured to simultaneously supply one or more chemicals in a gas state to the plurality of substrates in the housing, the one or more chemicals including a first chemical that contains a silylation agent;
a cooling module configured to simultaneously cool the plurality of substrates in the housing; and
a controller configured to control the chemical supplying module and the cooling module to simultaneously cool the plurality of substrates in the housing by the cooling module while any of the one or more chemicals is simultaneously supplied from the chemical supplying module to the plurality of substrates in the housing.

2. The apparatus of claim 1 , wherein the one or more chemicals further include a second chemical that contains alcohol.

3. The apparatus of claim 1 , wherein the controller controls the cooling module to simultaneously cool the plurality of substrates such that a temperature of the plurality of substrates is lower than a boiling point of the one or more chemicals.

4. The apparatus of claim 1 , wherein
the one or more chemicals include a chemical having a first boiling point and a chemical having a second boiling point lower than the first boiling point, and the controller controls the chemical supplying module to simultaneously supply the chemical having the first boiling point to the plurality of substrates after simultaneously supplying the chemical having the second boiling point to the plurality of substrates.

5. The apparatus of claim 4 , wherein the controller controls the chemical supplying module to simultaneously supply the chemical having the second boiling point to the plurality of substrates again after simultaneously supplying the chemical having the first boiling point to the plurality of substrates.

6. The apparatus of claim 1 , wherein the cooling module simultaneously cools the plurality of substrates by simultaneously supplying a gas or a liquid to cool the plurality of substrates.

7. The apparatus of claim 1 , wherein the cooling module simultaneously cools the plurality of substrates with at least a Peltier device disposed near the plurality of substrates.

8. The apparatus of claim 1 , wherein the controller controls the chemical supplying module and the cooling module such that the cooling module simultaneously cools the plurality of substrates in the whole period in which the first chemical is simultaneously supplied from the chemical supplying module to the plurality of substrates.

9. The apparatus of claim 1 , wherein the controller controls the chemical supplying module and the cooling module such that the cooling module simultaneously cools the plurality of substrates in one or more parts of a period in which the first chemical is simultaneously supplied from the chemical supplying module to the plurality of substrates.

Assignees

• Toshiba Memory Corp

Inventors

• Kimura Shinsuke
• Koide Tatsuhiko
• Ogawa Yoshihiro

Classifications

• H10P72/0434

  mainly by convection · CPC title

• H10P72/0406

  for cleaning followed by drying, rinsing, stripping, blasting or the like · CPC title

• H10P50/642

  Chemical etching · CPC title

• H10P70/20 Primary

  Cleaning during device manufacture · CPC title

• H01L21/67109

  Electricity · mapped topic