Systems and methods for achieving a pre-determined factor associated with an edge region within a plasma chamber by synchronizing main and edge RF generators

Patent metadata

Field	Value
Publication number	US-10283330-B2
Application number	US-201715636519-A
Country	US
Kind code	B2
Filing date	Jun 28, 2017
Priority date	Jul 25, 2016
Publication date	May 7, 2019
Grant date	May 7, 2019

Abstract

Systems and methods for achieving a pre-determined factor associated with the edge region within the plasma chamber is described. One of the methods includes providing an RF signal to a main electrode within the plasma chamber. The RF signal is generated based on a frequency of operation of a first RF generator. The method further includes providing another RF signal to an edge electrode within the plasma chamber. The other RF signal is generated based on the frequency of operation of the first RF generator. The method includes receiving a first measurement of a variable, receiving a second measurement of the variable, and modifying a phase of the other RF signal based on the first measurement and the second measurement. The method includes changing a magnitude of a variable associated with a second RF generator to achieve the pre-determined factor.

First claim

The invention claimed is:

1. A method for achieving a pre-determined factor associated with an edge region within a plasma chamber, comprising:
providing a radio frequency (RF) signal via a first impedance matching circuit to a main electrode within the plasma chamber, wherein the RF signal is generated based on a frequency of operation of a first RF generator;
providing another RF signal via a second impedance matching circuit to an edge electrode within the plasma chamber, wherein the other RF signal is generated based on the frequency of operation of the first RF generator;
receiving a first measurement of a variable associated with an output of the first impedance matching circuit;
receiving a second measurement of the variable associated with an output of the second impedance matching circuit;
modifying a phase of the other RF signal based on the first measurement and the second measurement; and
changing a magnitude of a variable associated with a second RF generator to achieve the pre-determined factor,
wherein the main electrode is configured to support a substrate to process the substrate at a center region within the plasma chamber and the edge electrode is configured to process the substrate at the edge region.

2. The method of claim 1 , wherein changing the magnitude is performed after the other RF signal is generated and after the phase of the other RF signal is modified.

3. The method of claim 1 , wherein modifying the phase of the other RF signal is performed to achieve a phase to be within a pre-set range from a phase of the first measurement.

4. The method of claim 1 , wherein the variable associated with the second RF generator is different from the variable associated with the outputs of the first and second impedance matching circuits.

5. The method of claim 1 , wherein the first measurement is measured at the output of the first impedance matching circuit, wherein the second measurement is measured at the output of the second impedance matching circuit.

6. The method of claim 1 , wherein the main electrode is a chuck, and the edge electrode is an edge ring or a coupling ring.

7. The method of claim 1 , wherein the second RF generator is controlled to have a frequency of operation that is within a pre-determined range from the frequency of operation of the first RF generator.

8. A method for achieving a pre-determined factor associated with an edge region within a plasma chamber, comprising:
providing a radio frequency (RF) signal via a first impedance matching circuit to a main electrode within the plasma chamber, wherein the RF signal is generated based on a frequency of operation of a first RF generator;
providing another RF signal via a second impedance matching circuit to an edge electrode within the plasma chamber, wherein the other RF signal is generated based on the frequency of operation of the first RF generator, wherein the main electrode is a chuck, and the edge electrode is a coupling ring;
receiving a first measurement of a variable associated with an output of the first impedance matching circuit;
receiving a second measurement of the variable associated with an output of the second impedance matching circuit;
modifying a phase of the other RF signal based on the first measurement and the second measurement; and
changing a magnitude of a variable associated with a second RF generator to achieve the pre-determined factor.

9. The method of claim 8 , wherein changing the magnitude is performed after the other RF signal is generated and after the phase of the other RF signal is modified.

10. The method of claim 8 , wherein modifying the phase of the other RF signal is performed to achieve a phase to be within a pre-set range from a phase of the first measurement.

11. The method of claim 8 , wherein the variable associated with the second RF generator is different from the variable associated with the outputs of the first and second impedance matching circuits.

12. The method of claim 8 , wherein the first measurement is measured at the output of the first impedance matching circuit, wherein the second measurement is measured at the output of the second impedance matching circuit.

13. The method of claim 8 , wherein the second RF generator is controlled to have a frequency of operation that is within a pre-determined range from the frequency of operation of the first RF generator.

14. A method for achieving a pre-determined factor associated with an edge region within a plasma chamber, comprising:
providing a radio frequency (RF) signal via a first impedance matching circuit to a main electrode within the plasma chamber, wherein the RF signal is generated based on a frequency of operation of a first RF generator;
providing another RF signal via a second impedance matching circuit to an edge electrode within the plasma chamber, wherein the other RF signal is generated based on the frequency of operation of the first RF generator, wherein the main electrode is a chuck, and the edge electrode is an edge ring;
receiving a first measurement of a variable associated with an output of the first impedance matching circuit;
receiving a second measurement of the variable associated with an output of the second impedance matching circuit;
modifying a phase of the other RF signal based on the first measurement and the second measurement; and
changing a magnitude of a variable associated with a second RF generator to achieve the pre-determined factor.

15. The method of claim 14 , wherein changing the magnitude is performed after the other RF signal is generated and after the phase of the other RF signal is modified.

16. The method of claim 14 , wherein modifying the phase of the other RF signal is performed to achieve a phase to be within a pre-set range from a phase of the first measurement.

17. The method of claim 14 , wherein the variable associated with the second RF generator is different from the variable associated with the outputs of the first and second impedance matching circuits.

18. The method of claim 14 , wherein the first measurement is measured at the output of the first impedance matching circuit, wherein the second measurement is measured at the output of the second impedance matching circuit.

19. The method of claim 14 , wherein the second RF generator is controlled to have a frequency of operation that is within a pre-determined range from the frequency of operation of the first RF generator.

Assignees

• Lam Res Corp

Inventors

• Marakhtanov Alexei
• Kozakevich Felix
• Kellogg Michael C
• Holland John Patrick
• Chen Zhigang
• Lucchesi Kenneth
• Zhao Lin

Classifications

• H10P72/7611

  characterised by edge profile or support profile · CPC title

• H10P72/0421

  for drying etching · CPC title

• H10P50/242

  of Group IV materials · CPC title

• H01J37/32155

  Frequency modulation · CPC title

• H01J37/32642

  Focus rings · CPC title