Mounting component, wiring substrate, electronic device and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-10276515-B2
Application number	US-201815933539-A
Country	US
Kind code	B2
Filing date	Mar 23, 2018
Priority date	Sep 25, 2015
Publication date	Apr 30, 2019
Grant date	Apr 30, 2019

Abstract

Disclosed is a wiring substrate including: a first wiring layer, a second wiring layer disposed on the first wiring layer interposed by an insulating film, and a via conductor passing through the insulating film in a thickness direction, the via conductor electrically connecting the first wiring layer and the second wiring layer. The second wiring layer and the via conductor include a second sintered metal layer and a first sintered metal layer arranged to surround the second sintered metal layer, and an average particle diameter of first metal particles forming the first sintered metal layer is smaller than an average particle diameter of second metal particles forming the second sintered metal layer.

First claim

What is claimed is:

1. A wiring substrate comprising:
a first wiring layer,
a second wiring layer disposed on the first wiring layer interposed by an insulating film, and
a via conductor passing through the insulating film in a thickness direction, the via conductor electrically connecting the first wiring layer and the second wiring layer,
wherein the second wiring layer and the via conductor include a second sintered metal layer and a first sintered metal layer arranged to surround the second sintered metal layer, and
wherein an average particle diameter of first metal particles forming the first sintered metal layer is smaller than an average particle diameter of second metal particles forming the second sintered metal layer.

2. The wiring substrate according to claim 1 ,
wherein the second wiring layer and the via conductor further include a metal layer arranged to surround the first sintered metal layer.

3. The wiring substrate according to claim 1 ,
wherein the first sintered metal layer in the via conductor includes a first curved part forming a continuous corner part between a bottom part and a side wall part of the via conductor, and a curvature radius of the first curved part is ¼ or more of a height of the via conductor.

4. The wiring substrate according to claim 2 ,
wherein the first sintered metal layer in the via conductor includes a first curved part forming a continuous corner part between a bottom part and a side wall part, and a curvature radius of the first curved part is ¼ or more of a height of the via conductor.

5. The wiring substrate according to claim 1 ,
wherein the second wiring layer includes a wiring part and a land part, the land part is wider than the via conductor in a cross sectional view in a thickness direction, and the land part is electrically connected to the via conductor, and
wherein the first sintered metal layer in the land part includes a second curved part forming a continuous corner part between a bottom part and a side wall part of the land part, and a curvature radius of the second curved part is ¼ or more of a height of the land part.

6. The wiring substrate according to claim 2 ,
wherein the second wiring layer includes a wiring part and a land part, the land part is wider than the via conductor in a cross sectional view in a thickness direction, and the land part is electrically connected to the via conductor, and
wherein the first sintered metal layer in the land part includes a second curved part forming a continuous corner part between a bottom part and a side wall part of the land part, and a curvature radius of the second curved part is ¼ or more of a height of the land part.

7. The wiring substrate according to claim 3 ,
wherein the second wiring layer includes a wiring part and a land part, the land part is wider than the via conductor in a cross sectional view in a thickness direction, and the land part is electrically connected to the via conductor, and
wherein the first sintered metal layer in the land part includes a second curved part forming a continuous corner part between a bottom part and a side wall part of the land part, and a curvature radius of the second curved part is ¼ or more of a height of the land part.

8. The wiring substrate according to claim 4 ,
wherein the second wiring layer includes a wiring part and a land part, the land part is wider than the via conductor in a cross sectional view in a thickness direction, and the land part is electrically connected to the via conductor, and
wherein the first sintered metal layer in the land part includes a second curved part forming a continuous corner part between a bottom part and a side wall part of the land part, and a curvature radius of the second curved part is ¼ or more of a height of the land part.

Assignees

• Dainippon Printing Co Ltd

Inventors

• Kasai Ryohei
• Tsunoda Tsuyoshi
• Yamamoto Yuichi
• SAGARA Shuji
• Tanaka Masaya

Classifications

• H10W70/685

  comprising multiple insulating layers · CPC title

• H10W70/098

  Applying pastes or inks, e.g. screen printing (H10W70/095 takes precedence) · CPC title

• H10W70/66

  Conductive materials thereof · CPC title

• H10W70/65

  Shapes or dispositions of interconnections · CPC title

• H10W70/60

  Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title