Light emitting device, package, and methods of manufacturing the same
US-2017271565-A1 · Sep 21, 2017 · US
Lead frame
US10276478B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10276478-B2 |
| Application number | US-201815890675-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 7, 2018 |
| Priority date | Feb 17, 2017 |
| Publication date | Apr 30, 2019 |
| Grant date | Apr 30, 2019 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A lead frame includes an outer frame. The outer frame includes: an upper surface; a lower surface that is opposite to the upper surface; a side surface between the upper surface and the lower surface; a first recess that is formed to extend from the upper surface to the side surface; a second recess that is formed to extend from the lower surface to the side surface; and a curved surface that is positioned between the side surface and a side wall of the first recess or between the side surface and a side wall of the second recess.
First claim
Opening claim text (preview).
What is claimed is: 1. A lead frame comprising an outer frame, wherein the outer frame comprises: an upper surface; a lower surface that is opposite to the upper surface; a side surface between the upper surface and the lower surface; a first recess that is formed to extend from the upper surface to the side surface; a second recess that is formed to extend from the lower surface to the side surface; and a curved surface that is positioned between the side surface and a side wall of the first recess or between the side surface and a side wall of the second recess. 2. The lead frame according to claim 1 , wherein the curved surface comprises: a first curved surface that is positioned between the side wall of the first recess and the side surface; and a second curved surface that is positioned between the side wall of the second recess and the side surface. 3. The lead frame according to claim 1 , wherein the first recess comprises a plurality of first recesses, the second recess comprises a plurality of second recesses, the plurality of first recesses and the plurality of second recesses are disposed side by side at predetermined intervals; and each of the plurality of first recesses is disposed between adjacent ones of the plurality of second recesses in plan view. 4. The lead frame according to claim 3 , wherein a portion of an upper end of the side surface, which is positioned between adjacent ones of the plurality of first recesses, is formed into a linear shape, and a portion of a lower end of the side surface, which is positioned between adjacent ones of the plurality of second recesses, is formed into a linear shape. 5. The lead frame according to claim 1 , wherein the first recess and the second recess are formed in the side surface that is parallel with a long-side direction of the outer frame. 6. The lead frame according to claim 1 , wherein an inner surface of the first recess and an inner surface of the second recess are formed as concavely curved surfaces respectively.
Assignees
Inventors
Classifications
specially adapted for containing substrates other than wafers · CPC title
between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title
between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title
the encapsulations exposing the passive side of the semiconductor body · CPC title
forming a chip-scale package [CSP] · CPC title
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Frequently asked questions
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- What does patent US10276478B2 cover?
- A lead frame includes an outer frame. The outer frame includes: an upper surface; a lower surface that is opposite to the upper surface; a side surface between the upper surface and the lower surface; a first recess that is formed to extend from the upper surface to the side surface; a second recess that is formed to extend from the lower surface to the side surface; and a curved surface that i…
- Who is the assignee on this patent?
- Shinko Electric Ind Co
- What technology area does this patent fall under?
- Primary CPC classification H10W70/421. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Apr 30 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).